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Archive of silicon-on-insulator

RF-SOI: Already in Every Smartphone, New Opps Abound in IoT (SF Workshop Part 3 of 3: IBM, ST, GF and more) Thumbnail

RF-SOI: Already in Every Smartphone, New Opps Abound in IoT (SF Workshop Part 3 of 3: IBM, ST, GF and more)

Posted by on March 11, 2015
In Conferences, Design & Manufacturing, Editor's Blog
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RF-SOI is already found in virtually every new smartphone out there, so the RF-SOI session of the recent FD-SOI/RF-SOI Workshop in San Francisco focused on long-term growth and further opportunities. In case you missed it, ASN already covered the SF Workshop’s FD-SOI presentations (Samsung, ST and the EDA houses – click here for that post) […]

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Big Boost for FD-SOI Momentum Seen at SF Workshop  –  Part 1 of 3: The FD-SOI Presentations (ST, Samsung, EDA & Design Houses) Thumbnail

Big Boost for FD-SOI Momentum Seen at SF Workshop – Part 1 of 3: The FD-SOI Presentations (ST, Samsung, EDA & Design Houses)

Posted by on March 3, 2015
In Conferences, Design & Manufacturing, Editor's Blog
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The FD-SOI/RF-SOI Workshop in San Francisco last week was a huge success. Over 150 people from over 80 companies attended the all-day event. There were excellent presentations, animated Q&A sessions, and lots of networking going on over coffee, lunch and cocktails.  It generated excellent press (click here to see the EETimes feature) and lots of […]

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How SOI wafers for RF predict LTE-A/5G device performance Thumbnail

How SOI wafers for RF predict LTE-A/5G device performance

Posted by and on February 17, 2015
In Design & Manufacturing, SOI In Action
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Soitec has developed an innovative metrology and metric for ensuring that devices built on our latest SOI wafers for RF will meet the draconian demands of LTE-Advanced (LTE-A) and 5G network standards. For smartphones and tablets to handle LTE-A and 5G, they need RF devices with much higher linearity than those running over the current […]

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Tokyo FD-SOI/RF-SOI Workshop (part 2): Sony 1mW FD-SOI GPS steals the show, but great presentations from EDA & design houses, too Thumbnail

Tokyo FD-SOI/RF-SOI Workshop (part 2): Sony 1mW FD-SOI GPS steals the show, but great presentations from EDA & design houses, too

Posted by on February 9, 2015
In Design & Manufacturing, Editor's Blog
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The Sony presentation on a 28nm FD-SOI GPS chip for an IoT app, which cut power by 10x (down to 1mW), has gained enormous traction worldwide.  However, that was just one of a dozen excellent presentations made by industry leaders at the recent FD-SOI/RF-SOI workshop in Tokyo. In part 1 of ASN’s coverage of the […]

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Tokyo FD-SOI/RF-SOI Workshop (part 1): Samsung, ST presentations & more Thumbnail

Tokyo FD-SOI/RF-SOI Workshop (part 1): Samsung, ST presentations & more

Posted by on February 8, 2015
In Design & Manufacturing, Editor's Blog
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A dozen excellent presentations on FD-SOI and RF-SOI were made by industry leaders at the recent workshop in Tokyo. Here in part 1 of ASN’s coverage, we’ll take a quick look at the presentations by Samsung, ST, IBS, IBM and Lapis. In part 2, we’ll look at Sony’s, as well as the presentations from the […]

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LTE-A/5G: Bring it on.  Next-gen Soitec eSI90 wafers predict & improve RF performance. Thumbnail

LTE-A/5G: Bring it on. Next-gen Soitec eSI90 wafers predict & improve RF performance.

Posted by on February 2, 2015
In Design & Manufacturing, Editor's Blog
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The folks at SOI wafer maker Soitec have announced an amazing update to their RF wafer line-up, with what they’re calling their eSI90 substrate (read the press release here). As you might expect, it improves on their terrifically successful line of substrates for the RF chips in smartphones and other mobile devices. And now with […]

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Sony’s FD-SOI GPS makes EETimes headlines — and quite a buzz.

Posted on February 2, 2015
In Industry Buzz
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A new EETimes article entitled Sony Joins FD-SOI Club by Chief International Correspondent Junko Yoshida has created a tremendous buzz (click here to read it). The piece covers Sony’s presentation at the latest RF/FD-SOI workshop in Tokyo (many of the presentation are now posted here). Sony described their design experience with porting a GPS chip […]

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IBM z13, world’s fastest microprocessor – on SOI, of  course! Thumbnail

IBM z13, world’s fastest microprocessor – on SOI, of course!

Posted on February 2, 2015
In Industry Buzz
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The recently announced IBM z13, which is billed as the world’s fastest microprocessor, is built on SOI (of course!) (read the press release here). At the heart of the latest in the IBM z-series of mainframes, the chip is manufactured in 22nm SOI (partially depleted). IBM says it is 2X faster than the most common […]

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2015 – Turning the Tables for FD-SOI, RF-SOI and More Thumbnail

2015 – Turning the Tables for FD-SOI, RF-SOI and More

Posted by on January 22, 2015
In Editor's Blog
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If current momentum is any indication, 2015 will be the year the tables turn in favor of FD-SOI designs (with a big shout-out to IoT).  The RF-SOI juggernaut will continue cutting an enormous swath through the mobile market.   Attention to the exciting possibilities of monolithic 3D (M3D) technology (like Leti’s “CoolCube”) will continue to grow, […]

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Paul Boudre named Soitec CEO as company re-focuses on electronics business Thumbnail

Paul Boudre named Soitec CEO as company re-focuses on electronics business

Posted on January 22, 2015
In Industry Buzz
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Paul Boudre has been named CEO of SOI wafer leader, Soitec (see financial press release here).  The company also announced its plans to re-focus on its core electronics business unit. Q3 sales were 48 million euros, up 45% over last year. The sale of 200mm wafers (which are used in chips for RF-SOI and smartpower) […]

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