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Shanghai RF-SOI and FD-SOI presentations being posted on SOI Consortium website

Posted on September 26, 2014
In Industry Buzz
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All the presentations made at the SOI Consortium‘s Shanghai workshops on RF-SOI and FD-SOI are now being posted. The RF-SOI posting includes presentations from IBS, ST, UCL, Skyworks, Shanghai Technology Institute, IBM, SMIC, Soitec and GlobalFoundries – click here for those. The FD-SOI postings include presentations from IBS, ST, Synopsys, Verisilicon, Wave Semi, IBM and […]

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New SOI Textbook (and e-book) with contributions by experts at Soitec, GF, TSMC, Leti and more Thumbnail

New SOI Textbook (and e-book) with contributions by experts at Soitec, GF, TSMC, Leti and more

Posted on August 8, 2014
In Industry Buzz
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A new book entitled Silicon-On-Insulator (SOI) Technology, Manufacture and Applications (1st Edition) features contributions by experts at Soitec, GF, TSMC, Leti and more. Billed as “a complete review of this rapidly growing high-speed, low-power semiconductor technology,” the book covers the entire SOI spectrum, from Moore to More than Moore.  It goes into SOI wafer technology,  […]

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Soitec’s Shipped Enough eSI RF-SOI Substrates to Make over 1.4 Billion Devices Thumbnail

Soitec’s Shipped Enough eSI RF-SOI Substrates to Make over 1.4 Billion Devices

Posted on July 18, 2014
In Industry Buzz
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Soitec estimates that it has shipped enough of its eSI wafers to fabricate more than 1.4 billion RF front-end semiconductor devices. (Read the press release here.)  The proprietary Enhanced Signal Integrity™ (eSI) substrates are now the substrate of choice for manufacturing cost-effective and high-performance radio-frequency (RF) devices providing a power boost for 4G /LTE applications. […]

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SOI: Looking Back Over a Year of Moving Forward (Part 1, FD-SOI) Thumbnail

SOI: Looking Back Over a Year of Moving Forward (Part 1, FD-SOI)

Posted by on January 13, 2014
In Editor's Blog, News & Viewpoints
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2014′s going to be a terrific year for the greater SOI community, with 28nm FD-SOI ramping in volume and 14nm debuting, plus RF-SOI continuing its stellar rise. But before we look forward (which we’ll do in an upcoming post), let’s consider where we’ve been and some of the highlights of the last year.  In fact, […]

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SOI Pioneers Mazure and Raskin Join Ranks of IEEE Fellows

Posted on December 5, 2013
In Industry Buzz
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Two SOI pioneers have been elevated to the status of Fellow by the IEEE for their extraordinary accomplishents: Jean-Pierre Raskin (Université catholique de Louvain (UCL), Louvain-la-Neuve, Belgium) – joined the “Class of 2014” for “contributions to the characterization of silicon-on-insulator RF MOSFETs and MEMS devices”.  Dr. Raskin received his PhD degree from UCL, where he […]

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SOITEC and UCL boost the RF performance of SOI substrates Thumbnail

SOITEC and UCL boost the RF performance of SOI substrates

Posted by and (Soitec) on December 4, 2013
In Advanced Substrate Corners, Design & Manufacturing, In & Around Our Industry, Professor's Perspective, R&D/Labnews
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Soitec and a team from UCL have been working together to identify the technological opportunities to further improve the high-frequency performance of SOI substrates. Based on the wideband characterization techniques developed at UCL, the RF characteristics of high-resistivity (HR) SOI substrates have been analyzed, modeled and greatly improved in order to meet the specifications of […]

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Microsemi, Honeywell <i>et al</i> Leveraging SOI to Curb CO<sub>2</sub> Emissions Thumbnail

Microsemi, Honeywell et al Leveraging SOI to Curb CO2 Emissions

Posted by on August 21, 2013
In Editor's Blog
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The furnace in your home’s basement might not be as sexy as your smartphone, but when it comes to making a difference to the planet, it’s awfully important. That’s why Microsemi and Honeywell have teamed up with Cissoid, Cambridge CMOS Sensors and several top universities like UCL, Cambridge and Warwick in a €4 million ($5.3 […]

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Over 50% of smartphones/tablets contain SOI? Think RF. Thumbnail

Over 50% of smartphones/tablets contain SOI? Think RF.

Posted by on March 11, 2013
In Editor's Blog
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In a recent press release, the SOI wafer leader Soitec said that chips built on its SOI wafers were found in over half of the smartphones and tablets in the market worldwide. 50%? That’s a lot! How do they figure that? The answer: RF. With all the talk right now about FD-SOI for application processors, […]

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Spotlight on FD-SOI & FinFETs at Upcoming IEEE SOI Conference<br />(1-4 Oct. in Napa – register by 17 Sept. for best rate) Thumbnail

Spotlight on FD-SOI & FinFETs at Upcoming IEEE SOI Conference
(1-4 Oct. in Napa – register by 17 Sept. for best rate)

Posted on September 14, 2012
In Editor's Blog
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The 38th annual SOI Conference is coming up in just a few weeks. Sponsored by IEEE Electron Devices Society, this is the only dedicated SOI conference covering the full technology chain from materials to devices, circuits and system applications. Chaired this year by Gosia Jurczak (manager of the Memories Program at imec), this excellent conference […]

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SOI Conference Shows SOI Driving Key Roadmaps Thumbnail

SOI Conference Shows SOI Driving Key Roadmaps

Posted by on October 14, 2011
In Editor's Blog
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The 2011 IEEE SOI Conference, held in Tempe, AZ last week was not one to miss…but I did. Happily, I got the papers right away, along with observations shared by some of the folks who did get there. Highlights include excellent and insightful papers from ST, ARM, IBM, Intel, Peregrine and GlobalFoundries, plus many more that indicate […]

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