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EVG Takes on 450 mm and SOI with Newest Wafer-Bonding System Thumbnail

EVG Takes on 450 mm and SOI with Newest Wafer-Bonding System

Posted by (EV Group) on October 28, 2011
In ASN #18, Design & Manufacturing, In & Around Our Industry
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EVG’s new wafer bonding system is a fully automated tool for production-level fabrication of 450mm SOI wafers. Transitioning to larger wafers heightens the need for process uniformity.  Wafer bonding is no exception, as process parameters must be applied with a high degree of both precision and uniformity.  This requirement will become particularly critical within the …

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Ultra-thin wafers for 450mm FD-SOI on schedule Thumbnail

Ultra-thin wafers for 450mm FD-SOI on schedule

Posted by on September 19, 2011
In Editor's Blog
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Engineered substrates like SOI wafers need to be ready years in advance of any major shift in technology – and before much of the rest of the materials and equipment. The fabs and foundries as well as the entire design chain – need real wafers they can work with early on to meet R&D and …

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FD-SOI Foundations Ready, Say Semi Execs

Posted by on August 30, 2011
In Editor's Blog
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SOI (especially fully depleted “FD-SOI”) was a hot topic in the video and audio interviews that Debra Vogler of SST released recently. Here are brief summaries of the most important SOI-related interviews – with top brass from Leti, Soitec, KT, EVG and Qcept –  that she made at Semicon West ’11. (If you need a …

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