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Archive of foundry

Presentation on Substrates for SOI-FinFETs and FD-SOI by SEH, World Wafer Leader, Posted on weSRCH Thumbnail

Presentation on Substrates for SOI-FinFETs and FD-SOI by SEH, World Wafer Leader, Posted on weSRCH

Posted on March 26, 2014
In Industry Buzz
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(Courtesy: SEH, weSRCH)   A presentation by Shin‐Etsu Handotai (SEH, the world’s largest wafer supplier) detailing the company’s line-up of wafers for FD-SOI and SOI-FinFET is now available on weSRCH (click here to access it). SEH, a $12.7 billion company supplying over 20% of the world’s bulk silicon wafers, has been making SOI wafers since […]

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Why Migration to FD-SOI is a Better Approach Than Bulk CMOS and FinFETs at 20nm and 14/16nm for Price-Sensitive Markets Thumbnail

Why Migration to FD-SOI is a Better Approach Than Bulk CMOS and FinFETs at 20nm and 14/16nm for Price-Sensitive Markets

Posted by on March 19, 2014
In Design & Manufacturing, News & Viewpoints
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By Handel Jones IBS has recently issued a new white paper entitled Why Migration to 20nm Bulk CMOS and 16/14nm FinFETs Is Not the Best Approach for the Semiconductor Industry.  The focus of the analysis is on technology options that can be used to give lower cost per gate and lower cost per transistor within […]

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FD-SOI Keeps Moore’s Law on Track Thumbnail

FD-SOI Keeps Moore’s Law on Track

Posted by on February 28, 2014
In Editor's Blog, News & Viewpoints
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Take a look at this graph – it’s obvious, isn’t it? FD-SOI is significantly cheaper, outdoes planar bulk and matches bulk FinFET in the performance/power ratio, and keeps the industry on track with Moore’s Law. This was part of a presentation by ST’s Joël Hartmann (EVP of Manufacturing and Process R&D, Embedded Processing Solutions) during Semi’s […]

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FD-SOI Opportunities in China Thumbnail

FD-SOI Opportunities in China

Posted by on February 5, 2014
In Design & Manufacturing, News & Viewpoints, Professor's Perspective
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Authors: Zhongli Liu, Kai Zhao, Jiajun Luo, Fang Yu, Tianchun Ye (IMECAS) The Chinese IC industry is facing a real opportunity, and Chinese IC developers are looking for points of entry to best leverage this important moment. The CTO of a large Chinese IC supplier is looking for system solutions for their SOC chips, in […]

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Europe Should Build a High-Volume FD-SOI Fab, says Penn (Mannerisms)

Posted on January 31, 2014
In Industry Buzz
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Europe needs to build a high-volume FD-SOI fab. Malcolm Penn, CEO of Future Horizons, said this in the firm’s annual forecast meeting, reported David Manners of ElectronicsWeekly (Click here to read his article.) Last year, European Commission Vice President Neelie Kroes said, “I want to double our chip production to around 20% of global production. […]

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CMP delivers multi-project wafer runs of 28nm FD-SOI with impressive device performance Thumbnail

CMP delivers multi-project wafer runs of 28nm FD-SOI with impressive device performance

Posted on January 31, 2014
In Industry Buzz
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CMP recently delivered the first 28nm FD-SOI/10LM multi-project wafer run, Kholdoun Torki, Technical Director at CMP has indicated. “We received positive feedback on the test results with quite impressive device performance,” he said. The PDK is from ST, making this a success for both STMicroelectronics and CMP. 
In 2013, they had 32 prototypes from 15 customers over […]

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A New Open Foundry Source for FD-SOI? Soon, Says ST. Watch This Space. Thumbnail

A New Open Foundry Source for FD-SOI? Soon, Says ST. Watch This Space.

Posted by on January 31, 2014
In Editor's Blog, News & Viewpoints
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STMicroelectronics will soon be announcing a “major foundry player” that will be both a dual FD-SOI manufacturing source for ST, plus an open source for the industry.  This important piece of news came out of the company’s Q4 and FY13 presentation in Paris on January 28th. While ST signed a licensing agreement with GlobalFoundries a […]

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China Fab XMC Looks at FD-SOI

Posted on January 13, 2014
In Industry Buzz
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Simon Yang, the CEO of XMC, a fast growing specialty foundry in China, gave an excellent presentation about FD-SOI at the SOI Consortium’s Technology Summit in Shanghai (Oct., 2013).  The presentation is now available both through VLSI’s weSRCH site (click here) and through the SOI Consortium’s website (click here for this plus all the other […]

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Soitec White Paper Explains Value of New RF-SOI Wafers for 4G/LTE Applications Thumbnail

Soitec White Paper Explains Value of New RF-SOI Wafers for 4G/LTE Applications

Posted on December 19, 2013
In Industry Buzz
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Soitec has issued a highly-informative new white paper on its enhanced signal integrity – aka eSI™ – wafers for 4G and LTE/A applications (to get the paper, click here).  Entitled “Innovative RF-SOI Wafers for Wireless Applications”, the paper explains the various challenges faced by RF IC designers, and how the new eSI wafers offer powerful […]

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FD-SOI Is Cheaper, Too, Concludes semiwiki Blogger

Posted on December 16, 2013
In Industry Buzz
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Concluding, “Faster, Simpler, Cooler,…and Cheaper: FD-SOI technology should get very good traction in the near future!”, semiwiki blogger Eric Esteve has kicked off a very lively conversation.  Within a few days of posting Faster, Cooler, Simpler, could FD-SOI be Cheaper too?, there were almost 20 comments, with lots of good supplemental information from well-informed participants. […]

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