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Archive of SOI

Interview (part 2 of 2): Leti Is a Catalyst for the FD-SOI Ecosystem. CEO Marie Semeria Explains Where They’re Headed Thumbnail

Interview (part 2 of 2): Leti Is a Catalyst for the FD-SOI Ecosystem. CEO Marie Semeria Explains Where They’re Headed

Posted by on December 17, 2015
In Design & Manufacturing, News & Viewpoints, R&D/Labnews
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From wafers to apps, Leti has been the moving force behind all things SOI for over 30 years. Now they’re the powerhouse behind the FD-SOI phenomenon. CEO Marie-Noelle Semeria shares her insights here in part 2 of this exclusive ASN interview as to what Leti’s doing to drive the ecosystem forward. (In part 1, she […]

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IEEE S3S, Top SOI/3D/SubVt Conference, Issues Call for Papers. Theme: Energy Efficient Tech for IoT. (Best Student Paper wins $1000) Thumbnail

IEEE S3S, Top SOI/3D/SubVt Conference, Issues Call for Papers. Theme: Energy Efficient Tech for IoT. (Best Student Paper wins $1000)

Posted on December 17, 2015
In Industry Buzz
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The IEEE S3S (SOI/3D/SubVt) has issued its call for papers for the 2016 conference (click here for details). The theme of the conference, which will take place October 10th – 13th in San Francisco, is “Energy Efficient Technology for the Internet of Things”. This industry-wide event gathers together widely known experts, contributed papers and invited […]

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Interview: Leti Is the Moving Force Behind FD-SOI. CEO Marie Semeria Explains the Strategy (part 1 of 2) Thumbnail

Interview: Leti Is the Moving Force Behind FD-SOI. CEO Marie Semeria Explains the Strategy (part 1 of 2)

Posted by on December 8, 2015
In Design & Manufacturing, News & Viewpoints, R&D/Labnews
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From wafers to apps, Leti has been the moving force behind all things SOI for over 30 years. Now they’re the powerhouse behind the FD-SOI phenomenon. CEO Marie Semeria shares her insights here in part 1 of this exclusive ASN interview as to what makes Leti tick. In part 2, we’ll talk about Leti’s new […]

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Don’t miss EuroSOI-ULIS, 25-27 January 2016 in Vienna. Call for papers still open. Thumbnail

Don’t miss EuroSOI-ULIS, 25-27 January 2016 in Vienna. Call for papers still open.

Posted on November 27, 2015
In Industry Buzz
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The 2016 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon, aka EUROSOI-ULIS 2016 will be taking place January 25-27, 2016 in Vienna, Austria. The event will be hosted by the Institute for Microelectronics, TU Wien. The focus of the sessions is on SOI technology and advanced nanoscale devices. The organizing committee […]

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GF’s 22nm FD-SOI Offering – Where to Get Lots of Excellent Info Thumbnail

GF’s 22nm FD-SOI Offering – Where to Get Lots of Excellent Info

Posted by on October 2, 2015
In Design & Manufacturing, Editor's Blog
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A fast-growing body of information is now posted by GlobalFoundries on their new 22nm FD-SOI offering. After years of asking “where’s FD-SOI on the GF website??”, it’s (finally!) there, front and center. There are some excellent new videos and documents. Here’s a rundown of what you’ll find. When you click down the “Technology Solutions” tab […]

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Industry 1st: Leti Demos MEMS on 300mm Wafers – And Yes, They’re SOI

Posted on October 2, 2015
In Industry Buzz
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In what may be a first for the MEMS industry, CEA-Leti has manufactured micro-accelerometers on 300mm wafers, a development that could lead to significantly lower MEMS manufacturing costs. And yes, those 300mm wafers are SOI wafers. These are “thick” SOI wafers, with an insulating BOx (buried oxide) layer of 2µm, and top silicon of 220nm. […]

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Soitec board names CEO Boudre Chairman; Auberton-Hervé Chairman Emeritus

Posted on September 24, 2015
In Industry Buzz
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Soitec, the world’s SOI wafer leader, announced that the Board of Directors has named André-Jacques Auberton-Hervé as Chairman Emeritus (he founded Soitec together with Jean-Michel Lamure in 1992). CEO Paul Boudre has been appointed Chairman of Soitec’s Board of Directors. (Read the press release here.)

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Great line-up planned for IEEE S3S (SOI, 3D and low-voltage — 5-8 October, Sonoma, CA). Advance Program available. Registration still open. Thumbnail

Great line-up planned for IEEE S3S (SOI, 3D and low-voltage — 5-8 October, Sonoma, CA). Advance Program available. Registration still open.

Posted by on September 10, 2015
In Conferences, In & Around Our Industry
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Now in its third year, the 2015 IEEE S3S Conference has evolved into the premier venue for sharing the latest and most important findings in the areas of process integration, advanced materials & materials processing, and device and circuit design for SOI, 3D and low-voltage microelectronics. World-class leading experts in their fields will come to […]

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IBM 0.3V SOI-FinFET SRAM paper garners press attention

Posted on July 21, 2015
In Industry Buzz
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An IBM paper on a 14nm SOI-FinFET SRAM functional down to 0.3V has garnered press attention. The paper, entitled 14nm FinFET Based Supply Voltage Boosting Techniques for Extreme Low Vmin Operation by R.V. Joshi et al, was presented during the Symposium on VLSI Circuits in Kyoto, Japan in June. According to the abstract, the authors […]

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Soitec Appoints New CFO

Posted on July 14, 2015
In Industry Buzz
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SOI-wafer leader Soitec has appointed Grégoire Duban as Chief Financial Officer. This recruitment supports the ongoing strategic refocusing of the Group’s activities on its core electronics business, as Soitec announced on January 19 (read full press release here). Duban will report directly to Soitec CEO Paul Boudre. “Grégoire Duban possesses over 18 years’ experience in […]

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