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Archive of SOI

IEEE SOI-3D-Subthreshold Conference (SF, Oct. ’14) Call for Papers

Posted on April 9, 2014
In Industry Buzz
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After a very successful first edition in 2013, the 2014 IEEE S3S will take place in San Francisco, 6-9 October, 2014 (click here for details). IEEE S3S combines the former IEEE International SOI Conference and the IEEE Subthreshold Microelectronics Conference, and adds a parallel track in 3D Integration. The technical sessions will be preceded by […]

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Tronics Manufactures the First Piezoresistive Nanowire 6DOF Inertial MEMS (SOI) Thumbnail

Tronics Manufactures the First Piezoresistive Nanowire 6DOF Inertial MEMS (SOI)

Posted on April 9, 2014
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       A year after announcing the industrialization of CEA-Leti’s breakthrough M&NEMS technologies, Tronics has successfully designed and manufactured the first batch of six-degrees-of-freedom (6DOF) MEMS chips, with 3 accelerometers and 3 gyroscopes on a single die (press release here). Built on SOI wafers, with a die size of less than 4mm2, this 6DOF MEMS […]

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Going Up! Monolithic 3D as an Alternative to CMOS Scaling Thumbnail

Going Up! Monolithic 3D as an Alternative to CMOS Scaling

Posted by , and on April 9, 2014
In Design & Manufacturing, R&D/Labnews
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By Jean-Eric Michallet, Hughes Metras and Perrine Batude (CEA-Leti)  The miniaturization of the MOSFET transistor has been the main booster for the semiconductor industry’s rapid growth in the last four decades. Following “Moore’s Law”, this scaling race has enabled performance increases in integrated circuits at a continuous cost reduction: today’s $200 mobile phone has as […]

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Presentation on Substrates for SOI-FinFETs and FD-SOI by SEH, World Wafer Leader, Posted on weSRCH Thumbnail

Presentation on Substrates for SOI-FinFETs and FD-SOI by SEH, World Wafer Leader, Posted on weSRCH

Posted on March 26, 2014
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(Courtesy: SEH, weSRCH)   A presentation by Shin‐Etsu Handotai (SEH, the world’s largest wafer supplier) detailing the company’s line-up of wafers for FD-SOI and SOI-FinFET is now available on weSRCH (click here to access it). SEH, a $12.7 billion company supplying over 20% of the world’s bulk silicon wafers, has been making SOI wafers since […]

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Eveon and Leti Leverage SOI in Milestone: Fabrication Of Smart Bolus-type Micro-pump for Drug Delivery Thumbnail

Eveon and Leti Leverage SOI in Milestone: Fabrication Of Smart Bolus-type Micro-pump for Drug Delivery

Posted on March 26, 2014
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(Courtesy: CEA-Leti)   Eveon and CEA-Leti have demonstrated liquid-pumping for smart drug delivery in the bolus mode using a silicon-based micro-pump fabricated with a standard MEMS process. (Read full press release here.) The milestone is the first functional micro-pump integration using MEMS standard process on Leti’s 200mm line. It is a result of FluMin3, Eveon […]

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Semicon Europa 2014 Comes to Grenoble, Issues Call for Papers Thumbnail

Semicon Europa 2014 Comes to Grenoble, Issues Call for Papers

Posted on March 19, 2014
In Industry Buzz
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For the first time, SEMICON Europa will be held in Grenoble, France. The greater Grenoble region is home to industry leaders leveraging and researching SOI and related advanced substrates, including Soitec, Leti and  ST. SEMI has now announced the “Call for Papers” for technical sessions and presentations for SEMICON Europa 2014, which takes place October […]

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Chipworks cites SOI in major IBM innovations (EETimes)

Posted on February 20, 2014
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Citing SOI in the Power family of high-performance processors, Chipworks concludes that IBM is a major source of chip innovation. In a recent EETimes article (read it here), which charts IBM developments at the transistor level over the last decade, the article notes that “..the 32 nm technology used to fabricate the IBM Power7+ represents […]

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EU report: SOI-based technologies should play important role in capturing new markets

Posted on February 20, 2014
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“High performing low power digital technology based on SOI” is an important part of the detailed plan submitted February 14th by the Electronics Leaders’ Group (ELG) to European Commission Vice-President Neelie Kroes.  (Press release here.) The group recommends the EU focus on: Areas were Europe is strong – automotive, energy, industrial automation and security. The […]

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RF-SOI Powerhouse Peregrine Introduces UltraCMOS® Global 1 Reconfigurable RF Front-End System Thumbnail

RF-SOI Powerhouse Peregrine Introduces UltraCMOS® Global 1 Reconfigurable RF Front-End System

Posted on February 7, 2014
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Peregrine’s UltraCMOS® Global 1, the first reconfigurable RFFE system, includes a multimode, multiband power amplifier, post-PA switch, antenna switch and antenna tuner on a single chip. (Image courtesy: Peregrine Semiconductor) RF-SOI powerhouse Peregrine Semiconductor has announced the Global 1 (press release here), billed as “the industry’s first reconfigurable RF front-end system”.  The company says it […]

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Debiotech expands target market for SOI-MEMS based solution to Type 2 diabetes Thumbnail

Debiotech expands target market for SOI-MEMS based solution to Type 2 diabetes

Posted on February 7, 2014
In Industry Buzz
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(Images courtesy: Debiotech) Debiotech has debuted the JewelPUMP2, a new product dedicated to the Diabetes Type 2 market, based on Debiotech’s innovative JewelPUMP platform (press release here). By using its JewelPUMP platform, which is already in the industrialization phase and in preparation for the CE marking, Debiotech will be able to introduce the JewelPUMP2 shortly […]

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