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Peregrine and RFMD Settle All Outstanding RF-SOI Litigation

Posted on August 8, 2014
In Industry Buzz
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In RF-SOI news, Peregrine and RFMD announced that they have settled all outstanding claims between the companies (read press release here). The two companies have entered into patent cross licenses and have agreed to dismiss all related litigation. “We are pleased that we have reached agreement with RF Micro Devices and resolved all of our […]

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GF takes multimillion dollar GSS TCAD/EDA license

Posted on August 8, 2014
In Industry Buzz
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Gold Standard Simulations Ltd. (GSS) announced a multimillion dollar contract to license its complete TCAD/EDA tool suite to GlobalFoundries (see press release here).  The fully integrated and automated tool chain includes GARAND, the GSS ‘atomistic’ TCAD simulator; Mystic, the GSS statistical compact model extractor; and RandomSpice, the GSS statistical circuit simulator. The GSS tool suite […]

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New SOI Textbook (and e-book) with contributions by experts at Soitec, GF, TSMC, Leti and more Thumbnail

New SOI Textbook (and e-book) with contributions by experts at Soitec, GF, TSMC, Leti and more

Posted on August 8, 2014
In Industry Buzz
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A new book entitled Silicon-On-Insulator (SOI) Technology, Manufacture and Applications (1st Edition) features contributions by experts at Soitec, GF, TSMC, Leti and more. Billed as “a complete review of this rapidly growing high-speed, low-power semiconductor technology,” the book covers the entire SOI spectrum, from Moore to More than Moore.  It goes into SOI wafer technology,  […]

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FD-SOI: The Best Enabler for Mobile Growth and Innovation Thumbnail

FD-SOI: The Best Enabler for Mobile Growth and Innovation

Posted by on August 8, 2014
In Design & Manufacturing, News & Viewpoints, SOI In Action
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The following in-depth analysis, an IBS study entitled How FD-SOI will Enable Innovation and Growth in Mobile Platform Sales, concludes that the benefits of FD-SOI are overwhelming for mobile platforms through Q4/2017 based on a number of key metrics. In fact, FD-SOI has the ability to support three technology nodes, which can mean a useful […]

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Soitec’s Shipped Enough eSI RF-SOI Substrates to Make over 1.4 Billion Devices Thumbnail

Soitec’s Shipped Enough eSI RF-SOI Substrates to Make over 1.4 Billion Devices

Posted on July 18, 2014
In Industry Buzz
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Soitec estimates that it has shipped enough of its eSI wafers to fabricate more than 1.4 billion RF front-end semiconductor devices. (Read the press release here.)  The proprietary Enhanced Signal Integrity™ (eSI) substrates are now the substrate of choice for manufacturing cost-effective and high-performance radio-frequency (RF) devices providing a power boost for 4G /LTE applications. […]

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Is FD-SOI Cheaper? Why yes!

Posted by on June 27, 2014
In Design & Manufacturing, Editor's Blog, News & Viewpoints
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A debate is raging over at SemiWiki following a post there entitled “Is SOI Really Less Expensive?” by Scotten Jones (you can read it here). Within just over 48 hours, about 30 comments were made, with heavy hitters on both sides of the fence weighing in. While the post itself is about manufacturing economics, the […]

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TowerJazz Releases Enhanced RF-SOI CMOS Process Design Kit for use with Agilent Technologies’ Advanced Design System Software

Posted on June 17, 2014
In Industry Buzz
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Specialty foundry TowerJazz announced the availability of an enhanced RF-SOI CMOS process design kit (PDK) for its 0.18µm process technology (see press release here). The kit was developed for use with Agilent Technologies’ Advanced Design System (ADS) software and targets a wide range of analog markets including front-end modules for mobile phones, tablets and WiFi […]

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IBM Specialty Foundry Shipped Over 7 Billion RF-SOI Chips in Last 3 Years, Launches New RF-SOI Technology Thumbnail

IBM Specialty Foundry Shipped Over 7 Billion RF-SOI Chips in Last 3 Years, Launches New RF-SOI Technology

Posted on June 17, 2014
In Industry Buzz
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  IBM Foundry Solutions announced a new SOI-based technology for RF called 7SW SOI. The company says it is designed for 30 percent better performance than its predecessor, 7RF SOI, with which IBM shipped over seven billion chips in the last three years. The new mobile phone chip technology can help device manufacturers provide consumers […]

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Interview: Leti CEO Malier on the FD-SOI Breakthrough; Leti Days in Grenoble (24-26 June) & Semicon West Thumbnail

Interview: Leti CEO Malier on the FD-SOI Breakthrough; Leti Days in Grenoble (24-26 June) & Semicon West

Posted by on June 17, 2014
In Design & Manufacturing, Editor's Blog, News & Viewpoints
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Some years back, European research giant CEA-Leti made a major commitment to support FD-SOI, partnering with STMicroelectronics, Soitec and IBM.  Now, with the big FD-SOI foundry announcement by Samsung and STMicroelectronics, Leti’s ready to bring its vast expertise to players throughout the value chain, right up through design integration. To learn more about the range […]

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SiTime Enters Wearables, IoT Markets with 32 kHz SOI-MEMS Thumbnail

SiTime Enters Wearables, IoT Markets with 32 kHz SOI-MEMS

Posted on June 8, 2014
In Industry Buzz
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SiTime, which leverages SOI for high-performance MEMS timing solutions, has introduced what it says is the smallest, lowest power 32 kHz TCXO (temperature compensated oscillator – read the press release here). With its tiny footprint and ultra-low power consumption, the SiT1552 MEMS TCXO enables a paradigm shift in the size and battery life of wearable […]

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