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Soitec’s Shipped Enough eSI RF-SOI Substrates to Make over 1.4 Billion Devices Thumbnail

Soitec’s Shipped Enough eSI RF-SOI Substrates to Make over 1.4 Billion Devices

Posted on July 18, 2014
In Industry Buzz
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Soitec estimates that it has shipped enough of its eSI wafers to fabricate more than 1.4 billion RF front-end semiconductor devices. (Read the press release here.)  The proprietary Enhanced Signal Integrity™ (eSI) substrates are now the substrate of choice for manufacturing cost-effective and high-performance radio-frequency (RF) devices providing a power boost for 4G /LTE applications. […]

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TowerJazz Releases Enhanced RF-SOI CMOS Process Design Kit for use with Agilent Technologies’ Advanced Design System Software

Posted on June 17, 2014
In Industry Buzz
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Specialty foundry TowerJazz announced the availability of an enhanced RF-SOI CMOS process design kit (PDK) for its 0.18µm process technology (see press release here). The kit was developed for use with Agilent Technologies’ Advanced Design System (ADS) software and targets a wide range of analog markets including front-end modules for mobile phones, tablets and WiFi […]

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IBM Specialty Foundry Shipped Over 7 Billion RF-SOI Chips in Last 3 Years, Launches New RF-SOI Technology Thumbnail

IBM Specialty Foundry Shipped Over 7 Billion RF-SOI Chips in Last 3 Years, Launches New RF-SOI Technology

Posted on June 17, 2014
In Industry Buzz
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  IBM Foundry Solutions announced a new SOI-based technology for RF called 7SW SOI. The company says it is designed for 30 percent better performance than its predecessor, 7RF SOI, with which IBM shipped over seven billion chips in the last three years. The new mobile phone chip technology can help device manufacturers provide consumers […]

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SiTime Enters Wearables, IoT Markets with 32 kHz SOI-MEMS Thumbnail

SiTime Enters Wearables, IoT Markets with 32 kHz SOI-MEMS

Posted on June 8, 2014
In Industry Buzz
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SiTime, which leverages SOI for high-performance MEMS timing solutions, has introduced what it says is the smallest, lowest power 32 kHz TCXO (temperature compensated oscillator – read the press release here). With its tiny footprint and ultra-low power consumption, the SiT1552 MEMS TCXO enables a paradigm shift in the size and battery life of wearable […]

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Samsung & ST 28nm FD-SOI Is Major Opportunity, Says IBS (EETimes)

Posted on May 28, 2014
In Industry Buzz
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In an EETimes blog, Handel Jones of IBS says that the Samsung-ST FD-SOI announcement represents a major opportunity. (Read full blog here.) “Samsung Electronics has a major opportunity with its large wafer capacity to support low-leakage products with its 28 nm FD-SOI process,” he wrote. “Cadence Design Systems, Synopsys, and Mentor Graphics are all supporting […]

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Peregrine Ships Next-Gen UltraCMOS® 10 RF-SOI Switches for Smartphones

Posted on May 28, 2014
In Industry Buzz
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Peregrine Semi has shipped the first RF switches built on the company’s SOI-based UltraCMOS 10 technology platform. With partner GlobalFoundries, Peregrine also announces the completion of product and process qualification for the advanced RF-SOI technology (see press release here). The 130 nm technology combines the performance of UltraCMOS technology with the economies of SOI, and […]

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Soitec and Simgui (China) Partner on SOI Wafer Production for RF and Power Apps

Posted on May 28, 2014
In Industry Buzz
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Soitec and Simgui (Shanghai, China) are partnering on SOI wafer production for RF and power applications. The newly signed deal (read press release here) includes a licensing and technology transfer agreement. Simgui will establish a high-volume SOI manufacturing line using Soitec’s proprietary Smart Cut™ technology to directly supply the Chinese market. In addition, Simgui will […]

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It’s Samsung! Announcement with ST confirms new tier-1 foundry for faster, cooler, simpler 28nm FD-SOI Thumbnail

It’s Samsung! Announcement with ST confirms new tier-1 foundry for faster, cooler, simpler 28nm FD-SOI

Posted by on May 14, 2014
In Design & Manufacturing, Editor's Blog, News & Viewpoints
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Great news: Samsung and STMicroelectronics have revealed that Samsung is the new 28nm FD-SOI foundry (see the press release here.) Specifically, the two companies announced, “…a comprehensive agreement on 28nm Fully Depleted Silicon-on-Insulator (FD-SOI) technology for multi-source manufacturing collaboration.” The agreement covers ST’s 28nm FD-SOI design platform: the design enablement ecosystem and the process technology. […]

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Soitec Paper on Wafers for RF-SOI Now Available on weSRCH Thumbnail

Soitec Paper on Wafers for RF-SOI Now Available on weSRCH

Posted on May 7, 2014
In Industry Buzz
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A Soitec white paper entitled Innovative RF-SOI Wafers for Wireless Applications is now available on the weSRCH website (see paper here). The paper explains the value of using RF-SOI substrates, and what the latest generation of Soitec’s WaveSOI™ and eSI™ wafers brings to RF IC performance. It also explains how these substrates simplify the IC […]

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Interview: Peregrine’s new Marketing VP on Global 1®, RF-SOI drivers, UltraCMOS 10 Thumbnail

Interview: Peregrine’s new Marketing VP on Global 1®, RF-SOI drivers, UltraCMOS 10

Posted on April 25, 2014
In Design & Manufacturing, End-User Apps
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Interview with : Duncan Pilgrim, VP of marketing ASN had a chance to catch up with Duncan Pilgrim, Peregrine Semi’s new VP of Marketing. Here he shares insights into the company’s new reconfigurable RF front end. Duncan Pilgrim is the VP of marketing at Peregrine Semiconductor. A 17-year semiconductor industry veteran, he previously served as VP […]

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