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Rambus will have access to ST’s FD-SOI process-technology design environment

Posted on June 21, 2013
In Industry Buzz
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Under a new agreement, Rambus will have access to ST’s FD-SOI process-technology design environment. With this, Rambus will be able to benefit from FD-SOI’s reduced silicon geometries and lower power consumption at 28nm and below in its future memory and interface solutions. This is part of a comprehensive agreement between the two companies, which covers […]

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American Semiconductor has announced the FleX-MCU™ product family. Thumbnail

American Semiconductor has announced the FleX-MCU™ product family.

Posted on June 17, 2013
In Industry Buzz
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American Semiconductor has announced the FleX-MCU™ product family. Leveraging an SOI starting wafer, the FleX-MCU is the world’s first physically flexible microcontroller fabricated using the FleX™ Silicon-on-Polymer™ process. The FleX-MCU is an 8-bit RISC microcontroller with 8KB embedded RAM operating up to 20MHz, and is the initial product for a full portfolio of physically flexible […]

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In the three months following Peregrine Semi’s announcement of the latest version of its UltraCMOS® process technology, the company has followed with a steady stream of news Thumbnail

In the three months following Peregrine Semi’s announcement of the latest version of its UltraCMOS® process technology, the company has followed with a steady stream of news

Posted on May 31, 2013
In Industry Buzz
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In the three months following Peregrine Semi’s announcement of the latest version of its UltraCMOS® process technology, STeP8 for RF Front End ICs, the company has followed with a steady stream of news. (The UltraCMOS technology is an advanced RF SOI process leveraging bonded silicon-on-sapphire (BSOS) substrates from Soitec.) Recent announcements include: a collaborative sourcing […]

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SiTime has entered the smartphone/tablet/mobile app market with the first MEMS oscillator in a chip scale package (CSP) Thumbnail

SiTime has entered the smartphone/tablet/mobile app market with the first MEMS oscillator in a chip scale package (CSP)

Posted on May 10, 2013
In Industry Buzz
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SiTime, which leverages SOI for high-performance MEMS timing solutions, has entered the smartphone/tablet/mobile app market with the first MEMS oscillator in a chip scale package (CSP). SiTime’s solutions offer area savings of 85%, cut power by 50% and are 15 times more reliable, all of which enable smaller, lower power and longer lasting mobile electronics. […]

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GF’s Two Flavors of FD-SOI – Kengeri Explains (Exclusive ASN Q&A) Thumbnail

GF’s Two Flavors of FD-SOI – Kengeri Explains (Exclusive ASN Q&A)

Posted on April 15, 2013
In Design & Manufacturing, In & Around Our Industry
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Hearing the news that GlobalFoundries would be offering two flavors of FD-SOI, ASN asked the company to explain the strategy further. Here are the responses provided by Subi Kengeri, Vice President of Advanced Technology Architecture. What do you see as the FD-SOI benefits for chip designers? Lower SRAM Vmin for retention and lower operating Vmin […]

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Altis Semiconductor will be a foundry partner for the IBM 180nm SOI technology

Posted on March 18, 2013
In Industry Buzz
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Specialty foundry Altis Semiconductor will be a foundry partner for the IBM 180nm SOI technology. ALTIS will deliver high volume products starting Q2 2013 and will secure capacity increase for 2014 and beyond to address the IBM forecasted demand.  This foundry agreement addresses the next generation of consumer products, including as an example, the RF/SOI […]

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Peregrine has announced the latest version of UltraCMOS® process technology-Semiconductor Technology Platform 8 (STeP8) Thumbnail

Peregrine has announced the latest version of UltraCMOS® process technology-Semiconductor Technology Platform 8 (STeP8)

Posted on March 18, 2013
In Industry Buzz
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Peregrine has announced the latest version of UltraCMOS®  process technology—Semiconductor Technology Platform 8 (STeP8), which the company says enables unmatched performance in RF Front End ICs. STeP8 technology shows a 36% improvement in Ron Coff  performance over STeP5 technology announced just one year ago—dramatically improving the linearity, insertion loss, and isolation capabilities of Peregrine’s RFIC […]

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TowerJazz says its latest RF SOI technology offers the industry’s best figure of merit for antenna switch and antenna tuning applications

Posted on March 18, 2013
In Industry Buzz
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Specialty foundry TowerJazz says its latest RF SOI technology offers the industry’s best figure of merit for antenna switch and antenna tuning applications with Ron-Coff of only 217fs. The technology is driving FEM market share, quickly replacing GaAs implementations and has already been adopted by multiple customers worldwide with over 50 separate designs taped-in with […]

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RDA Microelectronics has begun volume shipments of its RDALN16 GPS LNA

Posted on March 18, 2013
In Industry Buzz
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RDA Microelectronics has begun volume shipments of its RDALN16 GPS LNA for use in Samsung’s 3G handsets deployed in Europe and emerging markets worldwide, such as South America. Developed on SOI, RDA’s GPS LNA is a high gain, low noise, small size amplifier ideally suited for GPS, Galileo and GLONASS applications in 2G and 3G […]

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Skyworks announced that its industry-leading Silicon-on-insulator (SOI) switching technology is now being used by European, Japanese, Korean and North American car manufacturers Thumbnail

Skyworks announced that its industry-leading Silicon-on-insulator (SOI) switching technology is now being used by European, Japanese, Korean and North American car manufacturers

Posted on March 14, 2013
In Industry Buzz
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Skyworks announced that its industry-leading Silicon-on-insulator (SOI) switching technology is now being used by European, Japanese, Korean and North American car manufacturers for advanced infotainment systems. Specifically, Skyworks’ solid state technology is enabling seamless low noise and broadband switching between audio, Blu-ray/DVD, navigation, cell phone and vehicle security display inputs as well as a variety […]

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