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Archive of Soitec

12nm FD-SOI on the Roadmap for H1/2019 Customer Tape-out! Says GloFo (While Giving 22FDX Ecosys a Great Boost) Thumbnail

12nm FD-SOI on the Roadmap for H1/2019 Customer Tape-out! Says GloFo (While Giving 22FDX Ecosys a Great Boost)

Posted by on September 15, 2016
In Design & Manufacturing, Editor's Blog
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12nm FD-SOI has now officially joined the GlobalFoundries’ roadmap, targeting intelligent, connected systems and beating 14/16nm FinFET on performance, power consumption (by 50%!) and cost (see press release here). Customer product tape-outs are expected to begin in the first half of 2019. GloFo also announced FDXcelerator™, an ecosystem designed to give 22FDX™ SoC design a […]

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NXP, Qualcomm, Skyworks to Keynote IoT Theme in Upcoming IEEE SOI-3D-SubVt (S3S) Conference (San Francisco, Oct.’16) – Late News Submissions Open, Advance Program Available Thumbnail

NXP, Qualcomm, Skyworks to Keynote IoT Theme in Upcoming IEEE SOI-3D-SubVt (S3S) Conference (San Francisco, Oct.’16) – Late News Submissions Open, Advance Program Available

Posted by on August 15, 2016
In Conferences, In & Around Our Industry
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IEEE S3S Conference 10-13 October 2016 Hyatt Regency San Francisco Airport IEEE SOI–3D–Subthreshold Microelectronics Technology Unified Conference Theme: Energy Efficient Technology for the Internet of Things Late News submissions open and Advance Program available The IEEE S3S Conference brings together 3 key technologies that will play a major role in tomorrow’s industry: SOI, 3D integration, […]

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FD-SOI at DAC 2016 Thumbnail

FD-SOI at DAC 2016

Posted by on May 31, 2016
In Conferences, Editor's Blog
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If you’re headed to DAC (June 5-9 in Austin,TX) and are interested in learning more about FD-SOI, there will be lots of opportunities. Here’s a quick rundown. Synopsys-GlobalFoundries: Dinner! Synopsys (stands 149 & 361) and GlobalFoundries are hosting a dinner on Tuesday evening (7 June) at the Austin Hilton around the theme, What’s Important for […]

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Impressive! Soitec FD-SOI Press Conference in China = >150 Articles Thumbnail

Impressive! Soitec FD-SOI Press Conference in China = >150 Articles

Posted by on May 11, 2016
In Editor's Blog
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FD-SOI makes sense for China. That was the key message SOI wafer leader Soitec made in a press conference on FD-SOI for a select group of journalists just before Semicon China this spring. News then quickly spread, and resulted in over 150 FD-SOI articles in the top China technology and business press. Soitec also put […]

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Silicon Valley FD-SOI Symposium Promises Best Ecosystem Line-Up Ever: ARM, Foundries, EDA, Designers, Experts & Users (13 April – free and open to all who sign up) Thumbnail

Silicon Valley FD-SOI Symposium Promises Best Ecosystem Line-Up Ever: ARM, Foundries, EDA, Designers, Experts & Users (13 April – free and open to all who sign up)

Posted by on March 31, 2016
In Conferences, Design & Manufacturing, Editor's Blog
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The SOI Consortium has lined up an excellent, comprehensive FD-SOI Symposium on April 13th in San Jose. They’ll be highlighting the tremendous progress of the FD-SOI ecosystem. Headliners include Cisco, Sony, NXP, SigmaDesigns, ARM, Ciena plus the big FD-SOI foundries, EDA companies, design partners, chipmakers and analysts. There is a special session dedicated to RF […]

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RF-SOI – Foundries Weigh In On New 300mm Wafers for 4G/LTE-A, 5G and IoT. Plus a Look at the Innovation Pipeline – Part 2 of 2 Thumbnail

RF-SOI – Foundries Weigh In On New 300mm Wafers for 4G/LTE-A, 5G and IoT. Plus a Look at the Innovation Pipeline – Part 2 of 2

Posted by on March 23, 2016
In Design & Manufacturing, Editor's Blog
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As you may have read in the first part of this series, Soitec (the industry’s leading supplier of SOI wafers) says its 200mm RF-SOI wafers have been used to produce over 20 billion chips, and the company is now in high-volume manufacturing of a 300mm version of its wildly successful RFeSI line (see press release […]

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Now also on 300mm wafers and headed for 5G and IoT, RF-SOI’s going strong and stronger (>20 billion chips to date) – Part 1 of 2 Thumbnail

Now also on 300mm wafers and headed for 5G and IoT, RF-SOI’s going strong and stronger (>20 billion chips to date) – Part 1 of 2

Posted by on March 18, 2016
In Design & Manufacturing, Editor's Blog
Tagged with , , , , , , , , , , , , ,

Soitec, the industry’s leading supplier of SOI wafers recently announced it’s in high-volume manufacturing of a 300mm version of its wildly successful RFeSI line (see press release here). What’s it all about? FEMs. RF front-end module – aka FEM – chips handle the back-and-forth of signals between the transceiver and the antenna. FEMs built on […]

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RF-SOI Innovator JP Raskin (his team’s work is in your smartphone) Awarded Blondel Medal Thumbnail

RF-SOI Innovator JP Raskin (his team’s work is in your smartphone) Awarded Blondel Medal

Posted on February 8, 2016
In Industry Buzz
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RF-SOI substrate guru Jean-Pierre Raskin, whose team at UCL* has driven the technology behind the most advanced wafer substrates for RF applications, has been awarded one of the highest honors in electronics: the prestigious Blondel Medal. The technology he pioneered is now in virtually all the world’s smartphones, and used by just about every RF […]

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Great FD-SOI start for 2016: Samsung, GF, Renesas, NXP/Freescale, ST, Soitec Thumbnail

Great FD-SOI start for 2016: Samsung, GF, Renesas, NXP/Freescale, ST, Soitec

Posted by on February 3, 2016
In Design & Manufacturing, Editor's Blog
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Just a month into 2016 and we already have a raft of FD-SOI news from Samsung, GlobalFoundries, NXP/Freescale, Renesas and more. And of course RF-SOI continues ever stronger. Here’s a quick update of what we’ve been seeing, starting with news from the recent SOI Consortium forum in Tokyo. Many of the presentations are now available on […]

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Call for submissions to FD-SOI IP Workshops (prizes!): Dresden (March), Bangalore (April), Shanghai (Sept), Grenoble (Dec)

Posted on February 3, 2016
In Industry Buzz
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  Design & Reuse, in partnership with GlobalFoundries, ST, Soitec and Leti, is sponsoring a series of FD-SOI IP Workshops around the globe. (Click here for more information.) These working days aim at sharing information about IP that’s currently available or is being designed for FD-SOI technology. The first conference will take place during DATE […]

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