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Tronics Manufactures the First Piezoresistive Nanowire 6DOF Inertial MEMS (SOI) Thumbnail

Tronics Manufactures the First Piezoresistive Nanowire 6DOF Inertial MEMS (SOI)

Posted on April 9, 2014
In Industry Buzz
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       A year after announcing the industrialization of CEA-Leti’s breakthrough M&NEMS technologies, Tronics has successfully designed and manufactured the first batch of six-degrees-of-freedom (6DOF) MEMS chips, with 3 accelerometers and 3 gyroscopes on a single die (press release here). Built on SOI wafers, with a die size of less than 4mm2, this 6DOF MEMS […]

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Eveon and Leti Leverage SOI in Milestone: Fabrication Of Smart Bolus-type Micro-pump for Drug Delivery Thumbnail

Eveon and Leti Leverage SOI in Milestone: Fabrication Of Smart Bolus-type Micro-pump for Drug Delivery

Posted on March 26, 2014
In Industry Buzz
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(Courtesy: CEA-Leti)   Eveon and CEA-Leti have demonstrated liquid-pumping for smart drug delivery in the bolus mode using a silicon-based micro-pump fabricated with a standard MEMS process. (Read full press release here.) The milestone is the first functional micro-pump integration using MEMS standard process on Leti’s 200mm line. It is a result of FluMin3, Eveon […]

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Soitec Semicon Japan Presentation on Substrates for Mobile Era Now On weSRCH Thumbnail

Soitec Semicon Japan Presentation on Substrates for Mobile Era Now On weSRCH

Posted on March 19, 2014
In Industry Buzz
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  (Image courtesy: SEMI, Soitec, weSRCH) An excellent Soitec presentation from Semicon Japan entitled Innovative Substrates in the Mobile Era is now available on weSRCH (click here to view it). Given by Soitec COO Paul Boudre, it details the role of SOI wafers in RF and FD-SOI for mobile.

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Excellent Semiwiki piece examines ST’s ADC breakthrough (FD-SOI, ISSCC)

Posted on February 28, 2014
In Industry Buzz
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Semiwiki blogger Paul McLellan has written an excellent piece on the FD-SOI analog-to-digital converter (ADC) that ST presented recently at ISSCC. (Read the article here.)  He notes, “This is a very high performance ADC and thus an example of complex high-precision analog design in FD-SOI.”  He concludes, “Together with the low-power capability of the 28nm […]

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FD-SOI, Body-Biasing Shine in 10x Faster DSP With Ultra-Wide Voltage Range Thumbnail

FD-SOI, Body-Biasing Shine in 10x Faster DSP With Ultra-Wide Voltage Range

Posted by on February 20, 2014
In Conferences, Design & Manufacturing, Editor's Blog, R&D/Labnews
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Body-biasing design techniques, uniquely available in FD-SOI, have allowed STMicroelectronics and CEA-Leti to demonstrate a DSP that runs 10x faster than anything the industry’s seen before at ultra-low voltages (read press release here). In the mobile world (not to mention the IoT), the role of DSPs is becoming ever more important. All those things you […]

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SemiWiki heralds Fujitsu benchmarks on high-performance 14nm FD-SOI chip

Posted on February 18, 2014
In Industry Buzz
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A new SemiWiki piece by Eric Esteve heralds Fujitsu’s 14nm FD-SOI benchmark results for a high-performance networking chip (click here to read the post). In “If you still think that FDSOI is for low performance IC only…”, Esteve explains why power is critical in these high-end ASICs. He then leads readers through the benchmark results […]

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IP for FD-SOI: Examples from ST Thumbnail

IP for FD-SOI: Examples from ST

Posted by on February 14, 2014
In Design & Manufacturing, Editor's Blog
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Interested in energy-efficient SOCs? At the IP-SOC Conference last fall, STMicroelectronics’ Giorgio Cesana presented examples of the technological competitiveness of FD-SOI IP for memories, cores, ultra-low voltage and analog. Here’s a brief recap. The complete presentation, entitled “FD-SOI Technology for Energy-Efficient SoCs: IP Development Examples” is available on the Design & Reuse website (click here […]

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RF-SOI Powerhouse Peregrine Introduces UltraCMOS® Global 1 Reconfigurable RF Front-End System Thumbnail

RF-SOI Powerhouse Peregrine Introduces UltraCMOS® Global 1 Reconfigurable RF Front-End System

Posted on February 7, 2014
In Industry Buzz
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Peregrine’s UltraCMOS® Global 1, the first reconfigurable RFFE system, includes a multimode, multiband power amplifier, post-PA switch, antenna switch and antenna tuner on a single chip. (Image courtesy: Peregrine Semiconductor) RF-SOI powerhouse Peregrine Semiconductor has announced the Global 1 (press release here), billed as “the industry’s first reconfigurable RF front-end system”.  The company says it […]

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Debiotech expands target market for SOI-MEMS based solution to Type 2 diabetes Thumbnail

Debiotech expands target market for SOI-MEMS based solution to Type 2 diabetes

Posted on February 7, 2014
In Industry Buzz
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(Images courtesy: Debiotech) Debiotech has debuted the JewelPUMP2, a new product dedicated to the Diabetes Type 2 market, based on Debiotech’s innovative JewelPUMP platform (press release here). By using its JewelPUMP platform, which is already in the industrialization phase and in preparation for the CE marking, Debiotech will be able to introduce the JewelPUMP2 shortly […]

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SOI Reliability Key to SiTime MEMS Lifetime Warranty Thumbnail

SOI Reliability Key to SiTime MEMS Lifetime Warranty

Posted on January 31, 2014
In Industry Buzz
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(Courtesy: SiTime) The extreme reliability of SiTime’s MEMS devices, using SOI technology, has enabled the company to cover all its MEMS oscillators and clock generators with a lifetime warranty (press release here). SiTime contributed an excellent article to ASN a few years ago (click here to read it), explaining how their radical SOI-based approach put […]

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