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Archive of Leti

San Jose Symposium: It Was an Epic Day for FD-SOI – Now Dubbed “The Smart Path to Success” [Part 1 of 2] Thumbnail

San Jose Symposium: It Was an Epic Day for FD-SOI – Now Dubbed “The Smart Path to Success” [Part 1 of 2]

Posted by on April 25, 2016
In Conferences, Editor's Blog
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The #1 take-away message from the recent FD-SOI Symposium in San Jose is that “FD-SOI is the smart path to success”. With presentations echoing that theme by virtually all the major players – including (finally!) ARM – to a packed house, it really was an epic day for the FD-SOI ecosystem. The presentations are now […]

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Shanghai & Grenoble tech dev powerhouses team up on SOI for IoT in China and global innovation ecosystem Thumbnail

Shanghai & Grenoble tech dev powerhouses team up on SOI for IoT in China and global innovation ecosystem

Posted on April 5, 2016
In Industry Buzz
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Three of the world’s More-than-Moore and SOI technology development powerhouses have signed a comprehensive agreement for ongoing collaboration and cooperation in developing new technologies for the emerging IoT market. SITRI of Shanghai, and CEA-Leti and Minatec of Grenoble will work together to accelerate the adoption of their latest technologies and create a global innovation ecosystem […]

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Silicon Valley FD-SOI Symposium Promises Best Ecosystem Line-Up Ever: ARM, Foundries, EDA, Designers, Experts & Users (13 April – free and open to all who sign up) Thumbnail

Silicon Valley FD-SOI Symposium Promises Best Ecosystem Line-Up Ever: ARM, Foundries, EDA, Designers, Experts & Users (13 April – free and open to all who sign up)

Posted by on March 31, 2016
In Conferences, Design & Manufacturing, Editor's Blog
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The SOI Consortium has lined up an excellent, comprehensive FD-SOI Symposium on April 13th in San Jose. They’ll be highlighting the tremendous progress of the FD-SOI ecosystem. Headliners include Cisco, Sony, NXP, SigmaDesigns, ARM, Ciena plus the big FD-SOI foundries, EDA companies, design partners, chipmakers and analysts. There is a special session dedicated to RF […]

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Call for submissions to FD-SOI IP Workshops (prizes!): Dresden (March), Bangalore (April), Shanghai (Sept), Grenoble (Dec)

Posted on February 3, 2016
In Industry Buzz
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  Design & Reuse, in partnership with GlobalFoundries, ST, Soitec and Leti, is sponsoring a series of FD-SOI IP Workshops around the globe. (Click here for more information.) These working days aim at sharing information about IP that’s currently available or is being designed for FD-SOI technology. The first conference will take place during DATE […]

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Interview (part 2 of 2): Leti Is a Catalyst for the FD-SOI Ecosystem. CEO Marie Semeria Explains Where They’re Headed Thumbnail

Interview (part 2 of 2): Leti Is a Catalyst for the FD-SOI Ecosystem. CEO Marie Semeria Explains Where They’re Headed

Posted by on December 17, 2015
In Design & Manufacturing, News & Viewpoints, R&D/Labnews
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From wafers to apps, Leti has been the moving force behind all things SOI for over 30 years. Now they’re the powerhouse behind the FD-SOI phenomenon. CEO Marie-Noelle Semeria shares her insights here in part 2 of this exclusive ASN interview as to what Leti’s doing to drive the ecosystem forward. (In part 1, she […]

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To help designers assess 28nm FD-SOI power benefits, Keysight (formerly Agilent/HP test) adds more Leti-UTSOI modeling tech for SPICE

Posted on December 14, 2015
In Industry Buzz
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CEA-Leti has signed an agreement with Keysight Technologies (formerly the Agilent/HP test group), the industry-leading device-modeling software supplier, to adopt Leti’s UTSOI extraction flow methodology within Keysight’s device modeling solutions for high-volume SPICE model generation. (Read the press release here.) “This collaboration between Leti and Keysight will strengthen the global FD-SOI ecosystem by providing an […]

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Interview: Leti Is the Moving Force Behind FD-SOI. CEO Marie Semeria Explains the Strategy (part 1 of 2) Thumbnail

Interview: Leti Is the Moving Force Behind FD-SOI. CEO Marie Semeria Explains the Strategy (part 1 of 2)

Posted by on December 8, 2015
In Design & Manufacturing, News & Viewpoints, R&D/Labnews
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From wafers to apps, Leti has been the moving force behind all things SOI for over 30 years. Now they’re the powerhouse behind the FD-SOI phenomenon. CEO Marie Semeria shares her insights here in part 1 of this exclusive ASN interview as to what makes Leti tick. In part 2, we’ll talk about Leti’s new […]

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Leti Develops 22nm FD-SOI Local-strain Techniques to boost performance and lower power consumption

Posted on December 8, 2015
In Industry Buzz
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CEA-Leti announced it has developed two techniques to induce local strain in FD-SOI processes for next-generation FD-SOI circuits that will produce more speed or lower power consumption and improved performance. (For more details, read the press release here.) Targeting the 22/20nm node, the local-strain solutions are dual-strained technologies: compressive SiGe for PFETs and tensile Si […]

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Leti joins GF’s GlobalSolutions, Providing FD-SOI ASIC Design-and-Fab Solutions on 22FDX

Posted on October 28, 2015
In Industry Buzz
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Tags: FD-SOI, Leti, GlobalFoundries, GF, 22nm, IoT, design, foundry, manufacturing Leti has joined the GlobalFoundries’ GlobalSolutions ecosystem as an ASIC provider, specifically to support GF’s 22FDX™ technology platform. (Read the press release here.) Earlier this year, Leti assigned a team of experts to GF’s’ Dresden Fab 1 to support ramp up of the platform. As […]

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Industry 1st: Leti Demos MEMS on 300mm Wafers – And Yes, They’re SOI

Posted on October 2, 2015
In Industry Buzz
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In what may be a first for the MEMS industry, CEA-Leti has manufactured micro-accelerometers on 300mm wafers, a development that could lead to significantly lower MEMS manufacturing costs. And yes, those 300mm wafers are SOI wafers. These are “thick” SOI wafers, with an insulating BOx (buried oxide) layer of 2µm, and top silicon of 220nm. […]

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