The Move to Fully-Depleted
• FD-SOI: ST/Chery interview; CMP's MPW runs; IBS on cost-savings
• FD & wafers: SEH & Soitec
• IBM's Fin-on-Oxide/FinFET
• SOI Consortium – FD-SOI & wafer capacity for mobile
FD-SOI Industrialization
• Technology: ST/Soitec white paper excerpts
• Apps – ST-Ericsson's NovaThor at 28nm (interview)
• 20nm & Beyond: Chenming Hu; Leti
• Wafers: Soitec's Roadmap
• SOI Consortium – benchmarking
SOI on the Roadmaps
• FD-SOI: ST & 28nm SOCs; ARM & design porting
• Apps – NXP automotive sensors, AMD 32nm Bulldozer
• SOI Conference (IBM, Intel, Leti, GloFo, ST, ARM, Peregrine & more)
• SOI Consortium – FD-SOI whitepaper overview & excerpts
FD-SOI: The Right Choice & more
• Planar FD-SOI - wafers, Consortium update
• Apps – Xbox 360 CPU/GPU, ST/power
• GlobalFoundries on ESD
• Wafer stacking, MEMS, photonics & more
Freescale‘s new Xtrinsic MMA65xxKW family of accelerometers for advanced airbag sensors leverages SOI-based high-aspect-ratio (HAR) MEMS technology, which increases sensitivity and improves reliability.
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Freescale and CEA-Leti recently celebrated 10 years of MEMS collaboration, which includes producing a million SOI-based accelerometers a year for airbag and ESC apps in the automotive market. (Image courtesy: Leti and Freescale)
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All of VTI Technologies’ MEMS products are based on SOI wafers. The company’s CMA 3000 multi-axis accelerometer is the “stride sensor chip” in the miCoach real-time training system launched by adidas and Samsung last year. (Courtesy: VTI Technologies, adidas and Samsung)
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