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Archive of wafers

SOI-3D-SubVt (S3S): three central technologies for tomorrow’s mainstream applications Thumbnail

SOI-3D-SubVt (S3S): three central technologies for tomorrow’s mainstream applications

Posted by and on November 3, 2014
In Conferences
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ST further accelerates its FD-SOI ROs* by 2ps/stage, and reduces SRAM’s VMIN by an extra 70mV. IBM shows an apple-to-apple comparison of 10nm FinFETs on Bulk and SOI. AIST improves the energy efficiency of its FPGA by more than 10X and Nikon shows 2 wafers can be bonded with an overlay accuracy better than 250nm. […]

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IntelliEPI Buys Soitec GaAs Business

Posted on November 3, 2014
In Industry Buzz
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Soitec, a leader in SOI wafers and other advanced substrates, recently announced the sale of its gallium arsenide (GaAs) epitaxy business (the Soitec Specialty Electronics subsidiary) to Intelligent Epitaxy Technology Inc (see press release here).  The deal follows the previous collaboration between Soitec and IntelliEPI (see press release dated December 12, 2013). “The sale of […]

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Is China Interested in FD-SOI? You bet. Thumbnail

Is China Interested in FD-SOI? You bet.

Posted by on October 28, 2014
In Conferences, Editor's Blog, In & Around Our Industry
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At the recent FD-SOI Forum in Shanghai, the IoT (Internet of Things) was the #1 topic in all the presentations. The event was sponsored by the SOI Consortium, the Shanghai Institute of Microsystem and Information Technology / Chinese Academy of Sciences (SIMIT/CAS), and VeriSilicon. By all accounts it was a great success. Speakers included experts […]

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Soitec receives Sony’s Best Partnership Award for its support with RF-SOI substrates Thumbnail

Soitec receives Sony’s Best Partnership Award for its support with RF-SOI substrates

Posted on October 17, 2014
In Industry Buzz
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SOI wafer leader Soitec was awarded the Best Partnership Award by Sony Semiconductor. Soitec earned the recognition for outstanding support that has contributed to Sony’s success in the RF semiconductor market. Soitec’s high-resistivity silicon-on-insulator (HR-SOI) wafers have long been a favorite of RF designers for 2G and 3G switches. But the company’s latest eSi substrates […]

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FD-SOI Front and Center at Very Successful Semicon Europa Thumbnail

FD-SOI Front and Center at Very Successful Semicon Europa

Posted by on October 17, 2014
In Conferences, Editor's Blog
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Yes, GlobalFoundries is hot on FD-SOI. Yes, Qualcomm’s interested in it for IoT. Yes, ST’s got more amazing low-power FD-SOI results. These are just some of the highlights that came out of the Low Power Conference during Semicon Europa in Grenoble, France (7-9 October 2014). This was Semicon Europa’s first time in Grenoble, the heart […]

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Semicon Europa ’14 (Grenoble, 7-9 October) Includes Top Speakers at Conferences on Low Power, 3DI, Power Electronics & more Thumbnail

Semicon Europa ’14 (Grenoble, 7-9 October) Includes Top Speakers at Conferences on Low Power, 3DI, Power Electronics & more

Posted by on September 26, 2014
In Conferences, Editor's Blog
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  For the first time ever, Semicon Europa will be held in Grenoble this year, and FD-SOI will be a major part of it (website link here). With more than 5000 visitors and 350 exhibitors, Semicon Europa is the greatest annual event for the European microelectronics industry. And Grenoble can fairly be considered the epicenter of […]

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New SOI Textbook (and e-book) with contributions by experts at Soitec, GF, TSMC, Leti and more Thumbnail

New SOI Textbook (and e-book) with contributions by experts at Soitec, GF, TSMC, Leti and more

Posted on August 8, 2014
In Industry Buzz
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A new book entitled Silicon-On-Insulator (SOI) Technology, Manufacture and Applications (1st Edition) features contributions by experts at Soitec, GF, TSMC, Leti and more. Billed as “a complete review of this rapidly growing high-speed, low-power semiconductor technology,” the book covers the entire SOI spectrum, from Moore to More than Moore.  It goes into SOI wafer technology,  […]

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FD-SOI: The Best Enabler for Mobile Growth and Innovation Thumbnail

FD-SOI: The Best Enabler for Mobile Growth and Innovation

Posted by on August 8, 2014
In Design & Manufacturing, News & Viewpoints, SOI In Action
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The following in-depth analysis, an IBS study entitled How FD-SOI will Enable Innovation and Growth in Mobile Platform Sales, concludes that the benefits of FD-SOI are overwhelming for mobile platforms through Q4/2017 based on a number of key metrics. In fact, FD-SOI has the ability to support three technology nodes, which can mean a useful […]

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Soitec’s Shipped Enough eSI RF-SOI Substrates to Make over 1.4 Billion Devices Thumbnail

Soitec’s Shipped Enough eSI RF-SOI Substrates to Make over 1.4 Billion Devices

Posted on July 18, 2014
In Industry Buzz
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Soitec estimates that it has shipped enough of its eSI wafers to fabricate more than 1.4 billion RF front-end semiconductor devices. (Read the press release here.)  The proprietary Enhanced Signal Integrity™ (eSI) substrates are now the substrate of choice for manufacturing cost-effective and high-performance radio-frequency (RF) devices providing a power boost for 4G /LTE applications. […]

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Interview: Leti CEO Malier on the FD-SOI Breakthrough; Leti Days in Grenoble (24-26 June) & Semicon West Thumbnail

Interview: Leti CEO Malier on the FD-SOI Breakthrough; Leti Days in Grenoble (24-26 June) & Semicon West

Posted by on June 17, 2014
In Design & Manufacturing, Editor's Blog, News & Viewpoints
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Some years back, European research giant CEA-Leti made a major commitment to support FD-SOI, partnering with STMicroelectronics, Soitec and IBM.  Now, with the big FD-SOI foundry announcement by Samsung and STMicroelectronics, Leti’s ready to bring its vast expertise to players throughout the value chain, right up through design integration. To learn more about the range […]

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