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Archive of 3D

NXP, Qualcomm, Skyworks to Keynote IoT Theme in Upcoming IEEE SOI-3D-SubVt (S3S) Conference (San Francisco, Oct.’16) – Late News Submissions Open, Advance Program Available Thumbnail

NXP, Qualcomm, Skyworks to Keynote IoT Theme in Upcoming IEEE SOI-3D-SubVt (S3S) Conference (San Francisco, Oct.’16) – Late News Submissions Open, Advance Program Available

Posted by on August 15, 2016
In Conferences, In & Around Our Industry
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IEEE S3S Conference 10-13 October 2016 Hyatt Regency San Francisco Airport IEEE SOI–3D–Subthreshold Microelectronics Technology Unified Conference Theme: Energy Efficient Technology for the Internet of Things Late News submissions open and Advance Program available The IEEE S3S Conference brings together 3 key technologies that will play a major role in tomorrow’s industry: SOI, 3D integration, […]

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Reminder re: top SOI Conference – IEEE S3S ’16 (SOI/3D/SubVt) CFP deadline April 15th. Keynotes: NXP, Skyworks, Qualcomm Thumbnail

Reminder re: top SOI Conference – IEEE S3S ’16 (SOI/3D/SubVt) CFP deadline April 15th. Keynotes: NXP, Skyworks, Qualcomm

Posted on March 23, 2016
In Industry Buzz
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Don’t forget to get your paper submitted to the top conference with a major focus on the SOI ecosystem: the IEEE S3S (SOI/3D/SubVt). The Call For Papers (CFP) deadline is April 15, 2016. As we noted for you in ASN back in December, the theme of the conference, which will take place October 10th – […]

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IEEE S3S, Top SOI/3D/SubVt Conference, Issues Call for Papers. Theme: Energy Efficient Tech for IoT. (Best Student Paper wins $1000) Thumbnail

IEEE S3S, Top SOI/3D/SubVt Conference, Issues Call for Papers. Theme: Energy Efficient Tech for IoT. (Best Student Paper wins $1000)

Posted on December 17, 2015
In Industry Buzz
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The IEEE S3S (SOI/3D/SubVt) has issued its call for papers for the 2016 conference (click here for details). The theme of the conference, which will take place October 10th – 13th in San Francisco, is “Energy Efficient Technology for the Internet of Things”. This industry-wide event gathers together widely known experts, contributed papers and invited […]

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Don’t miss EuroSOI-ULIS, 25-27 January 2016 in Vienna. Call for papers still open. Thumbnail

Don’t miss EuroSOI-ULIS, 25-27 January 2016 in Vienna. Call for papers still open.

Posted on November 27, 2015
In Industry Buzz
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The 2016 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon, aka EUROSOI-ULIS 2016 will be taking place January 25-27, 2016 in Vienna, Austria. The event will be hosted by the Institute for Microelectronics, TU Wien. The focus of the sessions is on SOI technology and advanced nanoscale devices. The organizing committee […]

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Advanced substrates for 3D and other new markets drive new fab inspection equipment – interview with Altatech GM Thumbnail

Advanced substrates for 3D and other new markets drive new fab inspection equipment – interview with Altatech GM

Posted by on October 6, 2015
In Design & Manufacturing, News & Viewpoints
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New approaches in chipmaking and fast-evolving specialty markets are driving the need for new equipment on the fab floor. 3D chips (be they stacked or bonded), MEMS, lighting, power – they’re all leveraging wafer substrates in new ways. Altatech, the equipment division of SOI-wafer leader Soitec, has just announced new inspection equipment for foundry and […]

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Great line-up planned for IEEE S3S (SOI, 3D and low-voltage — 5-8 October, Sonoma, CA). Advance Program available. Registration still open. Thumbnail

Great line-up planned for IEEE S3S (SOI, 3D and low-voltage — 5-8 October, Sonoma, CA). Advance Program available. Registration still open.

Posted by on September 10, 2015
In Conferences, In & Around Our Industry
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Now in its third year, the 2015 IEEE S3S Conference has evolved into the premier venue for sharing the latest and most important findings in the areas of process integration, advanced materials & materials processing, and device and circuit design for SOI, 3D and low-voltage microelectronics. World-class leading experts in their fields will come to […]

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IEEE SOI-3D-Subthreshold Conference (S3S, Oct. Sonoma, CA) Welcoming Papers til mid-May Thumbnail

IEEE SOI-3D-Subthreshold Conference (S3S, Oct. Sonoma, CA) Welcoming Papers til mid-May

Posted by on April 27, 2015
In Conferences
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The IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (IEEE S3S) is welcoming papers until May 18, 2015. Last year, the second edition of the IEEE S3S conference, founded upon the co-location of the IEEE International SOI Conference and the IEEE Subthreshold Microelectronics Conference was a great success targetting key topics and attracting even more participants than […]

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Interview (Leti): How a new platform helps designers get the most out of FD-SOI for IoT, ULP Thumbnail

Interview (Leti): How a new platform helps designers get the most out of FD-SOI for IoT, ULP

Posted on April 9, 2015
In Design & Manufacturing, News & Viewpoints
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A driving force in FD-SOI, Leti recently announced a service called Silicon Impulse®, a new FD-SOI platform for IoT & ultra-low-power (ULP) apps that helps start-ups, SMEs and large companies evaluate, design, prototype & move to volume. Olivier Thomas, who’s in charge of the program and Ali Erdengiz, who’s Business Development Manager for Leti explain […]

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2015 – Turning the Tables for FD-SOI, RF-SOI and More Thumbnail

2015 – Turning the Tables for FD-SOI, RF-SOI and More

Posted by on January 22, 2015
In Editor's Blog
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If current momentum is any indication, 2015 will be the year the tables turn in favor of FD-SOI designs (with a big shout-out to IoT).  The RF-SOI juggernaut will continue cutting an enormous swath through the mobile market.   Attention to the exciting possibilities of monolithic 3D (M3D) technology (like Leti’s “CoolCube”) will continue to grow, […]

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IEEE SOI-3D-Substhreshold (S3S) Conference Issues Call for Papers

Posted on January 9, 2015
In Industry Buzz
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The IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (IEEE S3S) has issued the 2015 Call for Papers. Now in its 3rd year as a combined event, the 2015 IEEE S3S Conference will take place in Sonoma Valley, CA, just north of San Francisco, October 5-8. This industry-wide event will gather together widely known experts, contributed papers and […]

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