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Archive of RF SOI

New Chips and Design Wins for RF-SOI Pioneer Peregrine Semi Thumbnail

New Chips and Design Wins for RF-SOI Pioneer Peregrine Semi

Posted on April 29, 2016
In Industry Buzz
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From RF-SOI pioneer Peregrine Semi comes a steady stream of new chips and design wins. News include: Two UltraCMOS® MPAC–Doherty products—the PE46130 and PE46140 (press release here). These monolithic phase and amplitude controllers (MPAC) join the PE46120 in offering maximum phase-tuning flexibility for Doherty power amplifier (PA) optimization. Designed for the LTE and LTE-A wireless-infrastructure […]

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San Jose Symposium: It Was an Epic Day for FD-SOI – Now Dubbed “The Smart Path to Success” [Part 1 of 2] Thumbnail

San Jose Symposium: It Was an Epic Day for FD-SOI – Now Dubbed “The Smart Path to Success” [Part 1 of 2]

Posted by on April 25, 2016
In Conferences, Editor's Blog
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The #1 take-away message from the recent FD-SOI Symposium in San Jose is that “FD-SOI is the smart path to success”. With presentations echoing that theme by virtually all the major players – including (finally!) ARM – to a packed house, it really was an epic day for the FD-SOI ecosystem. The presentations are now […]

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GF’s New RF-SOI PDK Simplifies Design for Smartphones, IoT Thumbnail

GF’s New RF-SOI PDK Simplifies Design for Smartphones, IoT

Posted on April 7, 2016
In Industry Buzz
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GlobalFoundries recently announced availability of a new set of RF-SOI PDKs for the company’s 7SW SOI technology. GF, which has now delivered more than 20 billion RF-SOI chips for the world’s smartphones, tablets and more, notes that its 7SW SOI technology is optimized for multi-band RF switching in next-generation smartphones. It is also poised to […]

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Shanghai & Grenoble tech dev powerhouses team up on SOI for IoT in China and global innovation ecosystem Thumbnail

Shanghai & Grenoble tech dev powerhouses team up on SOI for IoT in China and global innovation ecosystem

Posted on April 5, 2016
In Industry Buzz
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Three of the world’s More-than-Moore and SOI technology development powerhouses have signed a comprehensive agreement for ongoing collaboration and cooperation in developing new technologies for the emerging IoT market. SITRI of Shanghai, and CEA-Leti and Minatec of Grenoble will work together to accelerate the adoption of their latest technologies and create a global innovation ecosystem […]

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New modeling tool dramatically improves RF-SOI design productivity

Posted on March 31, 2016
In Industry Buzz
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Coupling Wave Solutions (CWS) has a new productivity tool called SiPEX, which enables RF-SOI designers to increase the number of design iterations—including Spice simulation—up to 10 times in the same time frame. “With SiPEX, RF switch designers will be able to make their design changes in less than 15 minutes and obtain a few decibels […]

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RF-SOI – Foundries Weigh In On New 300mm Wafers for 4G/LTE-A, 5G and IoT. Plus a Look at the Innovation Pipeline – Part 2 of 2 Thumbnail

RF-SOI – Foundries Weigh In On New 300mm Wafers for 4G/LTE-A, 5G and IoT. Plus a Look at the Innovation Pipeline – Part 2 of 2

Posted by on March 23, 2016
In Design & Manufacturing, Editor's Blog
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As you may have read in the first part of this series, Soitec (the industry’s leading supplier of SOI wafers) says its 200mm RF-SOI wafers have been used to produce over 20 billion chips, and the company is now in high-volume manufacturing of a 300mm version of its wildly successful RFeSI line (see press release […]

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Reminder re: top SOI Conference – IEEE S3S ’16 (SOI/3D/SubVt) CFP deadline April 15th. Keynotes: NXP, Skyworks, Qualcomm Thumbnail

Reminder re: top SOI Conference – IEEE S3S ’16 (SOI/3D/SubVt) CFP deadline April 15th. Keynotes: NXP, Skyworks, Qualcomm

Posted on March 23, 2016
In Industry Buzz
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Don’t forget to get your paper submitted to the top conference with a major focus on the SOI ecosystem: the IEEE S3S (SOI/3D/SubVt). The Call For Papers (CFP) deadline is April 15, 2016. As we noted for you in ASN back in December, the theme of the conference, which will take place October 10th – […]

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Now also on 300mm wafers and headed for 5G and IoT, RF-SOI’s going strong and stronger (>20 billion chips to date) – Part 1 of 2 Thumbnail

Now also on 300mm wafers and headed for 5G and IoT, RF-SOI’s going strong and stronger (>20 billion chips to date) – Part 1 of 2

Posted by on March 18, 2016
In Design & Manufacturing, Editor's Blog
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Soitec, the industry’s leading supplier of SOI wafers recently announced it’s in high-volume manufacturing of a 300mm version of its wildly successful RFeSI line (see press release here). What’s it all about? FEMs. RF front-end module – aka FEM – chips handle the back-and-forth of signals between the transceiver and the antenna. FEMs built on […]

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China Design Conference (April 2016) Adds RF-SOI Design Track Thumbnail

China Design Conference (April 2016) Adds RF-SOI Design Track

Posted on March 18, 2016
In Industry Buzz
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EDI CON China 2016, taking place April 19-21 in Beijing at the China National Convention Center (CNCC) will feature a keynote talk by GlobalFoundries‘ Peter Rabbeni, Sr. Director, RF BU Business Development & Product Marketing. The talk, entitled, “RF SOI: Revolutionizing Radio Design Today and Driving Innovation for Tomorrow”, will kick off the newly added RF-SOI […]

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Latest RF-SOI Chip from Peregrine targets wired broadband apps Thumbnail

Latest RF-SOI Chip from Peregrine targets wired broadband apps

Posted on February 12, 2016
In Industry Buzz
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RF-SOI pioneer Peregrine Semiconductor has announced the UltraCMOS® PE4314, a 75-ohm glitch-less RF digital step attenuator (DSA). This new DSA extends Peregrine’s existing glitch-less DSA portfolio to 75 ohms. The PE4314 is ideal for wired broadband applications in cable/satellite customer premises equipment (CPE) and infrastructure equipment. “As the founders of RF-SOI, Peregrine is recognized as a […]

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