ASN

Archive of lighting

Soitec and Sumitomo Electric are launching pilot production of 4” and 6” GaN wafers for the LED and power markets

Posted on January 26, 2012
In Industry Buzz
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World-leading advanced substrate maker Soitec and compound materials leader Sumitomo Electric are launching pilot production of 4” and 6” GaN wafers for the LED and power markets. Soitec applies its Smart CutTM layer-transfer process to Sumitomo’s bulk GaN wafers to generate engineered wafers with the same thermal expansion (CTE) as standard GaN wafers but at …

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Soitec was named NXP’s Best Supplier for Front End Materials & Equipment Thumbnail

Soitec was named NXP’s Best Supplier for Front End Materials & Equipment

Posted on September 21, 2011
In Industry Buzz
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The leading producer of SOI wafers, Soitec was named NXP’s Best Supplier for Front End Materials & Equipment. NXP was one of the first in the industry to use SOI. The relationship with Soitec dates back to 1995, when the two companies began work together on the development of the (then Philips’) breakthrough SOI-based ABCD …

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NXP has introduced the GreenChip SSL4101T controller IC for Solid State LED lighting power supplies Thumbnail

NXP has introduced the GreenChip SSL4101T controller IC for Solid State LED lighting power supplies

Posted on May 30, 2011
In Industry Buzz
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NXP has introduced the GreenChip SSL4101T controller IC for Solid State LED lighting power supplies. Based on SOI, its industry-leading performance includes Total Harmonic Distortion (THD) of less than 20 percent, a high Power Factor (PF) of .99, and high efficiency of 94 percent.

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Soitec has inked deals with Peregrine and Sumitomo

Posted on February 9, 2011
In Industry Buzz
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In recent months, Soitec has inked deals with: • Peregrine for joint development and production of a new, bonded silicon-on-sapphire (SOS) substrate for RFICs; • and with Sumitomo for the development of engineered gallium nitride (GaN) substrates for applications like high brightness LEDs as well as electric power devices designed for hybrid and full electric …

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2011 & SOI: Doing It.

Posted by Adele HARS on January 5, 2011
In Editor's Blog
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What will 2011 bring in the world of SOI? The hot topic will no doubt be FD-SOI – the planar, fully-depleted SOI solution that’s the top contender for mobile, low power and SoC apps at the 22nm node. You’ll be learning about how it will maximize performance, manufacturability and reduce overall cost. The pieces are …

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Let There Be (Better!) Light Thumbnail

Let There Be (Better!) Light

Posted on December 13, 2010
In ASN #16, End-User Apps, SOI In Action
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SOI is a central pillar of NXP’s energy-efficient lighting strategy. In this exclusive ASN interview, Jacques Le Berre, the company’s director of marketing and business development for Lighting Solutions, explains why. Advanced Substrate News (ASN): Looking at overall trends and the “big picture” in the lighting market, what do consumers want / what are governments …

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Driving Light

Posted by Adele HARS on December 13, 2010
In ASN #16, End-User Apps, SOI In Action
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SOI is poised to take center stage in the impending lighting revolution, with companies like NXP leading the charge. Here’s why. Incandescent bulbs are being phased out or banned worldwide: European bans started taking effect in 2009; the US, Canada, Japan and Russia will start in 2012. India, Brazil, China and many more have all …

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Thinking Thin: NXP’s EZ-HV-SOI Thumbnail

Thinking Thin: NXP’s EZ-HV-SOI

Posted on December 13, 2010
In ASN #16, End-User Apps, SOI In Action
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First announced a decade ago, NXP’s EZ-HV™ is process technology for the production of commercial high-voltage (HV) SOI-enabled ICs.  It is at the heart of NXP’s GreenChip technology, and is ideal for implementing optimal solutions for a wide range of lighting applications. In high-power systems, it allows sophisticated control logic and high voltage drive circuits …

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Newest Drivers Reach New Levels of Integration

Posted on December 13, 2010
In ASN #16, End-User Apps, SOI In Action
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Newest Drivers Reach New Levels of Integration NXP’s UBA2211 for the 230V and 110V markets is the latest driver IC family in the company’s CFL IC portfolio. Built on NXP’s EZ-HV SOI technology, it features the highest level of integration available on the market today, including a current controlled preheat function, enabling more compact designs, …

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Celebrating Over A Decade of Green

Posted on July 30, 2009
In ASN #13, End-User Apps, SOI In Action
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Piet Wessels has been the driving force behind NXP’s (and formerly Philips’) SOI-enabled high-voltage business ever since it first began. Advanced Substrate News: 10 years ago this spring, NXP (then Philips), announced its EZ-HV SOI technology for applications in the 60 to 650V range. What sorts of products has it been used for? How effective …

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