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Archive of wafers

Top Silicon Valley Companies Signed Up for FD-SOI & RF-SOI Forum (27 Feb. 2015 in SF, free, registration still open) Thumbnail

Top Silicon Valley Companies Signed Up for FD-SOI & RF-SOI Forum (27 Feb. 2015 in SF, free, registration still open)

Posted by on February 23, 2015
In Conferences, Editor's Blog
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Name a top Silicon Valley company, and you’ll probably find it on the attendance list of the upcoming FD-SOI & RF-SOI Forum in San Francisco. At the time of this posting, people from over 65 companies are among the hundreds who’ve signed up for this free, all-day event. If you haven’t yet, you can still […]

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How SOI wafers for RF predict LTE-A/5G device performance Thumbnail

How SOI wafers for RF predict LTE-A/5G device performance

Posted by and on February 17, 2015
In Design & Manufacturing, SOI In Action
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Soitec has developed an innovative metrology and metric for ensuring that devices built on our latest SOI wafers for RF will meet the draconian demands of LTE-Advanced (LTE-A) and 5G network standards. For smartphones and tablets to handle LTE-A and 5G, they need RF devices with much higher linearity than those running over the current […]

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LTE-A/5G: Bring it on.  Next-gen Soitec eSI90 wafers predict & improve RF performance. Thumbnail

LTE-A/5G: Bring it on. Next-gen Soitec eSI90 wafers predict & improve RF performance.

Posted by on February 2, 2015
In Design & Manufacturing, Editor's Blog
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The folks at SOI wafer maker Soitec have announced an amazing update to their RF wafer line-up, with what they’re calling their eSI90 substrate (read the press release here). As you might expect, it improves on their terrifically successful line of substrates for the RF chips in smartphones and other mobile devices. And now with […]

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Paul Boudre named Soitec CEO as company re-focuses on electronics business Thumbnail

Paul Boudre named Soitec CEO as company re-focuses on electronics business

Posted on January 22, 2015
In Industry Buzz
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Paul Boudre has been named CEO of SOI wafer leader, Soitec (see financial press release here).  The company also announced its plans to re-focus on its core electronics business unit. Q3 sales were 48 million euros, up 45% over last year. The sale of 200mm wafers (which are used in chips for RF-SOI and smartpower) […]

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IEEE SOI-3D-Substhreshold (S3S) Conference Issues Call for Papers

Posted on January 9, 2015
In Industry Buzz
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The IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (IEEE S3S) has issued the 2015 Call for Papers. Now in its 3rd year as a combined event, the 2015 IEEE S3S Conference will take place in Sonoma Valley, CA, just north of San Francisco, October 5-8. This industry-wide event will gather together widely known experts, contributed papers and […]

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Soitec and SK Innovation collaborate on advanced semiconductor materials for IoT and communications

Posted on January 7, 2015
In Industry Buzz
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SOI wafer and advanced substrate leader Soitec and Korea’s SK Innovation (SKI) recently signed a Collaboration Agreement (CA) to establish a strategic alliance (read the press release here). The focus is on accelerating innovation in the area of semiconductor materials for information communication technologies and internet-of-things applications. The collaborative partnership will build on the synergy […]

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Simgui gets exclusive on distribution of Soitec 200mm SOI wafers in China

Posted on December 9, 2014
In Industry Buzz
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Under a new agreement, Simgui now has the exclusive right to promote, distribute and sell Soitec’s 200-mm SOI wafers in China (see press release in English here; Chinese version here). Soitec is the world’s leading producer of SOI wafers. Shanghai Simgui Technology Co., Ltd. (Simgui), a Shanghai-based semiconductor materials company, is a spinoff of the Shanghai Institute […]

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Two additions to Altatech equipment lines: 10x faster ultra-thin film deposition; Doppler nano-defect inspection captures true sizing and positioning Thumbnail

Two additions to Altatech equipment lines: 10x faster ultra-thin film deposition; Doppler nano-defect inspection captures true sizing and positioning

Posted on December 8, 2014
In Industry Buzz
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Two new products from semi equipment manufacturer Altatech: one for ultra-thin film deposition, and one for searching out nano-defects. Altatech is a division of Soitec, best known in the advanced substrates community for its leadership in SOI wafers. This part of the company, however, develops highly efficient, cost-effective inspection and chemical vapor deposition (CVD) technologies […]

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Successful RF-SOI 2014 International Symposium Held in Shanghai Thumbnail

Successful RF-SOI 2014 International Symposium Held in Shanghai

Posted by and on December 5, 2014
In Conferences
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A very successful international workshop on RF-SOI was held in Shanghai earlier this fall.  Jointly organized by industry leaders, it brought together world-class players in RF to discuss the opportunities and challenges in rapid development of RF applications. Sponsors included the SOI Industry Consortium, the Chinese Academy of Sciences (CAS) / Shanghai Institute of Microsystem […]

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SOI-3D-SubVt (S3S): three central technologies for tomorrow’s mainstream applications Thumbnail

SOI-3D-SubVt (S3S): three central technologies for tomorrow’s mainstream applications

Posted by and on November 3, 2014
In Conferences
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ST further accelerates its FD-SOI ROs* by 2ps/stage, and reduces SRAM’s VMIN by an extra 70mV. IBM shows an apple-to-apple comparison of 10nm FinFETs on Bulk and SOI. AIST improves the energy efficiency of its FPGA by more than 10X and Nikon shows 2 wafers can be bonded with an overlay accuracy better than 250nm. […]

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