Via Technologies Extends Range of Ultra-Low Voltage x86 Processors
Fabless Via leverages IBM’s 90nm SOI process.
A leader in the fabless world, Via
Technologies has launched its new, fanless
90-nm SOI Via-Eden™ and Eden™ ULV
(Ultra Low Voltage) processors, specifically
targeted at business, industrial and commercial applications such as thin
clients, silent desktops, IPCs and set top
boxes where ultra cool, ultra quiet,
reliable performance is essential. The
chips are manufactured using IBM’s 90nm
SOI process.
SOI gets credit for enabling its chips to run
15% faster while using 20% less power, says
Via. The reduced die size also enables the
company to claim its status as the maker of
the world’s smallest x86 processor die
(30mm2), thereby enabling a new generation
of small form factor designs and new,
smaller applications for the x86 platform.
VIA says its Eden ULV processors set
new levels in low power consumption for
a fanless processor: the 1.5GHz version
draws a maximum of just 7.5 watts, while
the 1.0GHz part draws no more than 3.5
watts. The company says this makes them
the smallest, most powerful fanless x86
processors on the market.
Via has also announced the SOI-based
C7-M ULV processor for ultra compact,
ultra portable devices, which the company
says features "...the best performance-perwatt
operation in the industry."
