ASN

Archive of apps

IBM Specialty Foundry Shipped Over 7 Billion RF-SOI Chips in Last 3 Years, Launches New RF-SOI Technology Thumbnail

IBM Specialty Foundry Shipped Over 7 Billion RF-SOI Chips in Last 3 Years, Launches New RF-SOI Technology

Posted on June 17, 2014
In Industry Buzz
Tagged with , , , , , , , , ,

  IBM Foundry Solutions announced a new SOI-based technology for RF called 7SW SOI. The company says it is designed for 30 percent better performance than its predecessor, 7RF SOI, with which IBM shipped over seven billion chips in the last three years. The new mobile phone chip technology can help device manufacturers provide consumers […]

Continue ReadingLeave a Comment
Interview: Leti CEO Malier on the FD-SOI Breakthrough; Leti Days in Grenoble (24-26 June) & Semicon West Thumbnail

Interview: Leti CEO Malier on the FD-SOI Breakthrough; Leti Days in Grenoble (24-26 June) & Semicon West

Posted by on June 17, 2014
In Design & Manufacturing, Editor's Blog, News & Viewpoints
Tagged with , , , , , , , , , , , , , , , , , ,

Some years back, European research giant CEA-Leti made a major commitment to support FD-SOI, partnering with STMicroelectronics, Soitec and IBM.  Now, with the big FD-SOI foundry announcement by Samsung and STMicroelectronics, Leti’s ready to bring its vast expertise to players throughout the value chain, right up through design integration. To learn more about the range […]

Continue ReadingLeave a Comment
SiTime Enters Wearables, IoT Markets with 32 kHz SOI-MEMS Thumbnail

SiTime Enters Wearables, IoT Markets with 32 kHz SOI-MEMS

Posted on June 8, 2014
In Industry Buzz
Tagged with , , , , , , , ,

SiTime, which leverages SOI for high-performance MEMS timing solutions, has introduced what it says is the smallest, lowest power 32 kHz TCXO (temperature compensated oscillator – read the press release here). With its tiny footprint and ultra-low power consumption, the SiT1552 MEMS TCXO enables a paradigm shift in the size and battery life of wearable […]

Continue ReadingLeave a Comment

Peregrine Ships Next-Gen UltraCMOS® 10 RF-SOI Switches for Smartphones

Posted on May 28, 2014
In Industry Buzz
Tagged with , , , , , , , , ,

Peregrine Semi has shipped the first RF switches built on the company’s SOI-based UltraCMOS 10 technology platform. With partner GlobalFoundries, Peregrine also announces the completion of product and process qualification for the advanced RF-SOI technology (see press release here). The 130 nm technology combines the performance of UltraCMOS technology with the economies of SOI, and […]

Continue ReadingLeave a Comment

Soitec and Simgui (China) Partner on SOI Wafer Production for RF and Power Apps

Posted on May 28, 2014
In Industry Buzz
Tagged with , , , , , , , , , , , ,

Soitec and Simgui (Shanghai, China) are partnering on SOI wafer production for RF and power applications. The newly signed deal (read press release here) includes a licensing and technology transfer agreement. Simgui will establish a high-volume SOI manufacturing line using Soitec’s proprietary Smart Cut™ technology to directly supply the Chinese market. In addition, Simgui will […]

Continue ReadingLeave a Comment
Soitec Paper on Wafers for RF-SOI Now Available on weSRCH Thumbnail

Soitec Paper on Wafers for RF-SOI Now Available on weSRCH

Posted on May 7, 2014
In Industry Buzz
Tagged with , , , , ,

A Soitec white paper entitled Innovative RF-SOI Wafers for Wireless Applications is now available on the weSRCH website (see paper here). The paper explains the value of using RF-SOI substrates, and what the latest generation of Soitec’s WaveSOI™ and eSI™ wafers brings to RF IC performance. It also explains how these substrates simplify the IC […]

Continue ReadingLeave a Comment

Kalray considers FD-SOI for many-core processors (Electronics360)

Posted on May 7, 2014
In Industry Buzz
Tagged with , , , , , , , , , , ,

Kalray is considering an FD-SOI version of its family of programmable multicore processors, reports Peter Clarke of Electronics360 (see article here).  Clarke says that Kalray’s director of solutions and software services told him that while they’re currently on 28nm bulk, they’ve had customer interest in an FD-SOI version of a planned 64-core chip for telecom, […]

Continue ReadingLeave a Comment
New Fraunhofer hi-temp SOI CMOS chips function at 300ºC Thumbnail

New Fraunhofer hi-temp SOI CMOS chips function at 300ºC

Posted on May 7, 2014
In Industry Buzz
Tagged with , , , , ,

Fraunhofer scientists have developed a new type of high-temperature SOI-based process for making extremely compact chips that withstand temperatures of up to 300 degrees Celsius (press release here).  At a characteristic dimension of 0.35 µm, they are considerably smaller than the high-temperature chips available today, they say.  Targets include oil production and geothermal power applications. […]

Continue ReadingLeave a Comment
Interview: Peregrine’s new Marketing VP on Global 1®, RF-SOI drivers, UltraCMOS 10 Thumbnail

Interview: Peregrine’s new Marketing VP on Global 1®, RF-SOI drivers, UltraCMOS 10

Posted on April 25, 2014
In Design & Manufacturing, End-User Apps
Tagged with , , , , , , , , , , , , ,

Interview with : Duncan Pilgrim, VP of marketing ASN had a chance to catch up with Duncan Pilgrim, Peregrine Semi’s new VP of Marketing. Here he shares insights into the company’s new reconfigurable RF front end. Duncan Pilgrim is the VP of marketing at Peregrine Semiconductor. A 17-year semiconductor industry veteran, he previously served as VP […]

Continue ReadingLeave a Comment
Tronics Manufactures the First Piezoresistive Nanowire 6DOF Inertial MEMS (SOI) Thumbnail

Tronics Manufactures the First Piezoresistive Nanowire 6DOF Inertial MEMS (SOI)

Posted on April 9, 2014
In Industry Buzz
Tagged with , , , , , , , , ,

       A year after announcing the industrialization of CEA-Leti’s breakthrough M&NEMS technologies, Tronics has successfully designed and manufactured the first batch of six-degrees-of-freedom (6DOF) MEMS chips, with 3 accelerometers and 3 gyroscopes on a single die (press release here). Built on SOI wafers, with a die size of less than 4mm2, this 6DOF MEMS […]

Continue ReadingLeave a Comment