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Archive of MEMS

Two additions to Altatech equipment lines: 10x faster ultra-thin film deposition; Doppler nano-defect inspection captures true sizing and positioning Thumbnail

Two additions to Altatech equipment lines: 10x faster ultra-thin film deposition; Doppler nano-defect inspection captures true sizing and positioning

Posted on December 8, 2014
In Industry Buzz
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Two new products from semi equipment manufacturer Altatech: one for ultra-thin film deposition, and one for searching out nano-defects. Altatech is a division of Soitec, best known in the advanced substrates community for its leadership in SOI wafers. This part of the company, however, develops highly efficient, cost-effective inspection and chemical vapor deposition (CVD) technologies […]

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MegaChips Buys SOI-MEMS Timing Leader SiTime

Posted on November 3, 2014
In Industry Buzz
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SOI-MEMS timing device leader SiTime Corporation is being acquired by MegaChips Corporation, a top 25 fabless semiconductor company based in Japan for $200 million in cash. (read the press release here). This transaction combines two complementary fabless semiconductor leaders that provide solutions for the growing Wearables, Mobile and Internet of Things markets. “MEMS components are fuelling […]

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Welcome to IEEE S3S – the World’s Leading Conference for SOI, 3DI and Sub Vt (SF, 6-9 Oct) Thumbnail

Welcome to IEEE S3S – the World’s Leading Conference for SOI, 3DI and Sub Vt (SF, 6-9 Oct)

Posted by on September 17, 2014
In Conferences, R&D/Labnews
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(For best rates, register by September 18th.) The 2014 IEEE SOI-3DI–Subthreshold (S3S) Microelectronics Technology Unified Conference will take place from Monday October 6 through Thursday October 8 in San Francisco. Last year we entered into a new era as the IEEE S3S Conference. The transition from the IEEE International SOI Conference to the IEEE S3S […]

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TowerJazz — Interview With SVP Marco Racanelli: What’s Driving Strong SOI-Based Design Wins? Thumbnail

TowerJazz — Interview With SVP Marco Racanelli: What’s Driving Strong SOI-Based Design Wins?

Posted on September 11, 2014
In Design & Manufacturing, News & Viewpoints
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            ASN recently spoke with TowerJazz SVP Marco Racanelli about when the specialty foundry leverages SOI – and why. Advanced Substrate News (ASN): Can you tell us briefly about TowerJazz’s overall vision and position in the market?  Marco Racanelli (MR):  TowerJazz is the foundry leader for the manufacture of specialty […]

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New SOI Textbook (and e-book) with contributions by experts at Soitec, GF, TSMC, Leti and more Thumbnail

New SOI Textbook (and e-book) with contributions by experts at Soitec, GF, TSMC, Leti and more

Posted on August 8, 2014
In Industry Buzz
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A new book entitled Silicon-On-Insulator (SOI) Technology, Manufacture and Applications (1st Edition) features contributions by experts at Soitec, GF, TSMC, Leti and more. Billed as “a complete review of this rapidly growing high-speed, low-power semiconductor technology,” the book covers the entire SOI spectrum, from Moore to More than Moore.  It goes into SOI wafer technology,  […]

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SiTime Enters Wearables, IoT Markets with 32 kHz SOI-MEMS Thumbnail

SiTime Enters Wearables, IoT Markets with 32 kHz SOI-MEMS

Posted on June 8, 2014
In Industry Buzz
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SiTime, which leverages SOI for high-performance MEMS timing solutions, has introduced what it says is the smallest, lowest power 32 kHz TCXO (temperature compensated oscillator – read the press release here). With its tiny footprint and ultra-low power consumption, the SiT1552 MEMS TCXO enables a paradigm shift in the size and battery life of wearable […]

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U. Washington Selects Altatech (Soitec) CVD System to Develop New Process Materials Thumbnail

U. Washington Selects Altatech (Soitec) CVD System to Develop New Process Materials

Posted on April 9, 2014
In Industry Buzz
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The University of Washington’s Nanofabrication Facility (WNF) is the first North American institution to get an AltaCVD™ chemical vapor deposition (CVD) system (press release here). The AltaCVD system uses pulsed deposition technology to offer a unique combination of capabilities for developing new materials. It can perform atomic layer deposition (ALD) for exceptional 3D coverage at deposition rates […]

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Tronics Manufactures the First Piezoresistive Nanowire 6DOF Inertial MEMS (SOI) Thumbnail

Tronics Manufactures the First Piezoresistive Nanowire 6DOF Inertial MEMS (SOI)

Posted on April 9, 2014
In Industry Buzz
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       A year after announcing the industrialization of CEA-Leti’s breakthrough M&NEMS technologies, Tronics has successfully designed and manufactured the first batch of six-degrees-of-freedom (6DOF) MEMS chips, with 3 accelerometers and 3 gyroscopes on a single die (press release here). Built on SOI wafers, with a die size of less than 4mm2, this 6DOF MEMS […]

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Going Up! Monolithic 3D as an Alternative to CMOS Scaling Thumbnail

Going Up! Monolithic 3D as an Alternative to CMOS Scaling

Posted by , and on April 9, 2014
In Design & Manufacturing, R&D/Labnews
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By Jean-Eric Michallet, Hughes Metras and Perrine Batude (CEA-Leti)  The miniaturization of the MOSFET transistor has been the main booster for the semiconductor industry’s rapid growth in the last four decades. Following “Moore’s Law”, this scaling race has enabled performance increases in integrated circuits at a continuous cost reduction: today’s $200 mobile phone has as […]

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Eveon and Leti Leverage SOI in Milestone: Fabrication Of Smart Bolus-type Micro-pump for Drug Delivery Thumbnail

Eveon and Leti Leverage SOI in Milestone: Fabrication Of Smart Bolus-type Micro-pump for Drug Delivery

Posted on March 26, 2014
In Industry Buzz
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(Courtesy: CEA-Leti)   Eveon and CEA-Leti have demonstrated liquid-pumping for smart drug delivery in the bolus mode using a silicon-based micro-pump fabricated with a standard MEMS process. (Read full press release here.) The milestone is the first functional micro-pump integration using MEMS standard process on Leti’s 200mm line. It is a result of FluMin3, Eveon […]

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