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Archive of wafers

Tronics Manufactures the First Piezoresistive Nanowire 6DOF Inertial MEMS (SOI) Thumbnail

Tronics Manufactures the First Piezoresistive Nanowire 6DOF Inertial MEMS (SOI)

Posted on April 9, 2014
In Industry Buzz
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       A year after announcing the industrialization of CEA-Leti’s breakthrough M&NEMS technologies, Tronics has successfully designed and manufactured the first batch of six-degrees-of-freedom (6DOF) MEMS chips, with 3 accelerometers and 3 gyroscopes on a single die (press release here). Built on SOI wafers, with a die size of less than 4mm2, this 6DOF MEMS […]

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Presentation on Substrates for SOI-FinFETs and FD-SOI by SEH, World Wafer Leader, Posted on weSRCH Thumbnail

Presentation on Substrates for SOI-FinFETs and FD-SOI by SEH, World Wafer Leader, Posted on weSRCH

Posted on March 26, 2014
In Industry Buzz
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(Courtesy: SEH, weSRCH)   A presentation by Shin‐Etsu Handotai (SEH, the world’s largest wafer supplier) detailing the company’s line-up of wafers for FD-SOI and SOI-FinFET is now available on weSRCH (click here to access it). SEH, a $12.7 billion company supplying over 20% of the world’s bulk silicon wafers, has been making SOI wafers since […]

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Eveon and Leti Leverage SOI in Milestone: Fabrication Of Smart Bolus-type Micro-pump for Drug Delivery Thumbnail

Eveon and Leti Leverage SOI in Milestone: Fabrication Of Smart Bolus-type Micro-pump for Drug Delivery

Posted on March 26, 2014
In Industry Buzz
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(Courtesy: CEA-Leti)   Eveon and CEA-Leti have demonstrated liquid-pumping for smart drug delivery in the bolus mode using a silicon-based micro-pump fabricated with a standard MEMS process. (Read full press release here.) The milestone is the first functional micro-pump integration using MEMS standard process on Leti’s 200mm line. It is a result of FluMin3, Eveon […]

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FD-SOI: Back to Basics for Best Cost, Energy Efficiency and Performance Thumbnail

FD-SOI: Back to Basics for Best Cost, Energy Efficiency and Performance

Posted by and on March 26, 2014
In Design & Manufacturing, News & Viewpoints
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By Bich-Yen Nguyen and Christophe Maleville (Soitec) We are in the era of mobile computing with smart handheld devices and remote data storage “in the cloud,” with devices that are almost always on and driven by needs of high data transmission rate, instant access/connection and long battery life.  With all the ambitious requirements for better […]

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Soitec Semicon Japan Presentation on Substrates for Mobile Era Now On weSRCH Thumbnail

Soitec Semicon Japan Presentation on Substrates for Mobile Era Now On weSRCH

Posted on March 19, 2014
In Industry Buzz
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  (Image courtesy: SEMI, Soitec, weSRCH) An excellent Soitec presentation from Semicon Japan entitled Innovative Substrates in the Mobile Era is now available on weSRCH (click here to view it). Given by Soitec COO Paul Boudre, it details the role of SOI wafers in RF and FD-SOI for mobile.

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Semicon Europa 2014 Comes to Grenoble, Issues Call for Papers Thumbnail

Semicon Europa 2014 Comes to Grenoble, Issues Call for Papers

Posted on March 19, 2014
In Industry Buzz
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For the first time, SEMICON Europa will be held in Grenoble, France. The greater Grenoble region is home to industry leaders leveraging and researching SOI and related advanced substrates, including Soitec, Leti and  ST. SEMI has now announced the “Call for Papers” for technical sessions and presentations for SEMICON Europa 2014, which takes place October […]

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FD-SOI Opportunities in China Thumbnail

FD-SOI Opportunities in China

Posted by on February 5, 2014
In Design & Manufacturing, News & Viewpoints, Professor's Perspective
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Authors: Zhongli Liu, Kai Zhao, Jiajun Luo, Fang Yu, Tianchun Ye (IMECAS) The Chinese IC industry is facing a real opportunity, and Chinese IC developers are looking for points of entry to best leverage this important moment. The CTO of a large Chinese IC supplier is looking for system solutions for their SOC chips, in […]

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CMP delivers multi-project wafer runs of 28nm FD-SOI with impressive device performance Thumbnail

CMP delivers multi-project wafer runs of 28nm FD-SOI with impressive device performance

Posted on January 31, 2014
In Industry Buzz
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CMP recently delivered the first 28nm FD-SOI/10LM multi-project wafer run, Kholdoun Torki, Technical Director at CMP has indicated. “We received positive feedback on the test results with quite impressive device performance,” he said. The PDK is from ST, making this a success for both STMicroelectronics and CMP. 
In 2013, they had 32 prototypes from 15 customers over […]

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Interview: Leti CEO Laurent Malier on FD-SOI and more Thumbnail

Interview: Leti CEO Laurent Malier on FD-SOI and more

Posted on January 23, 2014
In News & Viewpoints, SOI In Action
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CEA-Leti is one of the world’s most important research institutes for micro- and nano-electronics. Key enabler to the greater SOI-based community, they’re the quiet mega-partner behind everything from Soitec’s Smart CutTM technology for SOI wafer manufacturing to the design and chip manufacturing technology in today’s FD-SOI revolution. Leti’s work always reaches far into our industry’s […]

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MonolithIC3D CEO Says SOI’s the Future Technology of Semiconductors Thumbnail

MonolithIC3D CEO Says SOI’s the Future Technology of Semiconductors

Posted on January 13, 2014
In Industry Buzz
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Following IEDM (Dec. ’13), Zvi Or-Bach, President & CEO of posted a SemiMD blog (click here) entitled Why SOI is the Future Technology of Semiconductors.  Beginning with the assertions that it’s cheaper and easier for FinFETS, it’s a natural for monolithic 3D ICs, and it best for next-gen transistor architectures, he goes on to elaborate […]

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