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Archive of 45nm

A new generation of neurosynaptic computing chips is designed to emulate the brain’s abilities for perception, action and cognition

Posted on September 21, 2011
In Industry Buzz
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Built on 45nm SOI CMOS by IBM researchers, a new generation of neurosynaptic computing chips is designed to emulate the brain’s abilities for perception, action and cognition. The next phase of the project has received $21 million in new funding from DARPA.

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Topple the Towers: Freescale’s SOI SoC in Alcatel-Lucent’s lightRadio Thumbnail

Topple the Towers: Freescale’s SOI SoC in Alcatel-Lucent’s lightRadio

Posted on February 25, 2011
In Editor's Blog
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45nm SOI is a big part of the big news from the Mobile World Congress 2011 in Barcelona last week. That’s because Freescale’s newly announced QorIQ Qonverge is the “base-station on a chip” in the Alcatel-Lucent lightRadio™ technology, which was the talk of the show. (See the video.) The Bell Labs guys came up with …

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The MOSIS Service

Posted on December 4, 2009
In Industry Buzz
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The MOSIS Service, a leading provider of semiconductor fabrication solutions, has expanded its relationship with IBM to 45nm SOI for System-on-Chips (SOCs) and 180nm 7RF SOI for RF switches. This provides a low-cost route to prototyping and low-volume production.

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New 45nm chips from AMD

Posted on July 30, 2009
In Industry Buzz
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New 45nm chips from AMD (which builds all its 64-bit microprocessors on SOI): • Athlon™ II X2 250 processor for mainstream consumers and the Phenom™ II X2 550 Black Edition processor, the first ever dual-core AMD Phenom II CPU. • the Six-Core AMD Opteron™ processor family, to address rising demand for increased performance balanced by …

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IBM & SOI: Delivering on Customer Priorities

Posted by Dr. Raj SINGH (IBM) on July 30, 2009
In ASN #13, Design & Manufacturing, In & Around Our Industry
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How IBM’s Cu-45HP ASIC leverages SOI for an overall lowering of power. Initiatives for a smarter and greener planet are creating ubiquitous demand for higher intelligence, integration and performance at the lowest possible power. New regulations, such as Energy Star, are being contemplated for many industries. Application and system requirements are prompting a dramatic shift …

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45nm SOI

Posted on December 3, 2008
In ASN #11, Design & Manufacturing, In & Around Our Industry
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The Foundry Offering. The IP. The Collaboration. > It’s All Here IBM Announces the Industry’s First 45nm SOI Foundry Offering. IBM’s new 45nm SOI foundry offering is designed to meet the demands of emerging high-performance, low-power markets. The new offering adds ARM’s industry-standard design tools and libraries to the intellectual property (IP) already available through …

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IBM

Posted on July 16, 2008
In Industry Buzz
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IBM: • IBM has licensed the multi-protocol SerDes cell from Rambus for high-performance and low-power 45nm SOI. • For the most challenging arithmetic operations, IBM’s new PowerXCell™ 8i (65nm SOI) offers five-times the speed of the original Cell/B.E. processor. • The “Roadrunner” supercomputer at Los Alamos shot to #1 on the TOP500™ Supercomputer list with …

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TSMC Reports Industry-Leading Performance

Posted by Samuel FUNG (Taiwan Semiconductor Manufacturing Company) on May 14, 2008
In ASN #9, Design & Manufacturing, In & Around Our Industry
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The world’s biggest foundry says its 45nm SOI process technology for the newest generation of high performance CPUs is the best in terms of speed, energy and density in chips using standard nitrided oxide for the gate dielectric. In terms of speed, energy and density, at TSMC we believe we have developed the industry’s best …

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Freescale

Posted on May 14, 2008
In Industry Buzz
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Freescale: • Power and die size are cut in half with Freescale’s jump from 90nm SOI to 45nm SOI for a new multi-core communications platform (a PowerQUICC™ evolution). Freescale will manufacture, as can IBM, Chartered and existing foundry partners. 32 nm SOI is next in the path. • Sony’s XDCAM HD422 (fig. 1), the flagship …

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KLA-Tencor says its new WaferSight 2 is the industry’s first enabling wafer suppliers and chipmakers to measure bare wafer flatness

Posted on May 14, 2008
In Industry Buzz
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KLA-Tencor says its new WaferSight 2 is the industry’s first enabling wafer suppliers and chipmakers to measure bare wafer flatness, shape, edge roll-off and nanotopography in a single metrology system for 45nm and beyond. SOI wafer-supplier Soitec was a beta site.

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