ASN

Archive of End-User Apps

The Power of Communication Thumbnail

The Power of Communication

Posted by (Freescale) on October 31, 2007
In ASN #8, End-User Apps, SOI In Action
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Freescale is the world leader in integrated communications processors. Here’s why the new generation PowerQUICC® series is on SOI. Freescale’s PowerQUICC® family of integrated communications processors go into the world’s leading enterprise routers, wireless LANs, base stations, media gateways, network storage and industrial electronics. For us, that means ensuring the highest level of integration possible […]

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The Driving Force Thumbnail

The Driving Force

Posted by (Infineon Technologies) on May 11, 2007
In ASN #7, End-User Apps, SOI In Action
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Infineon’s cost-effective SOI technology for driver ICs helps major appliance designers meet stringent energy and reliability parameters. Infineon is using SOI to help tackle one of the biggest challenges faced by designers of major appliances like washing machines, refrigerators and air conditioners: motor control.

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SOI for the Real World Thumbnail

SOI for the Real World

Posted by (Texas Instruments) on May 11, 2007
In ASN #7, End-User Apps, SOI In Action
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TI is using SOI in key high-voltage, high-current and high-frequency analog components. The real world is analog. Things like temperature, sound, light, pressure, speed – for this analog data to be integrated into digital systems, it has to be converted. But because the requirements vary enormously among the different analog functions and various systems where […]

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The New Generation: It’s All On SOI Thumbnail

The New Generation: It’s All On SOI

Posted on December 6, 2006
In ASN #6, End-User Apps, SOI In Action
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The PS3, Wii and Xbox 360 CPU design teams all chose SOI. Here’s why. Design challenges (Read the Cell overview paper by Kahle et al on the IBM website) Achieve 100 times the PlayStation®2 performance. Joint developers IBM, Sony Group and Toshiba needed to co-optimize the chip area, design frequency, and product operating voltage, creating […]

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Hitachi’s tiny mu-chip Thumbnail

Hitachi’s tiny mu-chip

Posted on December 6, 2006
In ASN #6, End-User Apps, SOI In Action
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Already the world’s smallest RFID chip, SOI makes the next generation far thinner than a piece of paper – while radically increasing productivity. The next generation of Hitachi’s µ-chip (mu-chip) is poised to make a major impact on the RFID (radio frequency identification) world. Presented at the IEEE conference in February 2006, this latest version […]

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Full use of SOI advantages enables small, thin, and low-cost RFIDs Thumbnail

Full use of SOI advantages enables small, thin, and low-cost RFIDs

Posted by (Hitachi) on December 6, 2006
In ASN #6, End-User Apps, SOI In Action
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A lead developer of Hitachi’s µ-chip explains the SOI benefits. By using SOI, we could make an ultra-small RFID chip. In particular, its excellent isolation capability enabled successful miniaturization of the analog circuits in the front-end of the part. Also, BOX (Buried OXide) acts as an etch-stop layer in the self-controlled process, resulting in an […]

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AMD & SOI: Winning with Performance/Watt/Dollar Thumbnail

AMD & SOI: Winning with Performance/Watt/Dollar

Posted on July 11, 2006
In ASN #5, End-User Apps, SOI In Action
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Nick Kepler, vice president of logic technology development at AMD talks about the role of SOI in the company’s strategy. Advanced Substrate News: How important is SOI to your strategy? Nick Kepler: SOI is an important part of AMD’s product strategy. We are currently utilizing it for our entire line of 90nm AMD64 products. AMD […]

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Honeywell & SOI: Military, Aerospace and Beyond Thumbnail

Honeywell & SOI: Military, Aerospace and Beyond

Posted on July 11, 2006
In ASN #5, End-User Apps, SOI In Action
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Honeywell has sent SOI by Jupiter and to Mars. Now its SOI rad-hard foundry services are charting new frontiers with the industry’s first 150 nm rad-hard, digital ASIC solutions and more. Honeywell’s path runs parallel to commercial markets. Chips destined for space are increasingly facing the same performance vs. power issues of chips we find […]

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Partners In Design: Standard Tools Simplify Rad-Hard SOI Design Thumbnail

Partners In Design: Standard Tools Simplify Rad-Hard SOI Design

Posted on July 11, 2006
In ASN #5, End-User Apps, SOI In Action
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Honeywell has worked with the top EDA tool vendors to develop the SOI process design kits (PDKs) needed by both in-house designers and foundry customers. Rick Veres, Honeywell EDA Manager, explains. ASIC Design With Pilot Flow For digital rad-hard ASIC design, we worked with Synopsys to adapt the Pilot Design Environment to our process. The […]

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Via Technologies Extends Range of Ultra-Low Voltage x86 Processors Thumbnail

Via Technologies Extends Range of Ultra-Low Voltage x86 Processors

Posted on April 6, 2006
In ASN #4, End-User Apps, SOI In Action
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Fabless Via leverages IBM’s 90nm SOI process. A leader in the fabless world, Via Technologies has launched its new, fanless 90-nm SOI Via-Eden™ and Eden™ ULV (Ultra Low Voltage) processors, specifically targeted at business, industrial and commercial applications such as thin clients, silent desktops, IPCs and set top boxes where ultra cool, ultra quiet, reliable […]

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