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FD-SOI/Shanghai Forum – Panel Sees Great Things Coming Thumbnail

FD-SOI/Shanghai Forum – Panel Sees Great Things Coming

Posted by on October 26, 2016
In Conferences, Editor's Blog
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The panel discussion rounding out the day at the recent FD-SOI Forum in Shanghai ended an exciting week (GF’s 12nm FD-SOI & ecosys, Sony’s FD-SOI GPS in the Huami watch) on a decidedly optimistic note. Here’s a quick rundown of some of what was said. (As soon as the presentations given earlier in the day […]

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12nm FD-SOI on the Roadmap for H1/2019 Customer Tape-out! Says GloFo (While Giving 22FDX Ecosys a Great Boost) Thumbnail

12nm FD-SOI on the Roadmap for H1/2019 Customer Tape-out! Says GloFo (While Giving 22FDX Ecosys a Great Boost)

Posted by on September 15, 2016
In Design & Manufacturing, Editor's Blog
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12nm FD-SOI has now officially joined the GlobalFoundries’ roadmap, targeting intelligent, connected systems and beating 14/16nm FinFET on performance, power consumption (by 50%!) and cost (see press release here). Customer product tape-outs are expected to begin in the first half of 2019. GloFo also announced FDXcelerator™, an ecosystem designed to give 22FDX™ SoC design a […]

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San Jose Symposium – Part 2 of 2 in an Epic Day for FD-SOI – the “Disruption Enabler” Right Through 7nm Thumbnail

San Jose Symposium – Part 2 of 2 in an Epic Day for FD-SOI – the “Disruption Enabler” Right Through 7nm

Posted by on April 29, 2016
In Conferences, Editor's Blog
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This is part 2 (of 2) of ASN’s coverage of the epic FD-SOI Symposium in San Jose. In part 1 we looked at the exciting developments happening at 28nm (if you missed it, click here to read it now). Here in part 2, we’ll look at 22nm, covering the presentations by GlobalFoundries, ARM, VLSI Research […]

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New Chips and Design Wins for RF-SOI Pioneer Peregrine Semi Thumbnail

New Chips and Design Wins for RF-SOI Pioneer Peregrine Semi

Posted on April 29, 2016
In Industry Buzz
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From RF-SOI pioneer Peregrine Semi comes a steady stream of new chips and design wins. News include: Two UltraCMOS® MPAC–Doherty products—the PE46130 and PE46140 (press release here). These monolithic phase and amplitude controllers (MPAC) join the PE46120 in offering maximum phase-tuning flexibility for Doherty power amplifier (PA) optimization. Designed for the LTE and LTE-A wireless-infrastructure […]

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San Jose Symposium: It Was an Epic Day for FD-SOI – Now Dubbed “The Smart Path to Success” [Part 1 of 2] Thumbnail

San Jose Symposium: It Was an Epic Day for FD-SOI – Now Dubbed “The Smart Path to Success” [Part 1 of 2]

Posted by on April 25, 2016
In Conferences, Editor's Blog
Tagged with , , , , , , , , , , , , , , , , , , , , , , , , , , , , ,

The #1 take-away message from the recent FD-SOI Symposium in San Jose is that “FD-SOI is the smart path to success”. With presentations echoing that theme by virtually all the major players – including (finally!) ARM – to a packed house, it really was an epic day for the FD-SOI ecosystem. The presentations are now […]

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Implementing ARM Cortex A-series in 22nm FD-SOI – GloFo tech webinar Thumbnail

Implementing ARM Cortex A-series in 22nm FD-SOI – GloFo tech webinar

Posted on April 25, 2016
In Industry Buzz
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Registration is open for GlobalFoundries’ technical webinar, “How to Implement an ARM Cortex-A17 Processor in 22FDX 22nm FD-SOI Technology” (click here to go to the registration page). The webinar will cover the optimal steps to successfully implement ARM® Cortex®-A Series* processors using 22FDXTM 22nm FD-SOI technology. GF Design Enablement Fellow Dr. Joerg Winkler will address: […]

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GF’s New RF-SOI PDK Simplifies Design for Smartphones, IoT Thumbnail

GF’s New RF-SOI PDK Simplifies Design for Smartphones, IoT

Posted on April 7, 2016
In Industry Buzz
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GlobalFoundries recently announced availability of a new set of RF-SOI PDKs for the company’s 7SW SOI technology. GF, which has now delivered more than 20 billion RF-SOI chips for the world’s smartphones, tablets and more, notes that its 7SW SOI technology is optimized for multi-band RF switching in next-generation smartphones. It is also poised to […]

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RF-SOI – Foundries Weigh In On New 300mm Wafers for 4G/LTE-A, 5G and IoT. Plus a Look at the Innovation Pipeline – Part 2 of 2 Thumbnail

RF-SOI – Foundries Weigh In On New 300mm Wafers for 4G/LTE-A, 5G and IoT. Plus a Look at the Innovation Pipeline – Part 2 of 2

Posted by on March 23, 2016
In Design & Manufacturing, Editor's Blog
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As you may have read in the first part of this series, Soitec (the industry’s leading supplier of SOI wafers) says its 200mm RF-SOI wafers have been used to produce over 20 billion chips, and the company is now in high-volume manufacturing of a 300mm version of its wildly successful RFeSI line (see press release […]

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Now also on 300mm wafers and headed for 5G and IoT, RF-SOI’s going strong and stronger (>20 billion chips to date) – Part 1 of 2 Thumbnail

Now also on 300mm wafers and headed for 5G and IoT, RF-SOI’s going strong and stronger (>20 billion chips to date) – Part 1 of 2

Posted by on March 18, 2016
In Design & Manufacturing, Editor's Blog
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Soitec, the industry’s leading supplier of SOI wafers recently announced it’s in high-volume manufacturing of a 300mm version of its wildly successful RFeSI line (see press release here). What’s it all about? FEMs. RF front-end module – aka FEM – chips handle the back-and-forth of signals between the transceiver and the antenna. FEMs built on […]

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China Design Conference (April 2016) Adds RF-SOI Design Track Thumbnail

China Design Conference (April 2016) Adds RF-SOI Design Track

Posted on March 18, 2016
In Industry Buzz
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EDI CON China 2016, taking place April 19-21 in Beijing at the China National Convention Center (CNCC) will feature a keynote talk by GlobalFoundries‘ Peter Rabbeni, Sr. Director, RF BU Business Development & Product Marketing. The talk, entitled, “RF SOI: Revolutionizing Radio Design Today and Driving Innovation for Tomorrow”, will kick off the newly added RF-SOI […]

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