A new study compares processes for the 20/22nm generation at a typical foundry. Silicon On Insulator (SOI) has been in use for state-of-the-art integrated circuit (IC) manufacturing since IBM first championed the technology in the mid-nineties. SOI offers process technologists the option of reducing power or improving performance for a given process node. As process …

A new Yole report highlights growth of SOI MEM S. Although MEMS technologies are not driven by CD shrinking as ICs, that does not mean MEMS do not undergo strong technological evolutions. The ever-growing MEMS markets, today mostly driven by consumer applications, now have to be performance-driven, cost-driven and size driven. SOI wafers are a …

VLSI projects that a critical mass of expertise will support a fast transition to SOI designs at 32nm. The semiconductor market recovery has helped to grow SOI demand in-line with the industry. Established applications such as AMD’s microprocessors, IBM’s high performance ASICs, and other manufacturers’ high performance computer, consumer  and communications products are moving through …

The SOI cost structure is on target for penetrating new markets – especially the all-important mobile markets. Volume customers can anticipate 300mm SOI wafer prices in the $500 range. As the leading SOI wafer manufacturer, Soitec has been driving optimization of its Smart Cut™ manufacturing technology for increased efficiency and continuously improving yields.

Yole looks for a wide range of MEMS-based products to be introduced this year. Despite the current economic situation, a piece of good news is that innovation will not come to a halt in 2009: we expect that this will be one of the greatest years ever for new product introductions. The MEMS market in …

VLSI sees innovation and differentiation fueling the SOI market. The recent chaos in the world economy is creating one of the most severe downturns in the semiconductor industry. However, Moore’s Law will not be abandoned during this downturn; in fact, it will be clung to all the more desperately as competitors try to eliminate one …

A new study from Yole on 3D ICs sees a bright future for applications, markets and active layer transfer technology. Chip performance, size and functionality – especially for consumer electronics – will drive the industry to adopt 3D stacked chips with through-silicon vias (TSVs) replacing wire bonding for certain markets in the 2009-2015 time frame. …

The “SOI Technology: Semiconductor Perception & Awareness Study” should change the way the industry thinks about SOI. According to an SOI Industry Consortium and GSA survey, SOI is a real, here-and-now solution for the industry’s most pressing challenge: lowering power consumption.

Gartner Dataquest has been conducting research on the SOI wafer market trend since 1995. Its results indicate that SOI wafer demand achieved a compound annual growth rate (CAGR) of 33% over the decade between 1995 and 2005.

Mission: accelerating silicon-on-insulator (SOI) innovation into broad markets by promoting the benefits of SOI technology and reducing the barriers to adoption. This fall, nineteen of the world’s leading companies from across the electronics industry joined forces to launch the SOI Industry Consortium. Together, they aim to accelerate SOI innovation across a broad range of markets …