#9 | SPRING 2008 posted May 14, 2008

EDITORIAL

Why you should never say never

CALENDAR

A listing of key events for the advanced substrate community

PAPERLINKS

Revelant papers from recent conferences and journals

In and Around Our Industry

ON THE CIRCUIT

Wade Xiong of TI reviews the challenges facing embedded SRAM at 32nm and beyond.

PEOPLE

• Jean-Pierre Colinge has gathered industry experts for a new book on MuGFETs.

• Seminal SOI book from IBM reissued in paperback.

• 15 partners of European SilOnIS strained SOI program honored for excellence.

Jean-Pierren Colinge photo

Advanced Substrate Corners

III-V

Dr. Hervé Blanck of UMS (Thales/EADS) discusses GaN applications, and how engineered substrates may help.

IMAGING

Dr. P.K. Swain of Sarnoff explains the advantages of SOI for back-illuminated image sensors for the consumer camera market.

Special supplement: SOI Industry Consortium

SOI Consortium logo

• Executive Director Horacio Mendez describes current activities, what’s new, plus presentations & short courses now available on the website from members IBM and ST.

Market place

A special thanks goes to TSMC, CEA-LETI MINATEC,
UC Berkeley, OKI, TI, IBM, Tyndall, Eureka/Medea+, UMS, Picogiga, Sarnoff, SOI Consortium and Soitec for their help with this issue.