ASN

Archive of End-User Apps

Interview With ST-Ericsson’s Chief Chip Architect: SOCs on 28nm FD-SOI – When, Why and How Thumbnail

Interview With ST-Ericsson’s Chief Chip Architect: SOCs on 28nm FD-SOI – When, Why and How

Posted on April 6, 2012
In ASN #19, End-User Apps, SOI In Action
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ST-Ericsson’s Chief Chip Architect Louis Tannyeres talks with ASN about the move to 28nm FD-SOI for smartphones and tablet SOCs.   Advanced Substrate News (ASN): Can you give us a bit of background on the markets you’re addressing? Louis Tannyeres (LT): Founded in 2009, ST-Ericsson is an industry leader in design, development and creation of […]

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AMD Bulldozer Architecture Leverages 32nm SOI Thumbnail

AMD Bulldozer Architecture Leverages 32nm SOI

Posted on November 24, 2011
In ASN #18, End-User Apps, SOI In Action
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With performance, efficiency, and power optimization as top priorities, AMD’s innovative Bulldozer architecture is built on 32nm SOI. As of the Fall of 2011, AMD is shipping both client and server CPUs based on the new Bulldozer architecture. The first of the new APUs (CPU + GPU) incorporating Bulldozer modules will start shipping in 2012. […]

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Interview: How NXP’s SOI Technology Enables Major Advance in Automotive Position Sensors Thumbnail

Interview: How NXP’s SOI Technology Enables Major Advance in Automotive Position Sensors

Posted by on August 8, 2011
In ASN #18, End-User Apps, SOI In Action
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Guenter Reiniger, Marketing Manager for NXP’s Automotive Sensors, explains how SOI helps eliminate the need for external components in a new magnetic sensor family. Advanced Substrate News (ASN): NXP recently announced the KMA210, the first in a new family of magnetoresistive (MR) sensor chips. What is it used for? Guenter Reiniger (GR): The KMA210 is […]

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GPU/CPU on SOI: the Xbox 360 did it first Thumbnail

GPU/CPU on SOI: the Xbox 360 did it first

Posted by on May 11, 2011
In ASN #17, End-User Apps, SOI In Action
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Microsoft and IBM moved the CPU and the GPU of the best-selling game console in North America onto a single SoC – a year ahead of the pack. There’s a lot of excitement about the “latest trend” of integrating both the computing chip – the CPU and the graphics chip – the GPU – into […]

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Smart power saves power Thumbnail

Smart power saves power

Posted by (STMicroelectronics) on April 8, 2011
In ASN #17, End-User Apps, Power, SOI In Action
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ST’s newest SOI-based smart power technology delivers big reductions in power consumption in medical equipment, hybrid-electric-vehicle chargers and more. There is an urgent need for semiconductor technologies that can drastically reduce electrical energy consumption in consumer and industrial appliances. At STMicroelectronics, we have developed new SOI-based smart power technology that will make a significant difference […]

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Let There Be (Better!) Light Thumbnail

Let There Be (Better!) Light

Posted on December 13, 2010
In ASN #16, End-User Apps, SOI In Action
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SOI is a central pillar of NXP’s energy-efficient lighting strategy. In this exclusive ASN interview, Jacques Le Berre, the company’s director of marketing and business development for Lighting Solutions, explains why. Advanced Substrate News (ASN): Looking at overall trends and the “big picture” in the lighting market, what do consumers want / what are governments […]

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Driving Light Thumbnail

Driving Light

Posted by on December 13, 2010
In ASN #16, End-User Apps, SOI In Action
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SOI is poised to take center stage in the impending lighting revolution, with companies like NXP leading the charge. Here’s why. Incandescent bulbs are being phased out or banned worldwide: European bans started taking effect in 2009; the US, Canada, Japan and Russia will start in 2012. India, Brazil, China and many more have all […]

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Thinking Thin: NXP’s EZ-HV-SOI Thumbnail

Thinking Thin: NXP’s EZ-HV-SOI

Posted on December 13, 2010
In ASN #16, End-User Apps, SOI In Action
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First announced a decade ago, NXP’s EZ-HV™ is process technology for the production of commercial high-voltage (HV) SOI-enabled ICs.  It is at the heart of NXP’s GreenChip technology, and is ideal for implementing optimal solutions for a wide range of lighting applications. In high-power systems, it allows sophisticated control logic and high voltage drive circuits […]

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Newest Drivers Reach New Levels of Integration Thumbnail

Newest Drivers Reach New Levels of Integration

Posted on December 13, 2010
In ASN #16, End-User Apps, SOI In Action
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Newest Drivers Reach New Levels of Integration NXP’s UBA2211 for the 230V and 110V markets is the latest driver IC family in the company’s CFL IC portfolio. Built on NXP’s EZ-HV SOI technology, it features the highest level of integration available on the market today, including a current controlled preheat function, enabling more compact designs, […]

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Get the Picture Thumbnail

Get the Picture

Posted on July 26, 2010
In ASN #15, End-User Apps, SOI In Action
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Hitachi’s latch-up-free, SOI-based chips enable new generations of compact medical ultrasound systems. Medical challenge Ultrasound systems need to be smaller, more cost-effective, and higher performance – without compromising reliability. Design challenge Ultrasound is based on high-voltage pulses that drive transducers, which create and receive bursts of sound waves. Low-power, high-performance electronics control a complex set […]

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