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IP Value Starts at the Substrate Level

Posted by on October 19, 2013
In News & Viewpoints, SOI In Action
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If you say “IP” in the chip business, everyone thinks of cores and design. But in fact, the importance of intellectual property for chips can extend right down to the substrate level. Engineered, advanced wafer substrates open new doors for designers. For example, Soitec recently announcement that we are licensing some of our Smart Stacking™ […]

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Soitec’s Smart Cut™ technology is now being leveraged to produce GaN substrates for high-performance LED lighting applications

Posted on May 6, 2013
In Industry Buzz
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Soitec‘s Smart Cut™ technology, best known for its role as the leading technology for producing SOI wafers, is now being leveraged to produce GaN substrates for high-performance LED lighting applications. Following a successful pilot line announced last year, Sumitomo Electric will now industrialize the product and invest in Smart Cut technology. Yoshiki Miura, general manager […]

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Soitec and Sumitomo Electric are launching pilot production of 4” and 6” GaN wafers for the LED and power markets

Posted on January 26, 2012
In Industry Buzz
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World-leading advanced substrate maker Soitec and compound materials leader Sumitomo Electric are launching pilot production of 4” and 6” GaN wafers for the LED and power markets. Soitec applies its Smart CutTM layer-transfer process to Sumitomo’s bulk GaN wafers to generate engineered wafers with the same thermal expansion (CTE) as standard GaN wafers but at […]

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Soitec has inked deals with Peregrine and Sumitomo

Posted on February 9, 2011
In Industry Buzz
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In recent months, Soitec has inked deals with: • Peregrine for joint development and production of a new, bonded silicon-on-sapphire (SOS) substrate for RFICs; • and with Sumitomo for the development of engineered gallium nitride (GaN) substrates for applications like high brightness LEDs as well as electric power devices designed for hybrid and full electric […]

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