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RF-SOI Innovator JP Raskin (his team’s work is in your smartphone) Awarded Blondel Medal Thumbnail

RF-SOI Innovator JP Raskin (his team’s work is in your smartphone) Awarded Blondel Medal

Posted on February 8, 2016
In Industry Buzz
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RF-SOI substrate guru Jean-Pierre Raskin, whose team at UCL* has driven the technology behind the most advanced wafer substrates for RF applications, has been awarded one of the highest honors in electronics: the prestigious Blondel Medal. The technology he pioneered is now in virtually all the world’s smartphones, and used by just about every RF […]

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Great line-up planned for IEEE S3S (SOI, 3D and low-voltage — 5-8 October, Sonoma, CA). Advance Program available. Registration still open. Thumbnail

Great line-up planned for IEEE S3S (SOI, 3D and low-voltage — 5-8 October, Sonoma, CA). Advance Program available. Registration still open.

Posted by on September 10, 2015
In Conferences, In & Around Our Industry
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Now in its third year, the 2015 IEEE S3S Conference has evolved into the premier venue for sharing the latest and most important findings in the areas of process integration, advanced materials & materials processing, and device and circuit design for SOI, 3D and low-voltage microelectronics. World-class leading experts in their fields will come to […]

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GF, NXP, Infineon and more at SOI Workshop During Silicon Saxony Day (Dresden, 7 July 2015) Thumbnail

GF, NXP, Infineon and more at SOI Workshop During Silicon Saxony Day (Dresden, 7 July 2015)

Posted on June 12, 2015
In Industry Buzz
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Silicon Europe (an alliance of Europe’s leading micro- and nanoelectronics clusters) and the SOI Consortium have organized an SOI Workshop on the 7th of July 2015, during the 10th Silicon Saxony Day in Dresden. Here’s the agenda: Quick Introduction More than Moore Market Analysis and Opportunities (Yole) Power SOI and applications (NXP) Foundry offer (GlobalFoundries) […]

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RF-SOI: Already in Every Smartphone, New Opps Abound in IoT (SF Workshop Part 3 of 3: IBM, ST, GF and more) Thumbnail

RF-SOI: Already in Every Smartphone, New Opps Abound in IoT (SF Workshop Part 3 of 3: IBM, ST, GF and more)

Posted by on March 11, 2015
In Conferences, Design & Manufacturing, Editor's Blog
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RF-SOI is already found in virtually every new smartphone out there, so the RF-SOI session of the recent FD-SOI/RF-SOI Workshop in San Francisco focused on long-term growth and further opportunities. In case you missed it, ASN already covered the SF Workshop’s FD-SOI presentations (Samsung, ST and the EDA houses – click here for that post) […]

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How SOI wafers for RF predict LTE-A/5G device performance Thumbnail

How SOI wafers for RF predict LTE-A/5G device performance

Posted by and on February 17, 2015
In Design & Manufacturing, SOI In Action
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Soitec has developed an innovative metrology and metric for ensuring that devices built on our latest SOI wafers for RF will meet the draconian demands of LTE-Advanced (LTE-A) and 5G network standards. For smartphones and tablets to handle LTE-A and 5G, they need RF devices with much higher linearity than those running over the current […]

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LTE-A/5G: Bring it on.  Next-gen Soitec eSI90 wafers predict & improve RF performance. Thumbnail

LTE-A/5G: Bring it on. Next-gen Soitec eSI90 wafers predict & improve RF performance.

Posted by on February 2, 2015
In Design & Manufacturing, Editor's Blog
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The folks at SOI wafer maker Soitec have announced an amazing update to their RF wafer line-up, with what they’re calling their eSI90 substrate (read the press release here). As you might expect, it improves on their terrifically successful line of substrates for the RF chips in smartphones and other mobile devices. And now with […]

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Successful RF-SOI 2014 International Symposium Held in Shanghai Thumbnail

Successful RF-SOI 2014 International Symposium Held in Shanghai

Posted by and on December 5, 2014
In Conferences
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A very successful international workshop on RF-SOI was held in Shanghai earlier this fall.  Jointly organized by industry leaders, it brought together world-class players in RF to discuss the opportunities and challenges in rapid development of RF applications.Sponsors included the SOI Industry Consortium, the Chinese Academy of Sciences (CAS) / Shanghai Institute of Microsystem and […]

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Shanghai RF-SOI and FD-SOI presentations being posted on SOI Consortium website

Posted on September 26, 2014
In Industry Buzz
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All the presentations made at the SOI Consortium‘s Shanghai workshops on RF-SOI and FD-SOI are now being posted. The RF-SOI posting includes presentations from IBS, ST, UCL, Skyworks, Shanghai Technology Institute, IBM, SMIC, Soitec and GlobalFoundries – click here for those. The FD-SOI postings include presentations from IBS, ST, Synopsys, Verisilicon, Wave Semi, IBM and […]

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New SOI Textbook (and e-book) with contributions by experts at Soitec, GF, TSMC, Leti and more Thumbnail

New SOI Textbook (and e-book) with contributions by experts at Soitec, GF, TSMC, Leti and more

Posted on August 8, 2014
In Industry Buzz
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A new book entitled Silicon-On-Insulator (SOI) Technology, Manufacture and Applications (1st Edition) features contributions by experts at Soitec, GF, TSMC, Leti and more. Billed as “a complete review of this rapidly growing high-speed, low-power semiconductor technology,” the book covers the entire SOI spectrum, from Moore to More than Moore.  It goes into SOI wafer technology,  […]

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Soitec’s Shipped Enough eSI RF-SOI Substrates to Make over 1.4 Billion Devices Thumbnail

Soitec’s Shipped Enough eSI RF-SOI Substrates to Make over 1.4 Billion Devices

Posted on July 18, 2014
In Industry Buzz
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Soitec estimates that it has shipped enough of its eSI wafers to fabricate more than 1.4 billion RF front-end semiconductor devices. (Read the press release here.)  The proprietary Enhanced Signal Integrity™ (eSI) substrates are now the substrate of choice for manufacturing cost-effective and high-performance radio-frequency (RF) devices providing a power boost for 4G /LTE applications. […]

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