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Archive of Leti

Go! FD-SOI Wafer Suppliers Ready for High-Volume Ramp; Atomic-Scale Uniformity Assured Thumbnail

Go! FD-SOI Wafer Suppliers Ready for High-Volume Ramp; Atomic-Scale Uniformity Assured

Posted by on July 21, 2015
In Design & Manufacturing, Editor's Blog
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With the great news about FD-SOI foundry offerings from Samsung, ST and now GlobalFoundries, plus the IP availability, the wafer suppliers have chimed in to remind the ecosystem they’re ready to ramp (and have been for a number of years!). So the wafers are ready (and they truly are amazing), the processes ensuring high yield […]

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It’s Official! GlobalFoundries Launches 22FDX: 22nm FD-SOI in 4 flavors Thumbnail

It’s Official! GlobalFoundries Launches 22FDX: 22nm FD-SOI in 4 flavors

Posted by on July 14, 2015
In Design & Manufacturing, Editor's Blog
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With much fanfare, GlobalFoundries has officially announced its 22nm FD-SOI offering. Dubbed “22FDX™”, GF says the platform delivers FinFET-like performance and energy-efficiency at a cost comparable to 28nm planar, targeting mainstream mobile, IoT, RF connectivity and networking markets. Asked by EETimes why FD-SOI here and now, GF’s CEO Sanjay Jha responded, “The mass market is […]

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Yes! FD-SOI IP Ready for GF, Samsung; Ecosystem Now a Force to Be Reckoned With Thumbnail

Yes! FD-SOI IP Ready for GF, Samsung; Ecosystem Now a Force to Be Reckoned With

Posted by on July 6, 2015
In Conferences, Design & Manufacturing, Editor's Blog
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The recent LetiDays FD-SOI workshop in Grenoble was the biggest show of force to date for the burgeoning FD-SOI ecosystem. In addition to a raft of excellent presentations, we learned two very big pieces of news. First, GlobalFoundries provided more insights into their upcoming FD-SOI offering. And second, designers opting for Samsung’s 28nm FD-SOI offering […]

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Don’t Miss Leti Days and FD-SOI Workshop (Grenoble, 22-26 June) Thumbnail

Don’t Miss Leti Days and FD-SOI Workshop (Grenoble, 22-26 June)

Posted on May 29, 2015
In Industry Buzz
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CEA-Leti, a leading global center for applied research in microelectronics, nanotechnologies and integrated systems, is proudly hosting its 17th LetiDays in Grenoble on June 24–25, 2015, and associated seminars and workshops on June 22nd, 23rd and 26th (click here to go to the registration site). On June 22-23, Leti will present their first workshop on […]

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IEEE SOI-3D-Subthreshold Conference (S3S, Oct. Sonoma, CA) Welcoming Papers til mid-May Thumbnail

IEEE SOI-3D-Subthreshold Conference (S3S, Oct. Sonoma, CA) Welcoming Papers til mid-May

Posted by on April 27, 2015
In Conferences
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The IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (IEEE S3S) is welcoming papers until May 18, 2015. Last year, the second edition of the IEEE S3S conference, founded upon the co-location of the IEEE International SOI Conference and the IEEE Subthreshold Microelectronics Conference was a great success targetting key topics and attracting even more participants than […]

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Newest Leti Compact Model for FD-SOI Further Improves Predictability and Accuracy Thumbnail

Newest Leti Compact Model for FD-SOI Further Improves Predictability and Accuracy

Posted on April 21, 2015
In Industry Buzz
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CEA-Leti’s newest version of its advanced compact model for FD-SOI is now available in all major SPICE simulators (get the press release here). The Leti-UTSOI2.1 is the latest version of Leti’s compact model for FD-SOI, which was first released in 2013. (Compact models of transistors and other elementary devices are used to predict the behavior […]

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Interview (Leti): How a new platform helps designers get the most out of FD-SOI for IoT, ULP Thumbnail

Interview (Leti): How a new platform helps designers get the most out of FD-SOI for IoT, ULP

Posted on April 9, 2015
In Design & Manufacturing, News & Viewpoints
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A driving force in FD-SOI, Leti recently announced a service called Silicon Impulse®, a new FD-SOI platform for IoT & ultra-low-power (ULP) apps that helps start-ups, SMEs and large companies evaluate, design, prototype & move to volume. Olivier Thomas, who’s in charge of the program and Ali Erdengiz, who’s Business Development Manager for Leti explain […]

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European R&D Leaders Team on SOI-MEMS Platform for Industry, SME’s Thumbnail

European R&D Leaders Team on SOI-MEMS Platform for Industry, SME’s

Posted on March 27, 2015
In Industry Buzz
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The Heterogeneous Technology Alliance (HTA), a coalition of top European R&D organizations, is offering an SOI-MEMS platform. Looking to bridge the gap between academia and industry, this technological platform pools the SOI-MEMS expertise, capabilities and fabrication facilities of Leti (France), Fraunhofer (Germany), CSEM (Switzerland) and VTT (Finland). The main focus of HTA (click here for […]

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2015 – Turning the Tables for FD-SOI, RF-SOI and More Thumbnail

2015 – Turning the Tables for FD-SOI, RF-SOI and More

Posted by on January 22, 2015
In Editor's Blog
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If current momentum is any indication, 2015 will be the year the tables turn in favor of FD-SOI designs (with a big shout-out to IoT).  The RF-SOI juggernaut will continue cutting an enormous swath through the mobile market.   Attention to the exciting possibilities of monolithic 3D (M3D) technology (like Leti’s “CoolCube”) will continue to grow, […]

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Leti’s M3D, now dubbed “CoolCube”, featured in EETimes Thumbnail

Leti’s M3D, now dubbed “CoolCube”, featured in EETimes

Posted on January 22, 2015
In Industry Buzz
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Leti’s monolithic 3D technology, which has now been dubbed “CoolCube”, was featured in a recent EETimes piece.  Entitled True 3D monolithic integration eliminates TSV dependence (click here to read it), the article covers a Leti paper presented during a 3D-VLSI workshop preceding IEDM ’14.  Leti’s Advanced CMOS lab manager Maud Vinet detailed the “cool” process in […]

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