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It’s Official! GlobalFoundries Launches 22FDX: 22nm FD-SOI in 4 flavors Thumbnail

It’s Official! GlobalFoundries Launches 22FDX: 22nm FD-SOI in 4 flavors

Posted by on July 14, 2015
In Design & Manufacturing, Editor's Blog
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With much fanfare, GlobalFoundries has officially announced its 22nm FD-SOI offering. Dubbed “22FDX™”, GF says the platform delivers FinFET-like performance and energy-efficiency at a cost comparable to 28nm planar, targeting mainstream mobile, IoT, RF connectivity and networking markets. Asked by EETimes why FD-SOI here and now, GF’s CEO Sanjay Jha responded, “The mass market is […]

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Peregrine Semi Introduces Industry’s First 300mm RF-SOI Platform Thumbnail

Peregrine Semi Introduces Industry’s First 300mm RF-SOI Platform

Posted on July 14, 2015
In Industry Buzz
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RF-SOI champion Peregrine Semiconductor has introduced the industry’s first 300mm RF-SOI technology. Dubbed UltraCMOS® 11, it is built on GlobalFoundries’ 130 nm 300mm RF technology platform (read full press release here). The UltraCMOS 11 platform will be the foundation for Peregrine’s high volume mobile products and SOI products for other applications. It builds on the […]

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Qorvo’s New SOI Components landing major wins at cellular base station manufacturers

Posted on July 6, 2015
In Industry Buzz
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Qorvo recently announced that new high-performance SOI components are landing major wins at cellular base station manufacturers. (Read the press release here.) Ideal for broadband communications systems, the highly integrated components significantly reduce external components while lowering cost, power consumption, and weight in wireless infrastructure, test and measurement, and defense and aerospace applications. (Qorvo was […]

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Soitec and SITRI team up on RF-SOI, LTE-A/5G for China and more Thumbnail

Soitec and SITRI team up on RF-SOI, LTE-A/5G for China and more

Posted on June 12, 2015
In Industry Buzz
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SOI wafer leader Soitec and SITRI (aka Shanghai Industrial µTechnology Research Institute) have announced a collaboration agreement. (Read the press release here.) They say the strategic partnership will strengthen their leadership in high-growth wireless communications and the global market for RF apps, with a special emphasis on the fast-developing Chinese RF ecosystem. They’ll focus on […]

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Latest Peregrine RF-SOI University webinar addresses Linearity Thumbnail

Latest Peregrine RF-SOI University webinar addresses Linearity

Posted on May 29, 2015
In Industry Buzz
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RF-SOI specialist Peregrine continues to expand its “SOI University” series of webinars (click here to see the full offering), which has been ongoing for five years now. The latest webinar (the fifteenth in the series) is entitled, Linearity: The Key to Successful Data Transmission in Cable & Beyond. It is presented by Peter Bacon, the […]

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IEEE SOI-3D-Subthreshold Conference (S3S, Oct. Sonoma, CA) Welcoming Papers til mid-May Thumbnail

IEEE SOI-3D-Subthreshold Conference (S3S, Oct. Sonoma, CA) Welcoming Papers til mid-May

Posted by on April 27, 2015
In Conferences
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The IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (IEEE S3S) is welcoming papers until May 18, 2015. Last year, the second edition of the IEEE S3S conference, founded upon the co-location of the IEEE International SOI Conference and the IEEE Subthreshold Microelectronics Conference was a great success targetting key topics and attracting even more participants than […]

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New All-CMOS RF-SOI Front-End Solution from Peregrine/Murata First to Integrate Filters and Module Capabilities Thumbnail

New All-CMOS RF-SOI Front-End Solution from Peregrine/Murata First to Integrate Filters and Module Capabilities

Posted on March 27, 2015
In Industry Buzz
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Peregrine Semiconductor and Murata have launched the 2015 UltraCMOS® Global 1 Initiative, which includes the UltraCMOS Global 1 PE56500 and seamlessly integrates Murata filters and packaging into the RF-SOI front-end solution. (See press release here.) Built on Peregrine’s UltraCMOS 10 technology, the PE56500 combines Peregrine’s proven RF-SOI switch and tuner technology with new CMOS PA […]

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How SOI wafers for RF predict LTE-A/5G device performance Thumbnail

How SOI wafers for RF predict LTE-A/5G device performance

Posted by and on February 17, 2015
In Design & Manufacturing, SOI In Action
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Soitec has developed an innovative metrology and metric for ensuring that devices built on our latest SOI wafers for RF will meet the draconian demands of LTE-Advanced (LTE-A) and 5G network standards. For smartphones and tablets to handle LTE-A and 5G, they need RF devices with much higher linearity than those running over the current […]

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LTE-A/5G: Bring it on.  Next-gen Soitec eSI90 wafers predict & improve RF performance. Thumbnail

LTE-A/5G: Bring it on. Next-gen Soitec eSI90 wafers predict & improve RF performance.

Posted by on February 2, 2015
In Design & Manufacturing, Editor's Blog
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The folks at SOI wafer maker Soitec have announced an amazing update to their RF wafer line-up, with what they’re calling their eSI90 substrate (read the press release here). As you might expect, it improves on their terrifically successful line of substrates for the RF chips in smartphones and other mobile devices. And now with […]

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Simgui gets exclusive on distribution of Soitec 200mm SOI wafers in China

Posted on December 9, 2014
In Industry Buzz
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Under a new agreement, Simgui now has the exclusive right to promote, distribute and sell Soitec’s 200-mm SOI wafers in China (see press release in English here; Chinese version here). Soitec is the world’s leading producer of SOI wafers. Shanghai Simgui Technology Co., Ltd. (Simgui), a Shanghai-based semiconductor materials company, is a spinoff of the Shanghai Institute […]

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