ASN

Archive of automotive

NXP’s continues its line of SOI-based automotive CAN transceivers with the next-gen TJA1048 Thumbnail

NXP’s continues its line of SOI-based automotive CAN transceivers with the next-gen TJA1048

Posted on September 21, 2011
In Industry Buzz
Tagged with , , , , ,

NXP‘s continues its line of SOI-based automotive CAN transceivers with the next-gen TJA1048 for automotive engine, body control and gateway apps. SOI enables extremely low emission and high immunity against EMI, and protects the bus pins against transients in the automotive environment.

Continue ReadingLeave a Comment
Interview: How NXP’s SOI Technology Enables Major Advance in Automotive Position Sensors Thumbnail

Interview: How NXP’s SOI Technology Enables Major Advance in Automotive Position Sensors

Posted by on August 8, 2011
In ASN #18, End-User Apps, SOI In Action
Tagged with , , , , , , , , ,

Guenter Reiniger, Marketing Manager for NXP’s Automotive Sensors, explains how SOI helps eliminate the need for external components in a new magnetic sensor family. Advanced Substrate News (ASN): NXP recently announced the KMA210, the first in a new family of magnetoresistive (MR) sensor chips. What is it used for? Guenter Reiniger (GR): The KMA210 is […]

Continue ReadingLeave a Comment
Freescale and CEA-Leti recently celebrated 10 years of MEMS collaboration Thumbnail

Freescale and CEA-Leti recently celebrated 10 years of MEMS collaboration

Posted on April 4, 2011
In Industry Buzz
Tagged with , , , ,

Freescale and CEA-Leti recently celebrated 10 years of MEMS collaboration, which includes producing a million SOI-based accelerometers a year for airbag and ESC apps in the automotive market.   (Image courtesy: Leti and Freescale)

Continue ReadingLeave a Comment
NXP opens the door for widespread adoption of low-cost CAN in an increasing variety of industrial and automation applications Thumbnail

NXP opens the door for widespread adoption of low-cost CAN in an increasing variety of industrial and automation applications

Posted on February 9, 2011
In Industry Buzz
Tagged with , , , ,

With the new LPC11C22 and LPC11C24 integrated CAN transceiver microcontroller solution, NXP opens the door for widespread adoption of low-cost CAN in an increasing variety of industrial and automation applications for factories, buildings and in the home. An SiP solution, the CAN transceiver is built on SOI.

Continue ReadingLeave a Comment

Soitec has inked deals with Peregrine and Sumitomo

Posted on February 9, 2011
In Industry Buzz
Tagged with , , , , , , ,

In recent months, Soitec has inked deals with: • Peregrine for joint development and production of a new, bonded silicon-on-sapphire (SOS) substrate for RFICs; • and with Sumitomo for the development of engineered gallium nitride (GaN) substrates for applications like high brightness LEDs as well as electric power devices designed for hybrid and full electric […]

Continue ReadingLeave a Comment
From STMicroelectronics, it latest BCD process on SOI enables Thumbnail

From STMicroelectronics, it latest BCD process on SOI enables

Posted on December 15, 2010
In Industry Buzz
Tagged with , , , , ,

From STMicroelectronics, it latest BCD process on SOI enables: • The STOD03A, a power-saving power-supply IC for ultra-thin AMOLED (Active-Matrix Organic LED) handset displays. It integrates analog, digital and closely spaced high-power circuitry on the same chip. • For advanced airbag systems, the new AIS1xxxDS family integrates a high-g acceleration MEMS sensor with an on-chip […]

Continue ReadingLeave a Comment
Leveraging its SOI-based A-BCD mixed-signal HV process technology, NXP’s announced… Thumbnail

Leveraging its SOI-based A-BCD mixed-signal HV process technology, NXP’s announced…

Posted on December 15, 2010
In Industry Buzz
Tagged with , , ,

Leveraging its SOI-based A-BCD mixed-signal HV process technology, NXP’s announced: • the ASL1010NTK and ASL1010PHN, driver IC solutions designed for vehicle LED headlights and tail lights, the industry’s first to integrate critical functionality such as temperature feedback, fault detection, control for dimming, and short circuit protection. • Shipment of its two millionth FlexRay transceiver – […]

Continue ReadingLeave a Comment
Thinking Thin: NXP’s EZ-HV-SOI Thumbnail

Thinking Thin: NXP’s EZ-HV-SOI

Posted on December 13, 2010
In ASN #16, End-User Apps, SOI In Action
Tagged with , , , , , , ,

First announced a decade ago, NXP’s EZ-HV™ is process technology for the production of commercial high-voltage (HV) SOI-enabled ICs.  It is at the heart of NXP’s GreenChip technology, and is ideal for implementing optimal solutions for a wide range of lighting applications. In high-power systems, it allows sophisticated control logic and high voltage drive circuits […]

Continue ReadingLeave a Comment

Atmel’s new ATA6663/64 transceiver families

Posted on November 22, 2010
In Industry Buzz
Tagged with ,

With its high-voltage SOI process, Atmel’s new ATA6663/64 transceiver families for LIN automotive networking applications take 10x less wake-up power and can reduce system costs by 40%.

Continue ReadingLeave a Comment
New from NXP on SOI Thumbnail

New from NXP on SOI

Posted on November 22, 2010
In Industry Buzz
Tagged with , ,

New from NXP on SOI: • for automotives, the most-advanced, high-speedCAN transceiver, the TJA1043; • for ultra-slim power supplies for TVs, PCs and more,  the GreenChip TEA1713 resonant half-bridge converter. • the GreenChip TEA1733(L) – a low-cost IC that increases energy efficiency and standby performance of power supplies under 75W.

Continue ReadingLeave a Comment