STMicroelectronics predicts its new SOI-based STOD13AS power chip could be used in nearly every new smartphone or small electronic device that has an AMOLED display. ST, which already supplies over 80% of the market for these ultra-thin, vivid displays, says SOI ensures outstanding energy efficiency for longer battery life, and high immunity to noise for …

Imec and Genalyte have successfully developed and produced a set of disposable SOI-photonics biosensor chips for Genalyte‘s diagnostic and molecular detection equipment. Founded by SOI-photonics innovator Dr. Cary Gunn, Genalyte chips contain ring resonator sensors for very sensitive molecular detection; on-chip grating couples infrared light to diagnostic equipment.

The international Sematech consortium announced that SOI wafer leader Soitec has joined the Front End Processes (FEP) and Advanced Metrology Programs. Soitec will collaborate with SEMATECH’s material and metrology experts and leverage Sematech’s activities in advanced metrology, materials, process technology, and device characterization to extend CMOS and high-mobility FinFET technologies for high-performance, low-power IC applications.

Skyworks credits part of its Q1 FY12 success to having commenced volume production of advanced SOI-based Antenna Switch Modules (ASMs) for Huawei. With ongoing development of advanced switching solutions for handsets, data cards, and other applications, Skyworks cites the SKY18108 as one example of their recent ASMs tailored to meet the needs and requirements of …

World-leading advanced substrate maker Soitec and compound materials leader Sumitomo Electric are launching pilot production of 4” and 6” GaN wafers for the LED and power markets. Soitec applies its Smart CutTM layer-transfer process to Sumitomo’s bulk GaN wafers to generate engineered wafers with the same thermal expansion (CTE) as standard GaN wafers but at …

Grace Semiconductor, a leading foundry in China, added 0.13um SOI RF CMOS to its Technology Roadmap in Q2 2011. (Courtesy: Grace Semiconductor)

At CES 2012, NXP unveiled its ultra-compact, high-precision SOI-MEMS-based frequency synthesizer as an alternative to quartz crystal-based timing devices. These timing devices target communications equipment using Gigabit Ethernet, USB, PCI-Express and S-ATA, plus CPU timing, memory and control in consumer electronics devices.

Skyworks has launched two new SOI CMOS single-pole, triple-throw (SP3T) switches, the SKY13345-368LF and the SKY13385-460LF.  With their high linearity performance and low insertion loss, these devices target WLAN (802.11 b/g) and Bluetooth® applications in the 2.4 to 2.5 GHz frequency range.

IBM will produce Micron‘s Hybrid Memory Cube (HMC) in the debut of the first commercial, 3D chip-making. HMC parts will be manufactured at IBM’s advanced semiconductor fab in East Fishkill, N.Y., using the company’s 32nm SOI HKMG process technology.

IBM‘s SOI-based BlueGene/Q takes the top 5 spots on the latest “Green500” list of energy-efficient supercomputers.