ASN

Archive of automotive

Skyworks announced that its industry-leading Silicon-on-insulator (SOI) switching technology is now being used by European, Japanese, Korean and North American car manufacturers Thumbnail

Skyworks announced that its industry-leading Silicon-on-insulator (SOI) switching technology is now being used by European, Japanese, Korean and North American car manufacturers

Posted on March 14, 2013
In Industry Buzz
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Skyworks announced that its industry-leading Silicon-on-insulator (SOI) switching technology is now being used by European, Japanese, Korean and North American car manufacturers for advanced infotainment systems. Specifically, Skyworks’ solid state technology is enabling seamless low noise and broadband switching between audio, Blu-ray/DVD, navigation, cell phone and vehicle security display inputs as well as a variety […]

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NXP has named SOI wafer-leader Soitec as this year’s recipient of the “Best Supplier – Valued Partnership” for the company’s SOI solutions

Posted on October 9, 2012
In Industry Buzz
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NXP has named SOI wafer-leader Soitec as this year’s recipient of the “Best Supplier – Valued Partnership” for the company’s SOI solutions. NXP uses Soitec’s wafers in many of its most successful products for high-volume markets including power, automotive and lighting. The two companies have worked together since 1995.

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NXP’s latest automotive audio amplifiers are built on its SOI-based ABCD technology Thumbnail

NXP’s latest automotive audio amplifiers are built on its SOI-based ABCD technology

Posted on December 12, 2011
In Industry Buzz
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NXP’s latest automotive audio amplifiers are built on its SOI-based ABCD technology, and enable an uninterrupted audio experience during sudden supply voltage drops down to 6V in hybrid electric vehicles, micro-hybrids, mild hybrids, and other cars using start-stop systems. The Class-D TDF8530 offers concert-hall sound, while the TDF8546 Best Efficiency quad Class-AB amplifier cuts power dissipation […]

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Freescale’s new Xtrinsic MMA65xxKW family of accelerometers for advanced airbag sensors Thumbnail

Freescale’s new Xtrinsic MMA65xxKW family of accelerometers for advanced airbag sensors

Posted on December 12, 2011
In Industry Buzz
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Freescale‘s new Xtrinsic MMA65xxKW family of accelerometers for advanced airbag sensors leverages SOI-based high-aspect-ratio (HAR) MEMS  technology, which increases sensitivity and improves reliability.

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Soitec was named NXP’s Best Supplier for Front End Materials & Equipment Thumbnail

Soitec was named NXP’s Best Supplier for Front End Materials & Equipment

Posted on September 21, 2011
In Industry Buzz
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The leading producer of SOI wafers, Soitec was named NXP’s Best Supplier for Front End Materials & Equipment. NXP was one of the first in the industry to use SOI. The relationship with Soitec dates back to 1995, when the two companies began work together on the development of the (then Philips’) breakthrough SOI-based ABCD […]

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NXP’s continues its line of SOI-based automotive CAN transceivers with the next-gen TJA1048 Thumbnail

NXP’s continues its line of SOI-based automotive CAN transceivers with the next-gen TJA1048

Posted on September 21, 2011
In Industry Buzz
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NXP‘s continues its line of SOI-based automotive CAN transceivers with the next-gen TJA1048 for automotive engine, body control and gateway apps. SOI enables extremely low emission and high immunity against EMI, and protects the bus pins against transients in the automotive environment.

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Interview: How NXP’s SOI Technology Enables Major Advance in Automotive Position Sensors Thumbnail

Interview: How NXP’s SOI Technology Enables Major Advance in Automotive Position Sensors

Posted by on August 8, 2011
In ASN #18, End-User Apps, SOI In Action
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Guenter Reiniger, Marketing Manager for NXP’s Automotive Sensors, explains how SOI helps eliminate the need for external components in a new magnetic sensor family. Advanced Substrate News (ASN): NXP recently announced the KMA210, the first in a new family of magnetoresistive (MR) sensor chips. What is it used for? Guenter Reiniger (GR): The KMA210 is […]

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Freescale and CEA-Leti recently celebrated 10 years of MEMS collaboration Thumbnail

Freescale and CEA-Leti recently celebrated 10 years of MEMS collaboration

Posted on April 4, 2011
In Industry Buzz
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Freescale and CEA-Leti recently celebrated 10 years of MEMS collaboration, which includes producing a million SOI-based accelerometers a year for airbag and ESC apps in the automotive market.   (Image courtesy: Leti and Freescale)

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NXP opens the door for widespread adoption of low-cost CAN in an increasing variety of industrial and automation applications Thumbnail

NXP opens the door for widespread adoption of low-cost CAN in an increasing variety of industrial and automation applications

Posted on February 9, 2011
In Industry Buzz
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With the new LPC11C22 and LPC11C24 integrated CAN transceiver microcontroller solution, NXP opens the door for widespread adoption of low-cost CAN in an increasing variety of industrial and automation applications for factories, buildings and in the home. An SiP solution, the CAN transceiver is built on SOI.

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Soitec has inked deals with Peregrine and Sumitomo

Posted on February 9, 2011
In Industry Buzz
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In recent months, Soitec has inked deals with: • Peregrine for joint development and production of a new, bonded silicon-on-sapphire (SOS) substrate for RFICs; • and with Sumitomo for the development of engineered gallium nitride (GaN) substrates for applications like high brightness LEDs as well as electric power devices designed for hybrid and full electric […]

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