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FD-SOI/Shanghai Forum – Panel Sees Great Things Coming Thumbnail

FD-SOI/Shanghai Forum – Panel Sees Great Things Coming

Posted by on October 26, 2016
In Conferences, Editor's Blog
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The panel discussion rounding out the day at the recent FD-SOI Forum in Shanghai ended an exciting week (GF’s 12nm FD-SOI & ecosys, Sony’s FD-SOI GPS in the Huami watch) on a decidedly optimistic note. Here’s a quick rundown of some of what was said. (As soon as the presentations given earlier in the day […]

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12nm FD-SOI on the Roadmap for H1/2019 Customer Tape-out! Says GloFo (While Giving 22FDX Ecosys a Great Boost) Thumbnail

12nm FD-SOI on the Roadmap for H1/2019 Customer Tape-out! Says GloFo (While Giving 22FDX Ecosys a Great Boost)

Posted by on September 15, 2016
In Design & Manufacturing, Editor's Blog
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12nm FD-SOI has now officially joined the GlobalFoundries’ roadmap, targeting intelligent, connected systems and beating 14/16nm FinFET on performance, power consumption (by 50%!) and cost (see press release here). Customer product tape-outs are expected to begin in the first half of 2019. GloFo also announced FDXcelerator™, an ecosystem designed to give 22FDX™ SoC design a […]

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Impressive! Soitec FD-SOI Press Conference in China = >150 Articles Thumbnail

Impressive! Soitec FD-SOI Press Conference in China = >150 Articles

Posted by on May 11, 2016
In Editor's Blog
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FD-SOI makes sense for China. That was the key message SOI wafer leader Soitec made in a press conference on FD-SOI for a select group of journalists just before Semicon China this spring. News then quickly spread, and resulted in over 150 FD-SOI articles in the top China technology and business press. Soitec also put […]

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RF-SOI – Foundries Weigh In On New 300mm Wafers for 4G/LTE-A, 5G and IoT. Plus a Look at the Innovation Pipeline – Part 2 of 2 Thumbnail

RF-SOI – Foundries Weigh In On New 300mm Wafers for 4G/LTE-A, 5G and IoT. Plus a Look at the Innovation Pipeline – Part 2 of 2

Posted by on March 23, 2016
In Design & Manufacturing, Editor's Blog
Tagged with , , , , , , , , , , , , , ,

As you may have read in the first part of this series, Soitec (the industry’s leading supplier of SOI wafers) says its 200mm RF-SOI wafers have been used to produce over 20 billion chips, and the company is now in high-volume manufacturing of a 300mm version of its wildly successful RFeSI line (see press release […]

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Now also on 300mm wafers and headed for 5G and IoT, RF-SOI’s going strong and stronger (>20 billion chips to date) – Part 1 of 2 Thumbnail

Now also on 300mm wafers and headed for 5G and IoT, RF-SOI’s going strong and stronger (>20 billion chips to date) – Part 1 of 2

Posted by on March 18, 2016
In Design & Manufacturing, Editor's Blog
Tagged with , , , , , , , , , , , , ,

Soitec, the industry’s leading supplier of SOI wafers recently announced it’s in high-volume manufacturing of a 300mm version of its wildly successful RFeSI line (see press release here). What’s it all about? FEMs. RF front-end module – aka FEM – chips handle the back-and-forth of signals between the transceiver and the antenna. FEMs built on […]

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China Design Conference (April 2016) Adds RF-SOI Design Track Thumbnail

China Design Conference (April 2016) Adds RF-SOI Design Track

Posted on March 18, 2016
In Industry Buzz
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EDI CON China 2016, taking place April 19-21 in Beijing at the China National Convention Center (CNCC) will feature a keynote talk by GlobalFoundries‘ Peter Rabbeni, Sr. Director, RF BU Business Development & Product Marketing. The talk, entitled, “RF SOI: Revolutionizing Radio Design Today and Driving Innovation for Tomorrow”, will kick off the newly added RF-SOI […]

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RF-SOI Innovator JP Raskin (his team’s work is in your smartphone) Awarded Blondel Medal Thumbnail

RF-SOI Innovator JP Raskin (his team’s work is in your smartphone) Awarded Blondel Medal

Posted on February 8, 2016
In Industry Buzz
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RF-SOI substrate guru Jean-Pierre Raskin, whose team at UCL* has driven the technology behind the most advanced wafer substrates for RF applications, has been awarded one of the highest honors in electronics: the prestigious Blondel Medal. The technology he pioneered is now in virtually all the world’s smartphones, and used by just about every RF […]

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Great FD-SOI start for 2016: Samsung, GF, Renesas, NXP/Freescale, ST, Soitec Thumbnail

Great FD-SOI start for 2016: Samsung, GF, Renesas, NXP/Freescale, ST, Soitec

Posted by on February 3, 2016
In Design & Manufacturing, Editor's Blog
Tagged with , , , , , , , , , , , , , , ,

Just a month into 2016 and we already have a raft of FD-SOI news from Samsung, GlobalFoundries, NXP/Freescale, Renesas and more. And of course RF-SOI continues ever stronger. Here’s a quick update of what we’ve been seeing, starting with news from the recent SOI Consortium forum in Tokyo. Many of the presentations are now available on […]

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VLSI Research names Soitec CEO to 2015 All Stars of the Semiconductor Industry Thumbnail

VLSI Research names Soitec CEO to 2015 All Stars of the Semiconductor Industry

Posted on December 19, 2015
In Industry Buzz
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VLSI Research Chip Insider has named Soitec CEO Paul Boudre to its roster of 2015 All Stars of the Semiconductor Industry. (See the announcement here.) Boudre was cited for “…successfully re-organizing Soitec back to its core business as a leading innovative engineered substrate supplier. His first year results are already astounding, with very high growth […]

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Interview (part 2 of 2): Leti Is a Catalyst for the FD-SOI Ecosystem. CEO Marie Semeria Explains Where They’re Headed Thumbnail

Interview (part 2 of 2): Leti Is a Catalyst for the FD-SOI Ecosystem. CEO Marie Semeria Explains Where They’re Headed

Posted by on December 17, 2015
In Design & Manufacturing, News & Viewpoints, R&D/Labnews
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From wafers to apps, Leti has been the moving force behind all things SOI for over 30 years. Now they’re the powerhouse behind the FD-SOI phenomenon. CEO Marie-Noelle Semeria shares her insights here in part 2 of this exclusive ASN interview as to what Leti’s doing to drive the ecosystem forward. (In part 1, she […]

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