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Tronics Manufactures the First Piezoresistive Nanowire 6DOF Inertial MEMS (SOI) Thumbnail

Tronics Manufactures the First Piezoresistive Nanowire 6DOF Inertial MEMS (SOI)

Posted on April 9, 2014
In Industry Buzz
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       A year after announcing the industrialization of CEA-Leti’s breakthrough M&NEMS technologies, Tronics has successfully designed and manufactured the first batch of six-degrees-of-freedom (6DOF) MEMS chips, with 3 accelerometers and 3 gyroscopes on a single die (press release here). Built on SOI wafers, with a die size of less than 4mm2, this 6DOF MEMS […]

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Going Up! Monolithic 3D as an Alternative to CMOS Scaling Thumbnail

Going Up! Monolithic 3D as an Alternative to CMOS Scaling

Posted by , and on April 9, 2014
In Design & Manufacturing, R&D/Labnews
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By Jean-Eric Michallet, Hughes Metras and Perrine Batude (CEA-Leti)  The miniaturization of the MOSFET transistor has been the main booster for the semiconductor industry’s rapid growth in the last four decades. Following “Moore’s Law”, this scaling race has enabled performance increases in integrated circuits at a continuous cost reduction: today’s $200 mobile phone has as […]

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Eveon and Leti Leverage SOI in Milestone: Fabrication Of Smart Bolus-type Micro-pump for Drug Delivery Thumbnail

Eveon and Leti Leverage SOI in Milestone: Fabrication Of Smart Bolus-type Micro-pump for Drug Delivery

Posted on March 26, 2014
In Industry Buzz
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(Courtesy: CEA-Leti)   Eveon and CEA-Leti have demonstrated liquid-pumping for smart drug delivery in the bolus mode using a silicon-based micro-pump fabricated with a standard MEMS process. (Read full press release here.) The milestone is the first functional micro-pump integration using MEMS standard process on Leti’s 200mm line. It is a result of FluMin3, Eveon […]

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Semicon Europa 2014 Comes to Grenoble, Issues Call for Papers Thumbnail

Semicon Europa 2014 Comes to Grenoble, Issues Call for Papers

Posted on March 19, 2014
In Industry Buzz
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For the first time, SEMICON Europa will be held in Grenoble, France. The greater Grenoble region is home to industry leaders leveraging and researching SOI and related advanced substrates, including Soitec, Leti and  ST. SEMI has now announced the “Call for Papers” for technical sessions and presentations for SEMICON Europa 2014, which takes place October […]

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FD-SOI, Body-Biasing Shine in 10x Faster DSP With Ultra-Wide Voltage Range Thumbnail

FD-SOI, Body-Biasing Shine in 10x Faster DSP With Ultra-Wide Voltage Range

Posted by on February 20, 2014
In Conferences, Design & Manufacturing, Editor's Blog, R&D/Labnews
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Body-biasing design techniques, uniquely available in FD-SOI, have allowed STMicroelectronics and CEA-Leti to demonstrate a DSP that runs 10x faster than anything the industry’s seen before at ultra-low voltages (read press release here). In the mobile world (not to mention the IoT), the role of DSPs is becoming ever more important. All those things you […]

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Leti, ST Demo Order-of-Magnitude-Faster, Ultra-Low Power DSP on 28nm FD-SOI

Posted on February 18, 2014
In Industry Buzz
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CEA-Leti and STMicroelectronics presented an order-of-magnitude-faster FD-SOI Ultra-Wide-Voltage Range (UWVR) DSP at ISSCC ’14. The device was produced by ST in 28nm UTBB FD-SOI. It allows body-bias-voltage scaling from 0V to +2V, decreases minimum circuit operating voltage and supports clock-frequency operation of 460MHz at 400mV. “This demonstration DSP shows that FD-SOI is blazing the trail […]

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CMP delivers multi-project wafer runs of 28nm FD-SOI with impressive device performance Thumbnail

CMP delivers multi-project wafer runs of 28nm FD-SOI with impressive device performance

Posted on January 31, 2014
In Industry Buzz
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CMP recently delivered the first 28nm FD-SOI/10LM multi-project wafer run, Kholdoun Torki, Technical Director at CMP has indicated. “We received positive feedback on the test results with quite impressive device performance,” he said. The PDK is from ST, making this a success for both STMicroelectronics and CMP. 
In 2013, they had 32 prototypes from 15 customers over […]

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A New Open Foundry Source for FD-SOI? Soon, Says ST. Watch This Space. Thumbnail

A New Open Foundry Source for FD-SOI? Soon, Says ST. Watch This Space.

Posted by on January 31, 2014
In Editor's Blog, News & Viewpoints
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STMicroelectronics will soon be announcing a “major foundry player” that will be both a dual FD-SOI manufacturing source for ST, plus an open source for the industry.  This important piece of news came out of the company’s Q4 and FY13 presentation in Paris on January 28th. While ST signed a licensing agreement with GlobalFoundries a […]

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Interview: Leti CEO Laurent Malier on FD-SOI and more Thumbnail

Interview: Leti CEO Laurent Malier on FD-SOI and more

Posted on January 23, 2014
In News & Viewpoints, SOI In Action
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CEA-Leti is one of the world’s most important research institutes for micro- and nano-electronics. Key enabler to the greater SOI-based community, they’re the quiet mega-partner behind everything from Soitec’s Smart CutTM technology for SOI wafer manufacturing to the design and chip manufacturing technology in today’s FD-SOI revolution. Leti’s work always reaches far into our industry’s […]

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SOI: Looking Back Over a Year of Moving Forward (Part 2, RF-SOI & SOI-FinFETs) Thumbnail

SOI: Looking Back Over a Year of Moving Forward (Part 2, RF-SOI & SOI-FinFETs)

Posted by on January 17, 2014
In Editor's Blog, News & Viewpoints
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As we noted in the previous post (click here if you missed it), 2014 should be a terrific year for the greater SOI community. But before we look forward (which we’ll do in an upcoming post), let’s continue considering where we’ve been and some of the highlights of the last year.  In fact, there was […]

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