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Archive of MEMS

GF, NXP, Infineon and more at SOI Workshop During Silicon Saxony Day (Dresden, 7 July 2015) Thumbnail

GF, NXP, Infineon and more at SOI Workshop During Silicon Saxony Day (Dresden, 7 July 2015)

Posted on June 12, 2015
In Industry Buzz
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Silicon Europe (an alliance of Europe’s leading micro- and nanoelectronics clusters) and the SOI Consortium have organized an SOI Workshop on the 7th of July 2015, during the 10th Silicon Saxony Day in Dresden. Here’s the agenda: Quick Introduction More than Moore Market Analysis and Opportunities (Yole) Power SOI and applications (NXP) Foundry offer (GlobalFoundries) […]

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X-Fab Interview: SOI Solutions for analog/mixed-signal, high-voltage, high-temperature and MEMS Applications Thumbnail

X-Fab Interview: SOI Solutions for analog/mixed-signal, high-voltage, high-temperature and MEMS Applications

Posted by on May 29, 2015
In Design & Manufacturing, News & Viewpoints
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With five manufacturing sites around the world and 72,000 wafer starts/month, X-Fab is a leading pure-play analog/mixed-signal and specialty foundry for automotive, industrial and medical applications. ASN recently had the opportunity to talk to Tilman Metzger, Product Marketing Manager for the X-Fab Group, about when customers choose an SOI-based offering. Advanced Substrate News (ASN): Can […]

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Shanghai More-Than-Moore Presentations Now Posted on SOI Consortium Website

Posted on April 30, 2015
In Industry Buzz
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Presentations given at the ‘Beyond Computing’ Innovative Technologies Symposium (March 2015 in Shanghai) are now available on the SOI Consortium website (click here to see the list). The Symposium covered MEMS, semiconductor manufacturing, RF and power, which are key topics for the fast growing “More than Moore” industry. The one-day, closed-door symposium was organized by […]

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ASN Celebrates a Decade of SOI News, Views and Commentary Thumbnail

ASN Celebrates a Decade of SOI News, Views and Commentary

Posted by on April 21, 2015
In Editor's Blog
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April 2015 marks the 10-year anniversary of the first ever issue of Advanced Substrate News, aka ASN, covering news and views from the SOI ecosystem. Wow, were we precient. Consider some of the topics we covered in that first edition, back in April of 2005: the Oki FD-SOI chip in the Casio G-Shock watch FinFET […]

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Interview (Leti): How a new platform helps designers get the most out of FD-SOI for IoT, ULP Thumbnail

Interview (Leti): How a new platform helps designers get the most out of FD-SOI for IoT, ULP

Posted on April 9, 2015
In Design & Manufacturing, News & Viewpoints
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A driving force in FD-SOI, Leti recently announced a service called Silicon Impulse®, a new FD-SOI platform for IoT & ultra-low-power (ULP) apps that helps start-ups, SMEs and large companies evaluate, design, prototype & move to volume. Olivier Thomas, who’s in charge of the program and Ali Erdengiz, who’s Business Development Manager for Leti explain […]

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Huge Success of Semicon China: Opportunities in a Fast-Changing Landscape Thumbnail

Huge Success of Semicon China: Opportunities in a Fast-Changing Landscape

Posted by on March 27, 2015
In Editor's Blog
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Semicon China (Shanghai, 17-21 March 2015) was an awe-inspiring event.   The sheer size and the energy were dazzling. But it was the investment plans prompted by the government’s injection of RMB 120 billion (US$19.6 billion) last fall in seed money for the industry with supporting local funds pouring in that was clearly the source of […]

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European R&D Leaders Team on SOI-MEMS Platform for Industry, SME’s Thumbnail

European R&D Leaders Team on SOI-MEMS Platform for Industry, SME’s

Posted on March 27, 2015
In Industry Buzz
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The Heterogeneous Technology Alliance (HTA), a coalition of top European R&D organizations, is offering an SOI-MEMS platform. Looking to bridge the gap between academia and industry, this technological platform pools the SOI-MEMS expertise, capabilities and fabrication facilities of Leti (France), Fraunhofer (Germany), CSEM (Switzerland) and VTT (Finland). The main focus of HTA (click here for […]

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SiTime’s SOI-MEMS in MegaChips-Bosch Sensortec Solution for Realtime Health and Fitness Tracking in Smartphones & Wearables Thumbnail

SiTime’s SOI-MEMS in MegaChips-Bosch Sensortec Solution for Realtime Health and Fitness Tracking in Smartphones & Wearables

Posted on February 23, 2015
In Industry Buzz
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SiTime’s SOI-MEMS solution is a key part of a new realtime health and fitness tracking solution from MegaChips called “frizz”. MegaChips has announced a partnership with Bosch Sensortec to provide a complete reference design for use of frizz in smartphones, wearables and other personal devices allowing consumers to monitor their activities in real time (read […]

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SOI for MEMS, NEMS, sensors and more at IEDM ’14 (Part 3 of 3 in ASN’s IEDM coverage) Thumbnail

SOI for MEMS, NEMS, sensors and more at IEDM ’14 (Part 3 of 3 in ASN’s IEDM coverage)

Posted by on January 12, 2015
In Conferences, Paperlinks, R&D/Labnews
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Important SOI-based developments in MEMS, NEMS (like MEMS but N for nano), sensors and energy harvesting shared the spotlight with advanced CMOS and future devices at IEDM 2014 (15-17 December in San Francisco). IEDM is the world’s showcase for the most important applied research breakthroughs in transistors and electronics technology. Here in Part 3, we’ll […]

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Two additions to Altatech equipment lines: 10x faster ultra-thin film deposition; Doppler nano-defect inspection captures true sizing and positioning Thumbnail

Two additions to Altatech equipment lines: 10x faster ultra-thin film deposition; Doppler nano-defect inspection captures true sizing and positioning

Posted on December 8, 2014
In Industry Buzz
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Two new products from semi equipment manufacturer Altatech: one for ultra-thin film deposition, and one for searching out nano-defects. Altatech is a division of Soitec, best known in the advanced substrates community for its leadership in SOI wafers. This part of the company, however, develops highly efficient, cost-effective inspection and chemical vapor deposition (CVD) technologies […]

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