Interview: How NXP’s SOI Technology Enables Major Advance in Automotive Position Sensors
Posted by Adele HARS on August 8, 2011In ASN #18, End-User Apps, SOI In Action
Tagged with ABCD, apps, ASIC, automotive, design, embedded, high-temp, NXP, sensors, SOI
Guenter Reiniger, Marketing Manager for NXP’s Automotive Sensors, explains how SOI helps eliminate the need for external components in a new magnetic sensor family. Advanced Substrate News (ASN): NXP recently announced the KMA210, the first in a new family of magnetoresistive (MR) sensor chips. What is it used for? Guenter Reiniger (GR): The KMA210 is …
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