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Cambridge CMOS Sensors (CCMOS) says it is seeing increasing sales of its gas-sensing microsystems and is on the cusp of more major contracts.

Posted on August 26, 2013
In Industry Buzz
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Cambridge CMOS Sensors (CCMOS) says it is seeing increasing sales of its gas-sensing microsystems and is on the cusp of more major contracts. Gas-sensing technology has a broad range of applications, including domestic gas detectors, industrial safety, explosive detection, medical diagnostics and environmental monitoring. A Cambridge University spin-off that recently raised an additional £4.5m, the […]

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A leader in devices for extreme temperatures (-55°C to +225°C), Cissoid continues rolling out new SOI-based products for power management, power conversion and signal conditioning. Thumbnail

A leader in devices for extreme temperatures (-55°C to +225°C), Cissoid continues rolling out new SOI-based products for power management, power conversion and signal conditioning.

Posted on August 26, 2013
In Industry Buzz
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A leader in devices for extreme temperatures (-55°C to +225°C), Cissoid continues rolling out new SOI-based products for power management, power conversion and signal conditioning. Additions over the last year include: FUJI, a High Reliability 3.5W DC-DC Converter with Triple Output 5V, 3.3V & 1.8V CHT-RIGEL, a High Reliability Adjustable Voltage Regulator for up to […]

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Microsemi, Honeywell <i>et al</i> Leveraging SOI to Curb CO<sub>2</sub> Emissions Thumbnail

Microsemi, Honeywell et al Leveraging SOI to Curb CO2 Emissions

Posted by on August 21, 2013
In Editor's Blog
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The furnace in your home’s basement might not be as sexy as your smartphone, but when it comes to making a difference to the planet, it’s awfully important. That’s why Microsemi and Honeywell have teamed up with Cissoid, Cambridge CMOS Sensors and several top universities like UCL, Cambridge and Warwick in a €4 million ($5.3 […]

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SiTime, which leverages SOI for high-performance MEMS timing solutions, has introduced TempFlat™ MEMS Thumbnail

SiTime, which leverages SOI for high-performance MEMS timing solutions, has introduced TempFlat™ MEMS

Posted on July 11, 2013
In Industry Buzz, Non classé
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SiTime, which leverages SOI for high-performance MEMS timing solutions, has introduced TempFlat™ MEMS. Until recently, all MEMS oscillators used compensation circuitry to stabilize the output frequency over temperature. SiTime’s TempFlat MEMS is a revolutionary breakthrough that eliminates temperature compensation, resulting in dramatically higher performance, smaller size, lower power and cost, says the company. According to […]

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More than 65 percent of substrates used in fabricating switches for handsets are SOI based, according to the industry research firm Yole Développement

Posted on July 11, 2013
In Industry Buzz
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More than 65 percent of substrates used in fabricating switches for handsets are SOI based, according to the industry research firm Yole Développement. This shows the massive adoption of RF SOI for this booming electronic market experiencing double-digit growth.  Soitec, the world’s leading manufacturer of SOI wafers, says that this shows that SOI-based technologies are […]

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STMicroelectronics says its new manufacturing process, known as H9SOI_FEM, allows production of complete integrated front-end modules

Posted on June 28, 2013
In Industry Buzz
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STMicroelectronics says its new manufacturing process, known as H9SOI_FEM, allows production of complete integrated front-end modules. This process is an evolution of the H9SOI SOI process, a groundbreaking technology introduced by ST in 2008 and subsequently used by customers to produce more than 400 million RF switches for mobile phones and Wi-Fi applications. Building on […]

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Rambus will have access to ST’s FD-SOI process-technology design environment

Posted on June 21, 2013
In Industry Buzz
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Under a new agreement, Rambus will have access to ST’s FD-SOI process-technology design environment. With this, Rambus will be able to benefit from FD-SOI’s reduced silicon geometries and lower power consumption at 28nm and below in its future memory and interface solutions. This is part of a comprehensive agreement between the two companies, which covers […]

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American Semiconductor has announced the FleX-MCU™ product family. Thumbnail

American Semiconductor has announced the FleX-MCU™ product family.

Posted on June 17, 2013
In Industry Buzz
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American Semiconductor has announced the FleX-MCU™ product family. Leveraging an SOI starting wafer, the FleX-MCU is the world’s first physically flexible microcontroller fabricated using the FleX™ Silicon-on-Polymer™ process. The FleX-MCU is an 8-bit RISC microcontroller with 8KB embedded RAM operating up to 20MHz, and is the initial product for a full portfolio of physically flexible […]

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In the three months following Peregrine Semi’s announcement of the latest version of its UltraCMOS® process technology, the company has followed with a steady stream of news Thumbnail

In the three months following Peregrine Semi’s announcement of the latest version of its UltraCMOS® process technology, the company has followed with a steady stream of news

Posted on May 31, 2013
In Industry Buzz
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In the three months following Peregrine Semi’s announcement of the latest version of its UltraCMOS® process technology, STeP8 for RF Front End ICs, the company has followed with a steady stream of news. (The UltraCMOS technology is an advanced RF SOI process leveraging bonded silicon-on-sapphire (BSOS) substrates from Soitec.) Recent announcements include: a collaborative sourcing […]

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SiTime has entered the smartphone/tablet/mobile app market with the first MEMS oscillator in a chip scale package (CSP) Thumbnail

SiTime has entered the smartphone/tablet/mobile app market with the first MEMS oscillator in a chip scale package (CSP)

Posted on May 10, 2013
In Industry Buzz
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SiTime, which leverages SOI for high-performance MEMS timing solutions, has entered the smartphone/tablet/mobile app market with the first MEMS oscillator in a chip scale package (CSP). SiTime’s solutions offer area savings of 85%, cut power by 50% and are 15 times more reliable, all of which enable smaller, lower power and longer lasting mobile electronics. […]

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