NXP’s latest automotive audio amplifiers are built on its SOI-based ABCD technology, and enable an uninterrupted audio experience during sudden supply voltage drops down to 6V in hybrid electric vehicles, micro-hybrids, mild hybrids, and other cars using start-stop systems. The Class-D TDF8530 offers concert-hall sound, while the TDF8546 Best Efficiency quad Class-AB amplifier cuts power dissipation …

Freescale‘s new Xtrinsic MMA65xxKW family of accelerometers for advanced airbag sensors leverages SOI-based high-aspect-ratio (HAR) MEMS  technology, which increases sensitivity and improves reliability.

The leading producer of SOI wafers, Soitec was named NXP’s Best Supplier for Front End Materials & Equipment. NXP was one of the first in the industry to use SOI. The relationship with Soitec dates back to 1995, when the two companies began work together on the development of the (then Philips’) breakthrough SOI-based ABCD …

NXP‘s continues its line of SOI-based automotive CAN transceivers with the next-gen TJA1048 for automotive engine, body control and gateway apps. SOI enables extremely low emission and high immunity against EMI, and protects the bus pins against transients in the automotive environment.

Guenter Reiniger, Marketing Manager for NXP’s Automotive Sensors, explains how SOI helps eliminate the need for external components in a new magnetic sensor family. Advanced Substrate News (ASN): NXP recently announced the KMA210, the first in a new family of magnetoresistive (MR) sensor chips. What is it used for? Guenter Reiniger (GR): The KMA210 is …

Freescale and CEA-Leti recently celebrated 10 years of MEMS collaboration, which includes producing a million SOI-based accelerometers a year for airbag and ESC apps in the automotive market.   (Image courtesy: Leti and Freescale)

With the new LPC11C22 and LPC11C24 integrated CAN transceiver microcontroller solution, NXP opens the door for widespread adoption of low-cost CAN in an increasing variety of industrial and automation applications for factories, buildings and in the home. An SiP solution, the CAN transceiver is built on SOI.

In recent months, Soitec has inked deals with: • Peregrine for joint development and production of a new, bonded silicon-on-sapphire (SOS) substrate for RFICs; • and with Sumitomo for the development of engineered gallium nitride (GaN) substrates for applications like high brightness LEDs as well as electric power devices designed for hybrid and full electric …

From STMicroelectronics, it latest BCD process on SOI enables: • The STOD03A, a power-saving power-supply IC for ultra-thin AMOLED (Active-Matrix Organic LED) handset displays. It integrates analog, digital and closely spaced high-power circuitry on the same chip. • For advanced airbag systems, the new AIS1xxxDS family integrates a high-g acceleration MEMS sensor with an on-chip …

Leveraging its SOI-based A-BCD mixed-signal HV process technology, NXP’s announced: • the ASL1010NTK and ASL1010PHN, driver IC solutions designed for vehicle LED headlights and tail lights, the industry’s first to integrate critical functionality such as temperature feedback, fault detection, control for dimming, and short circuit protection. • Shipment of its two millionth FlexRay transceiver – …