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RF-SOI Powerhouse Peregrine Introduces UltraCMOS® Global 1 Reconfigurable RF Front-End System Thumbnail

RF-SOI Powerhouse Peregrine Introduces UltraCMOS® Global 1 Reconfigurable RF Front-End System

Posted on February 7, 2014
In Industry Buzz
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Peregrine’s UltraCMOS® Global 1, the first reconfigurable RFFE system, includes a multimode, multiband power amplifier, post-PA switch, antenna switch and antenna tuner on a single chip. (Image courtesy: Peregrine Semiconductor) RF-SOI powerhouse Peregrine Semiconductor has announced the Global 1 (press release here), billed as “the industry’s first reconfigurable RF front-end system”.  The company says it […]

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SOI: Looking Back Over a Year of Moving Forward (Part 2, RF-SOI & SOI-FinFETs) Thumbnail

SOI: Looking Back Over a Year of Moving Forward (Part 2, RF-SOI & SOI-FinFETs)

Posted by on January 17, 2014
In Editor's Blog, News & Viewpoints
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As we noted in the previous post (click here if you missed it), 2014 should be a terrific year for the greater SOI community. But before we look forward (which we’ll do in an upcoming post), let’s continue considering where we’ve been and some of the highlights of the last year.  In fact, there was […]

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Peregrine Ships 2 Billionth UltraCMOS Chip, Signs with GlobalFoundries,  Celebrates 25 Years of RF-SOI Thumbnail

Peregrine Ships 2 Billionth UltraCMOS Chip, Signs with GlobalFoundries, Celebrates 25 Years of RF-SOI

Posted on November 4, 2013
In Industry Buzz
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Peregrine Semiconductor announced that it has shipped its 2 billionth chip, released version 10 of its UltraCMOS RF-SOI technology, and is working with GlobalFoundries. UltraCMOS technology is an advanced RF-SOI process, the latest versions of which leverage bonded silicon-on-sapphire (BSOS) substrates from Soitec. Peregrine did an excellent article for ASN last spring, clearly explaining the use […]

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Toshiba Says New RF-SOI Antenna Switch for Smartphones Is Smallest Thumbnail

Toshiba Says New RF-SOI Antenna Switch for Smartphones Is Smallest

Posted by on October 14, 2013
In Design & Manufacturing, Editor's Blog
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Another RF-SOI solution is making headlines. Leveraging SOI, Toshiba has announced an SP10T RF antenna switch for the smartphone market. The company says it achieves the industry’s lowest insertion loss and smallest size. The company credits its new generation TaRF5 process, the latest in its line of Toshiba-original TarfSOI™ (Toshiba advanced RF SOI) processes. The […]

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Peregrine Semi’s RF Chip On Bonded SOS Is Main Antenna Switch in Samsung Galaxy S4 LTE-A  – That’s SOI! Thumbnail

Peregrine Semi’s RF Chip On Bonded SOS Is Main Antenna Switch in Samsung Galaxy S4 LTE-A – That’s SOI!

Posted by on September 26, 2013
In Editor's Blog
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Peregrine has announced that the company’s new UltraCMOS antenna switch is driving RF performance in the Samsung Galaxy S4 LTE-A smartphone. UltraCMOS technology is an advanced RF SOI process leveraging bonded silicon-on-sapphire (BSOS) substrates from Soitec. The new dual SP7T Multiswitch in the Samsung leverages Peregrine’s latest version of its UltraCMOS® process technology, STeP8 for RF […]

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SOI – 3D Integration – Subthreshold Microelectronics: Register now for the IEEE S3S! Thumbnail

SOI – 3D Integration – Subthreshold Microelectronics: Register now for the IEEE S3S!

Posted by (ARM) on September 13, 2013
In Conferences
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Last May, we already let you know about the IEEE S3S conference, founded upon the co-location of The IEEE International SOI Conference and the IEEE Subthreshold Microelectronics Conference, completed by an additional track on 3D Integration. Today, we would like let you know that the advance program is available, and to attract your attention on […]

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Design wins in smartphones from LG and Pantech are among the many announcements from Peregrine Semi over the last three months Thumbnail

Design wins in smartphones from LG and Pantech are among the many announcements from Peregrine Semi over the last three months

Posted on August 30, 2013
In Industry Buzz
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Design wins in smartphones from LG and Pantech are among the many announcements from Peregrine Semi over the last three months. These are thanks to the latest version of its UltraCMOS® process technology, STeP8 for RF Front End ICs. (The UltraCMOS technology is an advanced RF SOI process leveraging bonded silicon-on-sapphire (BSOS) substrates from Soitec.) […]

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In the three months following Peregrine Semi’s announcement of the latest version of its UltraCMOS® process technology, the company has followed with a steady stream of news Thumbnail

In the three months following Peregrine Semi’s announcement of the latest version of its UltraCMOS® process technology, the company has followed with a steady stream of news

Posted on May 31, 2013
In Industry Buzz
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In the three months following Peregrine Semi’s announcement of the latest version of its UltraCMOS® process technology, STeP8 for RF Front End ICs, the company has followed with a steady stream of news. (The UltraCMOS technology is an advanced RF SOI process leveraging bonded silicon-on-sapphire (BSOS) substrates from Soitec.) Recent announcements include: a collaborative sourcing […]

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Peregrine’s UltraCMOS® Semiconductor Technology Platforms: A Rapid Advancement of Process & Manufacturing Thumbnail

Peregrine’s UltraCMOS® Semiconductor Technology Platforms: A Rapid Advancement of Process & Manufacturing

Posted by (Peregrine Semiconductor) on May 27, 2013
In Design & Manufacturing, In & Around Our Industry, SOI In Action
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For more than 20 years, Silicon-on-Sapphire (SOS) technology—an advanced form of Silicon-on-Insulator (SOI) processing—has been used in semiconductor manufacturing. Recently, SOS in the form of UltraCMOS® technology has been designed into high-volume applications that have made it the technology of choice for several demanding RF applications. This technology combines a highly resistive substrate with CMOS […]

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Peregrine has announced the latest version of UltraCMOS® process technology-Semiconductor Technology Platform 8 (STeP8) Thumbnail

Peregrine has announced the latest version of UltraCMOS® process technology-Semiconductor Technology Platform 8 (STeP8)

Posted on March 18, 2013
In Industry Buzz
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Peregrine has announced the latest version of UltraCMOS®  process technology—Semiconductor Technology Platform 8 (STeP8), which the company says enables unmatched performance in RF Front End ICs. STeP8 technology shows a 36% improvement in Ron Coff  performance over STeP5 technology announced just one year ago—dramatically improving the linearity, insertion loss, and isolation capabilities of Peregrine’s RFIC […]

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