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Soitec receives Sony’s Best Partnership Award for its support with RF-SOI substrates Thumbnail

Soitec receives Sony’s Best Partnership Award for its support with RF-SOI substrates

Posted on October 17, 2014
In Industry Buzz
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SOI wafer leader Soitec was awarded the Best Partnership Award by Sony Semiconductor. Soitec earned the recognition for outstanding support that has contributed to Sony’s success in the RF semiconductor market. Soitec’s high-resistivity silicon-on-insulator (HR-SOI) wafers have long been a favorite of RF designers for 2G and 3G switches. But the company’s latest eSi substrates […]

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TowerJazz — Interview With SVP Marco Racanelli: What’s Driving Strong SOI-Based Design Wins? Thumbnail

TowerJazz — Interview With SVP Marco Racanelli: What’s Driving Strong SOI-Based Design Wins?

Posted on September 11, 2014
In Design & Manufacturing, News & Viewpoints
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            ASN recently spoke with TowerJazz SVP Marco Racanelli about when the specialty foundry leverages SOI – and why. Advanced Substrate News (ASN): Can you tell us briefly about TowerJazz’s overall vision and position in the market?  Marco Racanelli (MR):  TowerJazz is the foundry leader for the manufacture of specialty […]

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Murata to Acquire RF-SOI Pioneer Peregrine Semi

Posted on September 1, 2014
In Industry Buzz
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Murata and Peregrine Semiconductor have entered into a definitive agreement under which Murata will acquire all outstanding shares of Peregrine not owned by Murata (read full press release here). Peregrine will become a wholly owned subsidiary of Murata and continue with its current business model of solving the world’s toughest RF challenges. Peregrine supplies many […]

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ST’s Integrated RF-SOI for Front-End Modules: Why Designers Like It Thumbnail

ST’s Integrated RF-SOI for Front-End Modules: Why Designers Like It

Posted by on August 21, 2014
In Design & Manufacturing, News & Viewpoints
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RF-SOI is good for more than integrating RF switches.  Other key functions typically found inside RF Front-End Modules (FEM) like power amplifiers (PA), RF Energy Management, low-noise amplifiers (LNA), and passives also benefit from integration. Last year, ST announced a monolithic approach with a new RF-SOI process called H9SOI_FEM that allows the integration of all […]

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Peregrine and RFMD Settle All Outstanding RF-SOI Litigation

Posted on August 8, 2014
In Industry Buzz
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In RF-SOI news, Peregrine and RFMD announced that they have settled all outstanding claims between the companies (read press release here). The two companies have entered into patent cross licenses and have agreed to dismiss all related litigation. “We are pleased that we have reached agreement with RF Micro Devices and resolved all of our […]

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New SOI Textbook (and e-book) with contributions by experts at Soitec, GF, TSMC, Leti and more Thumbnail

New SOI Textbook (and e-book) with contributions by experts at Soitec, GF, TSMC, Leti and more

Posted on August 8, 2014
In Industry Buzz
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A new book entitled Silicon-On-Insulator (SOI) Technology, Manufacture and Applications (1st Edition) features contributions by experts at Soitec, GF, TSMC, Leti and more. Billed as “a complete review of this rapidly growing high-speed, low-power semiconductor technology,” the book covers the entire SOI spectrum, from Moore to More than Moore.  It goes into SOI wafer technology,  […]

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Soitec’s Shipped Enough eSI RF-SOI Substrates to Make over 1.4 Billion Devices Thumbnail

Soitec’s Shipped Enough eSI RF-SOI Substrates to Make over 1.4 Billion Devices

Posted on July 18, 2014
In Industry Buzz
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Soitec estimates that it has shipped enough of its eSI wafers to fabricate more than 1.4 billion RF front-end semiconductor devices. (Read the press release here.)  The proprietary Enhanced Signal Integrity™ (eSI) substrates are now the substrate of choice for manufacturing cost-effective and high-performance radio-frequency (RF) devices providing a power boost for 4G /LTE applications. […]

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TowerJazz Releases Enhanced RF-SOI CMOS Process Design Kit for use with Agilent Technologies’ Advanced Design System Software

Posted on June 17, 2014
In Industry Buzz
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Specialty foundry TowerJazz announced the availability of an enhanced RF-SOI CMOS process design kit (PDK) for its 0.18µm process technology (see press release here). The kit was developed for use with Agilent Technologies’ Advanced Design System (ADS) software and targets a wide range of analog markets including front-end modules for mobile phones, tablets and WiFi […]

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Interview: Peregrine’s new Marketing VP on Global 1®, RF-SOI drivers, UltraCMOS 10 Thumbnail

Interview: Peregrine’s new Marketing VP on Global 1®, RF-SOI drivers, UltraCMOS 10

Posted on April 25, 2014
In Design & Manufacturing, End-User Apps
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Interview with : Duncan Pilgrim, VP of marketing ASN had a chance to catch up with Duncan Pilgrim, Peregrine Semi’s new VP of Marketing. Here he shares insights into the company’s new reconfigurable RF front end. Duncan Pilgrim is the VP of marketing at Peregrine Semiconductor. A 17-year semiconductor industry veteran, he previously served as VP […]

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RF-SOI Powerhouse Peregrine Introduces UltraCMOS® Global 1 Reconfigurable RF Front-End System Thumbnail

RF-SOI Powerhouse Peregrine Introduces UltraCMOS® Global 1 Reconfigurable RF Front-End System

Posted on February 7, 2014
In Industry Buzz
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Peregrine’s UltraCMOS® Global 1, the first reconfigurable RFFE system, includes a multimode, multiband power amplifier, post-PA switch, antenna switch and antenna tuner on a single chip. (Image courtesy: Peregrine Semiconductor) RF-SOI powerhouse Peregrine Semiconductor has announced the Global 1 (press release here), billed as “the industry’s first reconfigurable RF front-end system”.  The company says it […]

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