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Archive of silicon-on-insulator

VLSI Research names Soitec CEO to 2015 All Stars of the Semiconductor Industry Thumbnail

VLSI Research names Soitec CEO to 2015 All Stars of the Semiconductor Industry

Posted on December 19, 2015
In Industry Buzz
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VLSI Research Chip Insider has named Soitec CEO Paul Boudre to its roster of 2015 All Stars of the Semiconductor Industry. (See the announcement here.) Boudre was cited for “…successfully re-organizing Soitec back to its core business as a leading innovative engineered substrate supplier. His first year results are already astounding, with very high growth […]

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Interview (part 2 of 2): Leti Is a Catalyst for the FD-SOI Ecosystem. CEO Marie Semeria Explains Where They’re Headed Thumbnail

Interview (part 2 of 2): Leti Is a Catalyst for the FD-SOI Ecosystem. CEO Marie Semeria Explains Where They’re Headed

Posted by on December 17, 2015
In Design & Manufacturing, News & Viewpoints, R&D/Labnews
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From wafers to apps, Leti has been the moving force behind all things SOI for over 30 years. Now they’re the powerhouse behind the FD-SOI phenomenon. CEO Marie-Noelle Semeria shares her insights here in part 2 of this exclusive ASN interview as to what Leti’s doing to drive the ecosystem forward. (In part 1, she […]

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Interview: Leti Is the Moving Force Behind FD-SOI. CEO Marie Semeria Explains the Strategy (part 1 of 2) Thumbnail

Interview: Leti Is the Moving Force Behind FD-SOI. CEO Marie Semeria Explains the Strategy (part 1 of 2)

Posted by on December 8, 2015
In Design & Manufacturing, News & Viewpoints, R&D/Labnews
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From wafers to apps, Leti has been the moving force behind all things SOI for over 30 years. Now they’re the powerhouse behind the FD-SOI phenomenon. CEO Marie Semeria shares her insights here in part 1 of this exclusive ASN interview as to what makes Leti tick. In part 2, we’ll talk about Leti’s new […]

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Don’t miss EuroSOI-ULIS, 25-27 January 2016 in Vienna. Call for papers still open. Thumbnail

Don’t miss EuroSOI-ULIS, 25-27 January 2016 in Vienna. Call for papers still open.

Posted on November 27, 2015
In Industry Buzz
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The 2016 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon, aka EUROSOI-ULIS 2016 will be taking place January 25-27, 2016 in Vienna, Austria. The event will be hosted by the Institute for Microelectronics, TU Wien. The focus of the sessions is on SOI technology and advanced nanoscale devices. The organizing committee […]

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First SOI wafers based on Smart Cut tech produced in China, target strong 200mm SOI demand in smart power, RF, automotive Thumbnail

First SOI wafers based on Smart Cut tech produced in China, target strong 200mm SOI demand in smart power, RF, automotive

Posted by on September 24, 2015
In Design & Manufacturing, Editor's Blog
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Shanghai-based Simgui has produced the company’s first 200mm SOI wafers based on Soitec‘s Smart CutTM manufacturing technology (read the press release here). Samples will be going to customers in the coming weeks for qualification, with high-volume ramp planned for early 2016. Simgui will be selling the wafers directly to its own customers in China, and […]

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Great line-up planned for IEEE S3S (SOI, 3D and low-voltage — 5-8 October, Sonoma, CA). Advance Program available. Registration still open. Thumbnail

Great line-up planned for IEEE S3S (SOI, 3D and low-voltage — 5-8 October, Sonoma, CA). Advance Program available. Registration still open.

Posted by on September 10, 2015
In Conferences, In & Around Our Industry
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Now in its third year, the 2015 IEEE S3S Conference has evolved into the premier venue for sharing the latest and most important findings in the areas of process integration, advanced materials & materials processing, and device and circuit design for SOI, 3D and low-voltage microelectronics. World-class leading experts in their fields will come to […]

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Go! FD-SOI Wafer Suppliers Ready for High-Volume Ramp; Atomic-Scale Uniformity Assured Thumbnail

Go! FD-SOI Wafer Suppliers Ready for High-Volume Ramp; Atomic-Scale Uniformity Assured

Posted by on July 21, 2015
In Design & Manufacturing, Editor's Blog
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With the great news about FD-SOI foundry offerings from Samsung, ST and now GlobalFoundries, plus the IP availability, the wafer suppliers have chimed in to remind the ecosystem they’re ready to ramp (and have been for a number of years!). So the wafers are ready (and they truly are amazing), the processes ensuring high yield […]

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Soitec Appoints New CFO

Posted on July 14, 2015
In Industry Buzz
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SOI-wafer leader Soitec has appointed Grégoire Duban as Chief Financial Officer. This recruitment supports the ongoing strategic refocusing of the Group’s activities on its core electronics business, as Soitec announced on January 19 (read full press release here). Duban will report directly to Soitec CEO Paul Boudre. “Grégoire Duban possesses over 18 years’ experience in […]

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X-Fab Interview: SOI Solutions for analog/mixed-signal, high-voltage, high-temperature and MEMS Applications Thumbnail

X-Fab Interview: SOI Solutions for analog/mixed-signal, high-voltage, high-temperature and MEMS Applications

Posted by on May 29, 2015
In Design & Manufacturing, News & Viewpoints
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With five manufacturing sites around the world and 72,000 wafer starts/month, X-Fab is a leading pure-play analog/mixed-signal and specialty foundry for automotive, industrial and medical applications. ASN recently had the opportunity to talk to Tilman Metzger, Product Marketing Manager for the X-Fab Group, about when customers choose an SOI-based offering. Advanced Substrate News (ASN): Can […]

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IBM Photonics (That’s SOI!) Ready for Cloud, Big Data Apps Thumbnail

IBM Photonics (That’s SOI!) Ready for Cloud, Big Data Apps

Posted on May 14, 2015
In Industry Buzz
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For the first time, IBM engineers have designed and tested a fully integrated wavelength multiplexed silicon photonics chip, which the company says will soon enable manufacturing of 100 Gb/s optical transceivers (read the press release here). This will allow datacenters to offer greater data rates and bandwidth for cloud computing and Big Data applications. Early in the program (back […]

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