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TowerJazz saw “a large amount of SOI design activity” in 2012 Thumbnail

TowerJazz saw “a large amount of SOI design activity” in 2012

Posted on December 4, 2012
In Industry Buzz
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The CEO of TowerJazz recently told analysts that in 2012, the company saw “a large amount of SOI design activity”, which he says will fuel revenue growth in 2013. Smart phone antenna switches that handle 8 to 14 different bands are moving from gallium arsenide to SOI, he explained.

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IBS Study Concludes FD-SOI Most Cost-Effective Technology Choice at 28nm and 20nm Thumbnail

IBS Study Concludes FD-SOI Most Cost-Effective Technology Choice at 28nm and 20nm

Posted by (IBS) on November 9, 2012
In ASN #20, News & Viewpoints, SOI In Action
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In a recent study entitled Economic Impact of the Technology Choices at 28nm/20nm, International Business Strategies (IBS) has found that those companies choosing FD-SOI at 28nm and/or 20nm should benefit from substantial savings in cost-per-die (see figure). For a technology to be utilized in high-volume production, costs must be lower than previous generations of technology. …

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SOI Demand Outlook Thumbnail

SOI Demand Outlook

Posted by (VLSI Research) on December 13, 2010
In ASN #16, News & Viewpoints, SOI In Action
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VLSI projects that a critical mass of expertise will support a fast transition to SOI designs at 32nm. The semiconductor market recovery has helped to grow SOI demand in-line with the industry. Established applications such as AMD’s microprocessors, IBM’s high performance ASICs, and other manufacturers’ high performance computer, consumer  and communications products are moving through …

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Frost & Sullivan’s new report

Posted on July 30, 2009
In Industry Buzz
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Frost & Sullivan’s new report, 3D IC Technology — An Assessment, includes a section entitled, SOI — A Key Substrate Enabler to 3D IC.

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Rooted in Green Thumbnail

Rooted in Green

Posted by (Soitec) on July 30, 2009
In ASN #13, Design & Manufacturing, In & Around Our Industry
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SOI and other engineered substrates drive power efficiency through the value chain.

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A Good Time for Innovation Thumbnail

A Good Time for Innovation

Posted by (Yole Développement) on May 27, 2009
In ASN #12, News & Viewpoints, SOI In Action
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Yole looks for a wide range of MEMS-based products to be introduced this year. Despite the current economic situation, a piece of good news is that innovation will not come to a halt in 2009: we expect that this will be one of the greatest years ever for new product introductions. The MEMS market in …

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Green and Growing

Posted by (SOI Industry Consortium) on May 27, 2009
In ASN #12, Special supplement: SOI Industry Consortium
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Despite the crises in the worldwide economy, market opportunities for SOI continue to expand.Those that can play the innovation card this year will be the ones ready with the right new products and technologies when growth returns. We are continuing in high gear. In meeting with companies across the globe, I’ve witnessed keen interest in …

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Growth Opportunities for SOI Thumbnail

Growth Opportunities for SOI

Posted by (VLSI Research) on December 3, 2008
In ASN #11, News & Viewpoints, SOI In Action
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VLSI sees innovation and differentiation fueling the SOI market. The recent chaos in the world economy is creating one of the most severe downturns in the semiconductor industry. However, Moore’s Law will not be abandoned during this downturn; in fact, it will be clung to all the more desperately as competitors try to eliminate one …

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Soitec Debuts Singapore Wafer Fab Thumbnail

Soitec Debuts Singapore Wafer Fab

Posted on December 3, 2008
In ASN #11, Design & Manufacturing, In & Around Our Industry
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The new manufacturing facility will support the region’s 300mm SOI-based markets. The “Linking of Hands” during the opening ceremony for Soitec Singapore Pte. Ltd. Left to right: Paul Boudre, COO, Soitec Group; His Excellency Pierre Buhler, French Ambassador to Singapore; Guest of Honour Mr Lim Hng Kiang, Singapore Minister for Trade and Industry; Dr. André-Jacques …

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3D ICs: Opportunities & Timing Thumbnail

3D ICs: Opportunities & Timing

Posted by (Yole Développement) on August 16, 2008
In ASN #10, News & Viewpoints, SOI In Action
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A new study from Yole on 3D ICs sees a bright future for applications, markets and active layer transfer technology. Chip performance, size and functionality – especially for consumer electronics – will drive the industry to adopt 3D stacked chips with through-silicon vias (TSVs) replacing wire bonding for certain markets in the 2009-2015 time frame. …

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