Tags

Here’s an alphabetical listing of all the tags used in ASN articles.

3D 3DI 5G 6T-SRAM cells 7nm 10nm 14nm 16nm 20/22nm 20nm 22FDX 22nm 28FDS 28nm 28nm 14nm 28nm 20nm 32nm 32nm SOI 45nm 45nm SOI 65nm 200mm 300mm 450mm A-BCD ABCD accelerometer Accelicon ADI Adidas Aerospace Agilent airbag AIST Alcatel Lucent Alliance Altatech Altera Altis AMAT AMD AmericanSemi AMO analog AnalogBits app Apple apps APU ARM ASIC Athlon Atmel automotive awards back-bias back-illuminated BCD body bias bonding books Boston BSI BSOS bulk Bulldozer C7 Cadence Cambridge Casio Cell Chartered China chinese ChipEstimate Ciena Circuit Layer transfer Cisco Cissoid Clare/IXYS clock oscillator CMOS-7HV CMP Columbia U communications conference conferences Consortium CoolCube Cortex cost cost reduction CPU CPU/GPU CSEM CU-32 DARPA Debiotech defect Denso design design clinic device performance diabetes display DRAM drivers DSP e2V ecomomics economics ECUs EDA eDRAM EEMI 450 electrochem embedded end-user app end-user apps ePIXfab equipment Ericsson Ericsson and UCL ESD eSI eSI90 eSOI ETMemory ETSOI EV Group EZ-HV Fab Fab 8 fabless FBB FBC FD-SOI FDSOI FDX FEM Fin-on-Oxide FinFET flexible forecast Foster City foundries foundry FOx FPGA Fraunhofer Freescale Frontiers in optics Fully Depleted Fusion GAA GaAs gadest GaN Gefran GeOI GF Glob GlobalFoundries gpu Grace Grace Semi GraceSemi green GreenChip Grenoble GSS GT half-bridge power ICs hi-perf hi-temp high-perf high-performance high-power high-resistivity high-temp high-temperature high-voltage highperf high yield production Hitachi Honeywell HP HPC HR-SOI HVPE IBM IBS IC IEDM IEEE IGBT III-V image sensors Imaging IMEC IMECAS IMEP IMS2009 in-vehicle networking Incize industrial Infineon INFOS inspection Intel IoT IP Isi ISSCC Japan Jazz Jeopardy Kek KLA-Tencor Kopin Kulite Lapis LEAP led Leti lighting Llano low-power low-voltage Luxtera M3D Magma Magna MagnaChip manufacturer manufacturing markets Marketsandmarkets MediaTek medical MEMC memory MEMS Mentor metrology miCoach Micragem Micron Microsemi Microsoft mil/aero military Minalogic Minatec MIT mixed-signal Miyagi mobile modeling modelling MonolithIC3D Moore MOSIS MOSIS service Motorola MuGFET Murata MWC11 Nanosens nanotubes nanowire nanowires National NEMS networking Nintendo NIST Novati NTT Numonyx Nvidia NXP Oki OnSemi Open-Silicon Opteron ower Panasonic Paul Scherrer Institute PD-SOI PDK People Peregrine performance PFC Phenom Photonics photovoltaic PLATON Plessey power Power7 power amp power consumption powerQUICC PPA prototype Prototyping ps3 Psemi publication Pulsar Purdue Qcept QorIQ Qorvo Qualcomm R&D Rambus RDA RDA Micro Rectifier STM reliability Renesas reports research rf RFeSI90 RFID RFMD RFSOI RF SOI roadmap S3S Samsung Sandia sapphire Sarnoff SEH Seiko Sematech Semico Semicon SemiWiki sensor sensors SiC SigmaDesigns Silex silicon-on-insulator silicon-on-insulator Good silicon-on-sapphire Simgui SIMIT SiTime SITRI SKI Skyworks SMART-I.S. Smart Cut SmartCut smartphone smart power Smart Stacking SMIC SNWT SOC software SOI SOI-based devices SOI-FinFET SOI-MEMS SOI Consortium SOI Consortium FD-SOI Soitec solar solid-state device Sony SOS SOTB Spansion SPICE SRAM SSDOI sSOI ST ST-Ericsson Stanford STM STMicroelectronics strain strategic expansions substrate substrates subthreshold sub Vt Sumitomo Sumitomo SEI SunEdison supercomputer supply sureCore surfscan Synapse Synapse Design Synopsys system-on-chips Tags: FD-SOI Tags: RF-SOI telecom Telefunken Thales Thershhold voltage variability TI Tokyo Tech Tokyo U Toshiba TowerJazz Toyota training trap-rich trigate Tronics TSMC TSV tv Tyndall U.Dresden U. Glasgow U.Tokyo U.Udine UC Berkeley UCBerkeley UCL UCLA UCL Intel UC Louvain Ulm ULP ultra-low-power UMC ums USC UT-SOI UTB UTBB UTBOX UT Box UTokyo VeriSilicon VIA Viena VLSI VLSIResearch VT VTH VTI VTT wafer wafers Watson WaveSemi Wave Semi Wave SOI wearables wifi Wii wireless workshop X-FAB x-ray Xbox Xilinx XMC yield Yole Z-RAM Zarlink