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Interview: Leti CEO Malier on the FD-SOI Breakthrough; Leti Days in Grenoble (24-26 June) & Semicon West Thumbnail

Interview: Leti CEO Malier on the FD-SOI Breakthrough; Leti Days in Grenoble (24-26 June) & Semicon West

Posted by on June 17, 2014
In Design & Manufacturing, Editor's Blog, News & Viewpoints
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Some years back, European research giant CEA-Leti made a major commitment to support FD-SOI, partnering with STMicroelectronics, Soitec and IBM.  Now, with the big FD-SOI foundry announcement by Samsung and STMicroelectronics, Leti’s ready to bring its vast expertise to players throughout the value chain, right up through design integration. To learn more about the range […]

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Soitec and Simgui (China) Partner on SOI Wafer Production for RF and Power Apps

Posted on May 28, 2014
In Industry Buzz
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Soitec and Simgui (Shanghai, China) are partnering on SOI wafer production for RF and power applications. The newly signed deal (read press release here) includes a licensing and technology transfer agreement. Simgui will establish a high-volume SOI manufacturing line using Soitec’s proprietary Smart Cut™ technology to directly supply the Chinese market. In addition, Simgui will […]

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SOI – 3D Integration – Subthreshold Microelectronics: Register now for the IEEE S3S! Thumbnail

SOI – 3D Integration – Subthreshold Microelectronics: Register now for the IEEE S3S!

Posted by (ARM) on September 13, 2013
In Conferences
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Last May, we already let you know about the IEEE S3S conference, founded upon the co-location of The IEEE International SOI Conference and the IEEE Subthreshold Microelectronics Conference, completed by an additional track on 3D Integration. Today, we would like let you know that the advance program is available, and to attract your attention on […]

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PCMag’s Michael Miller called IBM’s 22nm SOI Power8 “the most fascinating” of the high-end processors Thumbnail

PCMag’s Michael Miller called IBM’s 22nm SOI Power8 “the most fascinating” of the high-end processors

Posted on August 31, 2013
In Industry Buzz
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PCMag’s Michael Miller called IBM’s 22nm SOI Power8 “the most fascinating” of the high-end processors. Reporting on this year’s Hot Chips conference, presented there. He noted that the chip “will have 12 cores, each capable of running up to eight threads, with 512KB of SRAM Level 2 cache per core (6MB total L2) and 96MB […]

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ST’s FD-SOI Wins EETimes ACE Award… and Customers! Thumbnail

ST’s FD-SOI Wins EETimes ACE Award… and Customers!

Posted by on May 2, 2013
In Editor's Blog
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Two important FD-SOI wins for STMicroelectronics have just been announced: The EETimes ACE Award for Energy Technology; Customers. The Energy Technology Award was presented at a ceremony for the 2013 Annual Creativity in Electronics (ACE) Awards. It is given by EETimes and EDN, two of the most prominent trade-media sources in electronics. The ACE Awards […]

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DARPA reports that a team of researchers at the University of Southern California and Columbia University has achieved output power levels of nearly 0.5W at 45 GHz with a 45nm SOI CMOS chip Thumbnail

DARPA reports that a team of researchers at the University of Southern California and Columbia University has achieved output power levels of nearly 0.5W at 45 GHz with a 45nm SOI CMOS chip

Posted on April 12, 2013
In Industry Buzz
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DARPA reports that a team of researchers at the University of Southern California and Columbia University has achieved output power levels of nearly 0.5W at 45 GHz with a 45nm SOI CMOS chip. This world record result for CMOS-based power amplifiers doubles output power compared to the next best reported CMOS millimeter-wave power amplifier. The […]

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Wafer Leaders Extend Basis for Global SOI Supply Thumbnail

Wafer Leaders Extend Basis for Global SOI Supply

Posted by on October 10, 2012
In ASN #20, Editor's Blog, In & Around Our Industry
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It’s a bright green light from the world leaders in SOI wafer capacity. Soitec, the world leader in SOI wafer production, and long-time partner Shin-Etsu Handatai (SEH), the world’s biggest producer of silicon wafers, have extended their licensing agreement and expanded their technology cooperation. SEH is a $12.7 billion company, supplying over 20% of the […]

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NXP has named SOI wafer-leader Soitec as this year’s recipient of the “Best Supplier – Valued Partnership” for the company’s SOI solutions

Posted on October 9, 2012
In Industry Buzz
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NXP has named SOI wafer-leader Soitec as this year’s recipient of the “Best Supplier – Valued Partnership” for the company’s SOI solutions. NXP uses Soitec’s wafers in many of its most successful products for high-volume markets including power, automotive and lighting. The two companies have worked together since 1995.

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Spotlight on FD-SOI & FinFETs at Upcoming IEEE SOI Conference<br />(1-4 Oct. in Napa – register by 17 Sept. for best rate) Thumbnail

Spotlight on FD-SOI & FinFETs at Upcoming IEEE SOI Conference
(1-4 Oct. in Napa – register by 17 Sept. for best rate)

Posted on September 14, 2012
In Editor's Blog
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The 38th annual SOI Conference is coming up in just a few weeks. Sponsored by IEEE Electron Devices Society, this is the only dedicated SOI conference covering the full technology chain from materials to devices, circuits and system applications. Chaired this year by Gosia Jurczak (manager of the Memories Program at imec), this excellent conference […]

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NovaThor SmartPhone Chip on 28nm FD-SOI: ST-Ericsson Blogger Tells All; PC Mag Sees Light Thumbnail

NovaThor SmartPhone Chip on 28nm FD-SOI: ST-Ericsson Blogger Tells All; PC Mag Sees Light

Posted by on May 30, 2012
In Editor's Blog
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To paraphrase the song, “What a difference a day would make.”  Searching to plug into the nearest power strip each afternoon, active smartphone users would certainly agree with that. But ST-Ericsson’s next-gen NovaThor chips on 28nm FD-SOI (available for design now), which are looking to get an extra day out of your battery, should put […]

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