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ST’s Integrated RF-SOI for Front-End Modules: Why Designers Like It Thumbnail

ST’s Integrated RF-SOI for Front-End Modules: Why Designers Like It

Posted by on August 21, 2014
In Design & Manufacturing, News & Viewpoints
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RF-SOI is good for more than integrating RF switches.  Other key functions typically found inside RF Front-End Modules (FEM) like power amplifiers (PA), RF Energy Management, low-noise amplifiers (LNA), and passives also benefit from integration. Last year, ST announced a monolithic approach with a new RF-SOI process called H9SOI_FEM that allows the integration of all […]

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New SOI Textbook (and e-book) with contributions by experts at Soitec, GF, TSMC, Leti and more Thumbnail

New SOI Textbook (and e-book) with contributions by experts at Soitec, GF, TSMC, Leti and more

Posted on August 8, 2014
In Industry Buzz
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A new book entitled Silicon-On-Insulator (SOI) Technology, Manufacture and Applications (1st Edition) features contributions by experts at Soitec, GF, TSMC, Leti and more. Billed as “a complete review of this rapidly growing high-speed, low-power semiconductor technology,” the book covers the entire SOI spectrum, from Moore to More than Moore.  It goes into SOI wafer technology,  […]

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FD-SOI: The Best Enabler for Mobile Growth and Innovation Thumbnail

FD-SOI: The Best Enabler for Mobile Growth and Innovation

Posted by on August 8, 2014
In Design & Manufacturing, News & Viewpoints, SOI In Action
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The following in-depth analysis, an IBS study entitled How FD-SOI will Enable Innovation and Growth in Mobile Platform Sales, concludes that the benefits of FD-SOI are overwhelming for mobile platforms through Q4/2017 based on a number of key metrics. In fact, FD-SOI has the ability to support three technology nodes, which can mean a useful […]

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Soitec’s Shipped Enough eSI RF-SOI Substrates to Make over 1.4 Billion Devices Thumbnail

Soitec’s Shipped Enough eSI RF-SOI Substrates to Make over 1.4 Billion Devices

Posted on July 18, 2014
In Industry Buzz
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Soitec estimates that it has shipped enough of its eSI wafers to fabricate more than 1.4 billion RF front-end semiconductor devices. (Read the press release here.)  The proprietary Enhanced Signal Integrity™ (eSI) substrates are now the substrate of choice for manufacturing cost-effective and high-performance radio-frequency (RF) devices providing a power boost for 4G /LTE applications. […]

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Leti’s Monolithic 3D Highlighted in IEEE Spectrum

Posted on July 15, 2014
In Industry Buzz
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An excellent article highlighting Leti’s work on monolithic 3D was recently published in the IEEE’s Spectrum magazine – click here to read it. In the article, Maud Vinet, manager of advanced CMOS at Leti says they’ve worked closely with ST to ensure manufacturability. “There is no major roadblock to the transfer of this technology to […]

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Is FD-SOI Cheaper? Why yes!

Posted by on June 27, 2014
In Design & Manufacturing, Editor's Blog, News & Viewpoints
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A debate is raging over at SemiWiki following a post there entitled “Is SOI Really Less Expensive?” by Scotten Jones (you can read it here). Within just over 48 hours, about 30 comments were made, with heavy hitters on both sides of the fence weighing in. While the post itself is about manufacturing economics, the […]

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TowerJazz Releases Enhanced RF-SOI CMOS Process Design Kit for use with Agilent Technologies’ Advanced Design System Software

Posted on June 17, 2014
In Industry Buzz
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Specialty foundry TowerJazz announced the availability of an enhanced RF-SOI CMOS process design kit (PDK) for its 0.18µm process technology (see press release here). The kit was developed for use with Agilent Technologies’ Advanced Design System (ADS) software and targets a wide range of analog markets including front-end modules for mobile phones, tablets and WiFi […]

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IBM Specialty Foundry Shipped Over 7 Billion RF-SOI Chips in Last 3 Years, Launches New RF-SOI Technology Thumbnail

IBM Specialty Foundry Shipped Over 7 Billion RF-SOI Chips in Last 3 Years, Launches New RF-SOI Technology

Posted on June 17, 2014
In Industry Buzz
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  IBM Foundry Solutions announced a new SOI-based technology for RF called 7SW SOI. The company says it is designed for 30 percent better performance than its predecessor, 7RF SOI, with which IBM shipped over seven billion chips in the last three years. The new mobile phone chip technology can help device manufacturers provide consumers […]

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Synopsys Design Flow Support for Samsung-ST 28nm FD-SOI (With More Details on What Designers Need to Know) Thumbnail

Synopsys Design Flow Support for Samsung-ST 28nm FD-SOI (With More Details on What Designers Need to Know)

Posted by on June 8, 2014
In Design & Manufacturing, Editor's Blog
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Following the big FD-SOI/EDA news, Synopsys has provided ASN with more details for designers.             The Synopsys’ Galaxy Design Platform has been extended to support the Samsung-STMicroelectronics strategic agreement on 28nm FD-SOI (see press release here). They’ve covered all the bases, so that designers going to Samsung’s foundry services for […]

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Samsung & ST 28nm FD-SOI Is Major Opportunity, Says IBS (EETimes)

Posted on May 28, 2014
In Industry Buzz
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In an EETimes blog, Handel Jones of IBS says that the Samsung-ST FD-SOI announcement represents a major opportunity. (Read full blog here.) “Samsung Electronics has a major opportunity with its large wafer capacity to support low-leakage products with its 28 nm FD-SOI process,” he wrote. “Cadence Design Systems, Synopsys, and Mentor Graphics are all supporting […]

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