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Semicon Europa ’14 (Grenoble, 7-9 October) Includes Top Speakers at Conferences on Low Power, 3DI, Power Electronics & more Thumbnail

Semicon Europa ’14 (Grenoble, 7-9 October) Includes Top Speakers at Conferences on Low Power, 3DI, Power Electronics & more

Posted by on September 26, 2014
In Conferences, Editor's Blog
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  For the first time ever, Semicon Europa will be held in Grenoble this year, and FD-SOI will be a major part of it (website link here). With more than 5000 visitors and 350 exhibitors, Semicon Europa is the greatest annual event for the European microelectronics industry. And Grenoble can fairly be considered the epicenter of […]

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TowerJazz — Interview With SVP Marco Racanelli: What’s Driving Strong SOI-Based Design Wins? Thumbnail

TowerJazz — Interview With SVP Marco Racanelli: What’s Driving Strong SOI-Based Design Wins?

Posted on September 11, 2014
In Design & Manufacturing, News & Viewpoints
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            ASN recently spoke with TowerJazz SVP Marco Racanelli about when the specialty foundry leverages SOI – and why. Advanced Substrate News (ASN): Can you tell us briefly about TowerJazz’s overall vision and position in the market?  Marco Racanelli (MR):  TowerJazz is the foundry leader for the manufacture of specialty […]

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FD-SOI: The Best Enabler for Mobile Growth and Innovation Thumbnail

FD-SOI: The Best Enabler for Mobile Growth and Innovation

Posted by on August 8, 2014
In Design & Manufacturing, News & Viewpoints, SOI In Action
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The following in-depth analysis, an IBS study entitled How FD-SOI will Enable Innovation and Growth in Mobile Platform Sales, concludes that the benefits of FD-SOI are overwhelming for mobile platforms through Q4/2017 based on a number of key metrics. In fact, FD-SOI has the ability to support three technology nodes, which can mean a useful […]

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Interview: Leti CEO Malier on the FD-SOI Breakthrough; Leti Days in Grenoble (24-26 June) & Semicon West Thumbnail

Interview: Leti CEO Malier on the FD-SOI Breakthrough; Leti Days in Grenoble (24-26 June) & Semicon West

Posted by on June 17, 2014
In Design & Manufacturing, Editor's Blog, News & Viewpoints
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Some years back, European research giant CEA-Leti made a major commitment to support FD-SOI, partnering with STMicroelectronics, Soitec and IBM.  Now, with the big FD-SOI foundry announcement by Samsung and STMicroelectronics, Leti’s ready to bring its vast expertise to players throughout the value chain, right up through design integration. To learn more about the range […]

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Soitec and Simgui (China) Partner on SOI Wafer Production for RF and Power Apps

Posted on May 28, 2014
In Industry Buzz
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Soitec and Simgui (Shanghai, China) are partnering on SOI wafer production for RF and power applications. The newly signed deal (read press release here) includes a licensing and technology transfer agreement. Simgui will establish a high-volume SOI manufacturing line using Soitec’s proprietary Smart Cut™ technology to directly supply the Chinese market. In addition, Simgui will […]

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SOI – 3D Integration – Subthreshold Microelectronics: Register now for the IEEE S3S! Thumbnail

SOI – 3D Integration – Subthreshold Microelectronics: Register now for the IEEE S3S!

Posted by (ARM) on September 13, 2013
In Conferences
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Last May, we already let you know about the IEEE S3S conference, founded upon the co-location of The IEEE International SOI Conference and the IEEE Subthreshold Microelectronics Conference, completed by an additional track on 3D Integration. Today, we would like let you know that the advance program is available, and to attract your attention on […]

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PCMag’s Michael Miller called IBM’s 22nm SOI Power8 “the most fascinating” of the high-end processors Thumbnail

PCMag’s Michael Miller called IBM’s 22nm SOI Power8 “the most fascinating” of the high-end processors

Posted on August 31, 2013
In Industry Buzz
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PCMag’s Michael Miller called IBM’s 22nm SOI Power8 “the most fascinating” of the high-end processors. Reporting on this year’s Hot Chips conference, presented there. He noted that the chip “will have 12 cores, each capable of running up to eight threads, with 512KB of SRAM Level 2 cache per core (6MB total L2) and 96MB […]

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ST’s FD-SOI Wins EETimes ACE Award… and Customers! Thumbnail

ST’s FD-SOI Wins EETimes ACE Award… and Customers!

Posted by on May 2, 2013
In Editor's Blog
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Two important FD-SOI wins for STMicroelectronics have just been announced: The EETimes ACE Award for Energy Technology; Customers. The Energy Technology Award was presented at a ceremony for the 2013 Annual Creativity in Electronics (ACE) Awards. It is given by EETimes and EDN, two of the most prominent trade-media sources in electronics. The ACE Awards […]

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DARPA reports that a team of researchers at the University of Southern California and Columbia University has achieved output power levels of nearly 0.5W at 45 GHz with a 45nm SOI CMOS chip Thumbnail

DARPA reports that a team of researchers at the University of Southern California and Columbia University has achieved output power levels of nearly 0.5W at 45 GHz with a 45nm SOI CMOS chip

Posted on April 12, 2013
In Industry Buzz
Tagged with , , , , , , , , ,

DARPA reports that a team of researchers at the University of Southern California and Columbia University has achieved output power levels of nearly 0.5W at 45 GHz with a 45nm SOI CMOS chip. This world record result for CMOS-based power amplifiers doubles output power compared to the next best reported CMOS millimeter-wave power amplifier. The […]

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Wafer Leaders Extend Basis for Global SOI Supply Thumbnail

Wafer Leaders Extend Basis for Global SOI Supply

Posted by on October 10, 2012
In ASN #20, Editor's Blog, In & Around Our Industry
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It’s a bright green light from the world leaders in SOI wafer capacity. Soitec, the world leader in SOI wafer production, and long-time partner Shin-Etsu Handatai (SEH), the world’s biggest producer of silicon wafers, have extended their licensing agreement and expanded their technology cooperation. SEH is a $12.7 billion company, supplying over 20% of the […]

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