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Excellent Semiwiki piece examines ST’s ADC breakthrough (FD-SOI, ISSCC)

Posted on February 28, 2014
In Industry Buzz
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Semiwiki blogger Paul McLellan has written an excellent piece on the FD-SOI analog-to-digital converter (ADC) that ST presented recently at ISSCC. (Read the article here.)  He notes, “This is a very high performance ADC and thus an example of complex high-precision analog design in FD-SOI.”  He concludes, “Together with the low-power capability of the 28nm […]

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A New Open Foundry Source for FD-SOI? Soon, Says ST. Watch This Space. Thumbnail

A New Open Foundry Source for FD-SOI? Soon, Says ST. Watch This Space.

Posted by on January 31, 2014
In Editor's Blog, News & Viewpoints
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STMicroelectronics will soon be announcing a “major foundry player” that will be both a dual FD-SOI manufacturing source for ST, plus an open source for the industry.  This important piece of news came out of the company’s Q4 and FY13 presentation in Paris on January 28th. While ST signed a licensing agreement with GlobalFoundries a […]

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IEDM ’13 (Part 2): More SOI and Advanced Substrate Papers Thumbnail

IEDM ’13 (Part 2): More SOI and Advanced Substrate Papers

Posted by on December 19, 2013
In Conferences, Editor's Blog, Paperlinks
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SOI and other advanced substrates were the basis for dozens of excellent papers at IEDM ’13.  Last week we covered the FD-SOI papers (click here if you missed that piece). In this post, we’ll cover the other major SOI et al papers – including those on FinFETs, RF and various advanced devices. Brief summaries, culled […]

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New FD-SOI Presentation by ST on Design & Reuse Looks at Cost, IP Thumbnail

New FD-SOI Presentation by ST on Design & Reuse Looks at Cost, IP

Posted on November 18, 2013
In Industry Buzz
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Design & Reuse has posted an excellent presentation by Giorgio Cesana of ST entitled FD-SOI Technology for Energy Efficient SoCs: IP Development Examples (click here). It explains why the technology is faster-cooler-simpler – and more cost effective. After a quick tour of the tech basics, Cesana gets into cost/performance ratios, comparing the technology to bulk […]

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Peregrine Ships 2 Billionth UltraCMOS Chip, Signs with GlobalFoundries,  Celebrates 25 Years of RF-SOI Thumbnail

Peregrine Ships 2 Billionth UltraCMOS Chip, Signs with GlobalFoundries, Celebrates 25 Years of RF-SOI

Posted on November 4, 2013
In Industry Buzz
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Peregrine Semiconductor announced that it has shipped its 2 billionth chip, released version 10 of its UltraCMOS RF-SOI technology, and is working with GlobalFoundries. UltraCMOS technology is an advanced RF-SOI process, the latest versions of which leverage bonded silicon-on-sapphire (BSOS) substrates from Soitec. Peregrine did an excellent article for ASN last spring, clearly explaining the use […]

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ASN Exclusive Interview: Skyworks on SOI for RF Thumbnail

ASN Exclusive Interview: Skyworks on SOI for RF

Posted by on November 4, 2013
In Editor's Blog
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Skyworks has a growing portfolio of chips on SOI. Kevin Walsh, the company’s Marketing Director of Analog Solutions, tells ASN why. Advanced Substrate News: Can you tell us generally about Skyworks’ vision and position in the market? Kevin Walsh: Skyworks Solutions, Inc. is an innovator of high performance analog semiconductors and one of the world’s […]

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Peregrine Semi’s RF Chip On Bonded SOS Is Main Antenna Switch in Samsung Galaxy S4 LTE-A  – That’s SOI! Thumbnail

Peregrine Semi’s RF Chip On Bonded SOS Is Main Antenna Switch in Samsung Galaxy S4 LTE-A – That’s SOI!

Posted by on September 26, 2013
In Editor's Blog
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Peregrine has announced that the company’s new UltraCMOS antenna switch is driving RF performance in the Samsung Galaxy S4 LTE-A smartphone. UltraCMOS technology is an advanced RF SOI process leveraging bonded silicon-on-sapphire (BSOS) substrates from Soitec. The new dual SP7T Multiswitch in the Samsung leverages Peregrine’s latest version of its UltraCMOS® process technology, STeP8 for RF […]

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SOI – 3D Integration – Subthreshold Microelectronics: Register now for the IEEE S3S! Thumbnail

SOI – 3D Integration – Subthreshold Microelectronics: Register now for the IEEE S3S!

Posted by (ARM) on September 13, 2013
In Conferences
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Last May, we already let you know about the IEEE S3S conference, founded upon the co-location of The IEEE International SOI Conference and the IEEE Subthreshold Microelectronics Conference, completed by an additional track on 3D Integration. Today, we would like let you know that the advance program is available, and to attract your attention on […]

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Cambridge CMOS Sensors (CCMOS) says it is seeing increasing sales of its gas-sensing microsystems and is on the cusp of more major contracts.

Posted on August 26, 2013
In Industry Buzz
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Cambridge CMOS Sensors (CCMOS) says it is seeing increasing sales of its gas-sensing microsystems and is on the cusp of more major contracts. Gas-sensing technology has a broad range of applications, including domestic gas detectors, industrial safety, explosive detection, medical diagnostics and environmental monitoring. A Cambridge University spin-off that recently raised an additional £4.5m, the […]

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A leader in devices for extreme temperatures (-55°C to +225°C), Cissoid continues rolling out new SOI-based products for power management, power conversion and signal conditioning. Thumbnail

A leader in devices for extreme temperatures (-55°C to +225°C), Cissoid continues rolling out new SOI-based products for power management, power conversion and signal conditioning.

Posted on August 26, 2013
In Industry Buzz
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A leader in devices for extreme temperatures (-55°C to +225°C), Cissoid continues rolling out new SOI-based products for power management, power conversion and signal conditioning. Additions over the last year include: FUJI, a High Reliability 3.5W DC-DC Converter with Triple Output 5V, 3.3V & 1.8V CHT-RIGEL, a High Reliability Adjustable Voltage Regulator for up to […]

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