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Archive of 22nm

It’s Official! GlobalFoundries Launches 22FDX: 22nm FD-SOI in 4 flavors Thumbnail

It’s Official! GlobalFoundries Launches 22FDX: 22nm FD-SOI in 4 flavors

Posted by on July 14, 2015
In Design & Manufacturing, Editor's Blog
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With much fanfare, GlobalFoundries has officially announced its 22nm FD-SOI offering. Dubbed “22FDX™”, GF says the platform delivers FinFET-like performance and energy-efficiency at a cost comparable to 28nm planar, targeting mainstream mobile, IoT, RF connectivity and networking markets. Asked by EETimes why FD-SOI here and now, GF’s CEO Sanjay Jha responded, “The mass market is […]

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Yes! FD-SOI IP Ready for GF, Samsung; Ecosystem Now a Force to Be Reckoned With Thumbnail

Yes! FD-SOI IP Ready for GF, Samsung; Ecosystem Now a Force to Be Reckoned With

Posted by on July 6, 2015
In Conferences, Design & Manufacturing, Editor's Blog
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The recent LetiDays FD-SOI workshop in Grenoble was the biggest show of force to date for the burgeoning FD-SOI ecosystem. In addition to a raft of excellent presentations, we learned two very big pieces of news. First, GlobalFoundries provided more insights into their upcoming FD-SOI offering. And second, designers opting for Samsung’s 28nm FD-SOI offering […]

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GlobalFoundries FD-SOI Webinar 24 June 2015, 10am PST: Be There! Thumbnail

GlobalFoundries FD-SOI Webinar 24 June 2015, 10am PST: Be There!

Posted by on June 13, 2015
In Design & Manufacturing, Editor's Blog
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It’s happening! GlobalFoundries is having an FD-SOI technical webinar on the 24th of June 2015. Don’t wait – sign up now – click here to get the registration document. Here’s the information we know so far. Title: Extending Moore’s Law with FD-SOI Technology  Agenda: FD-SOI technology overview Power Performance Area (PPA) advantages Transistor control with […]

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IBM z13, world’s fastest microprocessor – on SOI, of  course! Thumbnail

IBM z13, world’s fastest microprocessor – on SOI, of course!

Posted on February 2, 2015
In Industry Buzz
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The recently announced IBM z13, which is billed as the world’s fastest microprocessor, is built on SOI (of course!) (read the press release here). At the heart of the latest in the IBM z-series of mainframes, the chip is manufactured in 22nm SOI (partially depleted). IBM says it is 2X faster than the most common […]

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Is China Interested in FD-SOI? You bet. Thumbnail

Is China Interested in FD-SOI? You bet.

Posted by on October 28, 2014
In Conferences, Editor's Blog, In & Around Our Industry
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At the recent FD-SOI Forum in Shanghai, the IoT (Internet of Things) was the #1 topic in all the presentations. The event was sponsored by the SOI Consortium, the Shanghai Institute of Microsystem and Information Technology / Chinese Academy of Sciences (SIMIT/CAS), and VeriSilicon. By all accounts it was a great success. Speakers included experts […]

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IEDM ’13 (Part 2): More SOI and Advanced Substrate Papers Thumbnail

IEDM ’13 (Part 2): More SOI and Advanced Substrate Papers

Posted by on December 19, 2013
In Conferences, Editor's Blog, Paperlinks
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SOI and other advanced substrates were the basis for dozens of excellent papers at IEDM ’13.  Last week we covered the FD-SOI papers (click here if you missed that piece). In this post, we’ll cover the other major SOI et al papers – including those on FinFETs, RF and various advanced devices. Brief summaries, culled […]

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PCMag’s Michael Miller called IBM’s 22nm SOI Power8 “the most fascinating” of the high-end processors Thumbnail

PCMag’s Michael Miller called IBM’s 22nm SOI Power8 “the most fascinating” of the high-end processors

Posted on August 31, 2013
In Industry Buzz
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PCMag’s Michael Miller called IBM’s 22nm SOI Power8 “the most fascinating” of the high-end processors. Reporting on this year’s Hot Chips conference, presented there. He noted that the chip “will have 12 cores, each capable of running up to eight threads, with 512KB of SRAM Level 2 cache per core (6MB total L2) and 96MB […]

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Soitec: Wafer Roadmap for Fully Depleted Planar and 3D/FinFET Thumbnail

Soitec: Wafer Roadmap for Fully Depleted Planar and 3D/FinFET

Posted by (Soitec) on April 20, 2012
In ASN #19, Design & Manufacturing, In & Around Our Industry
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Soitec wafers for FD bridge the planar gap between 28nm and 14nm, then accelerate and simplify the move to 3D architectures. Today’s semiconductor industry is moving through several challenging transitions that are creating a significant opportunity for Soitec to bring incremental value to the market and our customers. With traditional CMOS reaching the end of […]

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Study Shows FD-SOI Most Cost-Effective Approach at 22nm

Posted by on August 1, 2011
In Editor's Blog
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A new IC Knowledge report examines the costs of potential solutions for a foundry at 22nm. What are you doing at 22nm? The debate is raging in the press and forums alike. Now research firm IC Knowledge has issued a report showing that from a straight cost perspective, planar FD-SOI is a better choice than […]

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FD-SOI: The Right Choice Thumbnail

FD-SOI: The Right Choice

Posted by on May 14, 2011
In Editor's Blog
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Although Intel will do FinFETs at 22nm, FD-SOI remains the better alternative for most all the industry for low power and mobile apps. In the weeks and months to come, we’ll continue hearing  the SOI camp addressing key points. 1. FD-SOI technology is the most cost-effective solution. The wafers are available from multiple sources. With […]

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