ASN

Archive of Smart Stacking

What Smart Stacking™ can do for you Thumbnail

What Smart Stacking™ can do for you

Posted by (Soitec) on April 22, 2011
In ASN #17, Design & Manufacturing, Imaging, In & Around Our Industry, MEMS
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Transferring a processed (or partially processed) layer of circuits from one wafer onto another enables innovative new solutions for BSI, MEMS, RF, 3D and more. Smart Stacking™ is Soitec’s wafer-to-wafer stacking technology platform for partially or fully processed wafers (see Figure 1). It enables the transfer of very thin processed layers in a high-volume production …

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Circuit Layer Transfer with Smart Stacking™ Thumbnail

Circuit Layer Transfer with Smart Stacking™

Posted by (Soitec) on May 27, 2009
In ASN #12, Design & Manufacturing, In & Around Our Industry
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Transferring the entire layer of circuits from a processed wafer to the best substrate for the application is now available for custom manufacturing or technology transfer. The Soitec Group recently announced that Smart Stacking™, our circuit stacking technology, is ready for both manufacturing and technology transfer.

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New Layer Transfer Technology Moves Processed Circuits to the Best Substrates for the Application Thumbnail

New Layer Transfer Technology Moves Processed Circuits to the Best Substrates for the Application

Posted by (Soitec) on May 11, 2007
In ASN #7, Design & Manufacturing, In & Around Our Industry
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Transferring a layer with all the circuits from a processed wafer onto another support substrate decouples the exigencies of circuit fabrication from the needs of the final application. The best substrate for circuit fabrication is not always the best choice for the functioning of the chip. Nor is the best substrate for the final application …

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Soitec has announced the acquisition of TraciT Technologies

Posted on July 11, 2006
In Industry Buzz
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• Soitec has announced the acquisition of TraciT Technologies. A CEA-Léti spin-off, TraciT specializes in thin-film layer transfer technologies that leverage molecular adhesion and mechanical and chemical thinning processes for MEMS and power-circuit production. The technology is complementary to Smart Cut,™ and enables Soitec to enter new electronic markets, thanks to fully-processed electronic circuits transfer …

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A New Generation of Structures

Posted by (Soitec) on July 11, 2006
In ASN #5, Design & Manufacturing, In & Around Our Industry
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Bonding and thinning technologies pave the way to new substrates for MEMS and power ICs, and enable the transfer of finished circuits to new supports. Layer transfer and direct bonding technologies that leverage molecular adhesion and mechanical and chemical thinning open doors to new generations in advanced and engineered substrates. A spin-off of CEA-Léti, TraciT …

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