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ST’s Integrated RF-SOI for Front-End Modules: Why Designers Like It Thumbnail

ST’s Integrated RF-SOI for Front-End Modules: Why Designers Like It

Posted by on August 21, 2014
In Design & Manufacturing, News & Viewpoints
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RF-SOI is good for more than integrating RF switches.  Other key functions typically found inside RF Front-End Modules (FEM) like power amplifiers (PA), RF Energy Management, low-noise amplifiers (LNA), and passives also benefit from integration. Last year, ST announced a monolithic approach with a new RF-SOI process called H9SOI_FEM that allows the integration of all […]

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FD-SOI: The Best Enabler for Mobile Growth and Innovation Thumbnail

FD-SOI: The Best Enabler for Mobile Growth and Innovation

Posted by on August 8, 2014
In Design & Manufacturing, News & Viewpoints, SOI In Action
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The following in-depth analysis, an IBS study entitled How FD-SOI will Enable Innovation and Growth in Mobile Platform Sales, concludes that the benefits of FD-SOI are overwhelming for mobile platforms through Q4/2017 based on a number of key metrics. In fact, FD-SOI has the ability to support three technology nodes, which can mean a useful […]

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Soitec’s Shipped Enough eSI RF-SOI Substrates to Make over 1.4 Billion Devices Thumbnail

Soitec’s Shipped Enough eSI RF-SOI Substrates to Make over 1.4 Billion Devices

Posted on July 18, 2014
In Industry Buzz
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Soitec estimates that it has shipped enough of its eSI wafers to fabricate more than 1.4 billion RF front-end semiconductor devices. (Read the press release here.)  The proprietary Enhanced Signal Integrity™ (eSI) substrates are now the substrate of choice for manufacturing cost-effective and high-performance radio-frequency (RF) devices providing a power boost for 4G /LTE applications. […]

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TowerJazz Releases Enhanced RF-SOI CMOS Process Design Kit for use with Agilent Technologies’ Advanced Design System Software

Posted on June 17, 2014
In Industry Buzz
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Specialty foundry TowerJazz announced the availability of an enhanced RF-SOI CMOS process design kit (PDK) for its 0.18µm process technology (see press release here). The kit was developed for use with Agilent Technologies’ Advanced Design System (ADS) software and targets a wide range of analog markets including front-end modules for mobile phones, tablets and WiFi […]

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IBM Specialty Foundry Shipped Over 7 Billion RF-SOI Chips in Last 3 Years, Launches New RF-SOI Technology Thumbnail

IBM Specialty Foundry Shipped Over 7 Billion RF-SOI Chips in Last 3 Years, Launches New RF-SOI Technology

Posted on June 17, 2014
In Industry Buzz
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  IBM Foundry Solutions announced a new SOI-based technology for RF called 7SW SOI. The company says it is designed for 30 percent better performance than its predecessor, 7RF SOI, with which IBM shipped over seven billion chips in the last three years. The new mobile phone chip technology can help device manufacturers provide consumers […]

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Interview: Leti CEO Malier on the FD-SOI Breakthrough; Leti Days in Grenoble (24-26 June) & Semicon West Thumbnail

Interview: Leti CEO Malier on the FD-SOI Breakthrough; Leti Days in Grenoble (24-26 June) & Semicon West

Posted by on June 17, 2014
In Design & Manufacturing, Editor's Blog, News & Viewpoints
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Some years back, European research giant CEA-Leti made a major commitment to support FD-SOI, partnering with STMicroelectronics, Soitec and IBM.  Now, with the big FD-SOI foundry announcement by Samsung and STMicroelectronics, Leti’s ready to bring its vast expertise to players throughout the value chain, right up through design integration. To learn more about the range […]

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Synopsys Design Flow Support for Samsung-ST 28nm FD-SOI (With More Details on What Designers Need to Know) Thumbnail

Synopsys Design Flow Support for Samsung-ST 28nm FD-SOI (With More Details on What Designers Need to Know)

Posted by on June 8, 2014
In Design & Manufacturing, Editor's Blog
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Following the big FD-SOI/EDA news, Synopsys has provided ASN with more details for designers.             The Synopsys’ Galaxy Design Platform has been extended to support the Samsung-STMicroelectronics strategic agreement on 28nm FD-SOI (see press release here). They’ve covered all the bases, so that designers going to Samsung’s foundry services for […]

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Samsung & ST 28nm FD-SOI Is Major Opportunity, Says IBS (EETimes)

Posted on May 28, 2014
In Industry Buzz
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In an EETimes blog, Handel Jones of IBS says that the Samsung-ST FD-SOI announcement represents a major opportunity. (Read full blog here.) “Samsung Electronics has a major opportunity with its large wafer capacity to support low-leakage products with its 28 nm FD-SOI process,” he wrote. “Cadence Design Systems, Synopsys, and Mentor Graphics are all supporting […]

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Peregrine Ships Next-Gen UltraCMOS® 10 RF-SOI Switches for Smartphones

Posted on May 28, 2014
In Industry Buzz
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Peregrine Semi has shipped the first RF switches built on the company’s SOI-based UltraCMOS 10 technology platform. With partner GlobalFoundries, Peregrine also announces the completion of product and process qualification for the advanced RF-SOI technology (see press release here). The 130 nm technology combines the performance of UltraCMOS technology with the economies of SOI, and […]

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Soitec and Simgui (China) Partner on SOI Wafer Production for RF and Power Apps

Posted on May 28, 2014
In Industry Buzz
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Soitec and Simgui (Shanghai, China) are partnering on SOI wafer production for RF and power applications. The newly signed deal (read press release here) includes a licensing and technology transfer agreement. Simgui will establish a high-volume SOI manufacturing line using Soitec’s proprietary Smart Cut™ technology to directly supply the Chinese market. In addition, Simgui will […]

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