#8 | FALL 2007 posted October 31, 2007
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Tech Special: Photonics
EDITORIAL
SOI consortium launches a new era
CALENDAR
A listing of key events for the advanced substrate community
PAPERLINKS
Revelant papers from recent conferences and journals
Industry
This fall, nineteen of the world’s leading electronics companies got together to accelerate SOI innovation across a broad range of markets.
• Julio Costa of RFMD describes their work with Jazz on an SOI-based power amp solution for the next generation of cell phones.
• Bill Mercer of Freescale says that putting the new generation of PowerQUICC®III chips on SOI gives an edge to both the company’s designers and to their customers.
Christine Rayanud of CEA-LETI and STMicroelectronics reports on the promise of high-resistivity SOI for the wireless world.
Steve Longria of IBM explains how the company’s new CMOS 7RF SOI technology offers cost advantages to mobile handset designers.
• Smart Cut™ inventor Michel Bruel will receive the IEEE’s 2008 Cledo Brunetti award.
• SEMI gives Merit Award to George Celler.
• Bich-Yen Nguyen and Mohamad Shaheen join Soitec’s R&D team.
Vincent Liao of UMC says the new 65nm SOI PDK paves the way for improved speed and power in complex SOCs.
Robert Newcomb of Qcept describes non-optical inspection technology for tracking down non-visual residue (NVR) defects.
The EC has given the green light for funding of the €200 million NanoSmart project.
Dr. Mohamad Shaheen of Soitec examines the potential of SOI for memory applications.
The G²REC program is taking a GaN approach to Schottky diodes.
• Giacometti Fabrizio of Pirelli Labs describes how SOI is leveraged in a new generation of optical telecom components.
• Ansheng Liu of Intel explains why SOI is the ideal substrate for the company’s integrated approach to silicon photonics.
• Koichiro Kishima of Sony is taking a double - SOI waveguide approach.
• Yuri Vlasov of IBM describes the path to CMOS - photonics monolithic integration.