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Archive of Industry Buzz

SiTime has entered the smartphone/tablet/mobile app market with the first MEMS oscillator in a chip scale package (CSP) Thumbnail

SiTime has entered the smartphone/tablet/mobile app market with the first MEMS oscillator in a chip scale package (CSP)

Posted on May 10, 2013
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SiTime, which leverages SOI for high-performance MEMS timing solutions, has entered the smartphone/tablet/mobile app market with the first MEMS oscillator in a chip scale package (CSP). SiTime’s solutions offer area savings of 85%, cut power by 50% and are 15 times more reliable, all of which enable smaller, lower power and longer lasting mobile electronics. …

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An agreement between Soitec and GT Advanced Technologies is aiming to lower the cost of LED production and accelerate adoption in commercial and residential lighting

Posted on May 6, 2013
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An agreement between Soitec and GT Advanced Technologies is aiming to lower the cost of LED production and accelerate adoption in commercial and residential lighting. GT is developing an HVPE (high productivity hydride vapor phase epitaxy) system incorporating Soitec Phoenix Labs’ (a subsidiary of Soitec) unique and proprietary HVPE technology. This includes Soitec’s novel and …

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Soitec’s Smart Cut™ technology is now being leveraged to produce GaN substrates for high-performance LED lighting applications

Posted on May 6, 2013
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Soitec‘s Smart Cut™ technology, best known for its role as the leading technology for producing SOI wafers, is now being leveraged to produce GaN substrates for high-performance LED lighting applications. Following a successful pilot line announced last year, Sumitomo Electric will now industrialize the product and invest in Smart Cut technology. Yoshiki Miura, general manager …

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FD-SOI Forum 2013 in Hsinchu, Taiwan – Presentations available online! Thumbnail

FD-SOI Forum 2013 in Hsinchu, Taiwan – Presentations available online!

Posted on April 26, 2013
In Industry Buzz

On April 22, 2013, leading companies from the SOI Industry Consortium organized a forum focused on fully depleted technologies for highly energy-efficient System-on-Chip applications. This forum was co-organized by Horacio Mendez from the SOI Consortium, Gary Patton from IBM and Mike Noonen from GLOBALFOUNDRIES. The presentations are now posted on the SOI Industry Consortium website: …

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DARPA reports that a team of researchers at the University of Southern California and Columbia University has achieved output power levels of nearly 0.5W at 45 GHz with a 45nm SOI CMOS chip Thumbnail

DARPA reports that a team of researchers at the University of Southern California and Columbia University has achieved output power levels of nearly 0.5W at 45 GHz with a 45nm SOI CMOS chip

Posted on April 12, 2013
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DARPA reports that a team of researchers at the University of Southern California and Columbia University has achieved output power levels of nearly 0.5W at 45 GHz with a 45nm SOI CMOS chip. This world record result for CMOS-based power amplifiers doubles output power compared to the next best reported CMOS millimeter-wave power amplifier. The …

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Altis Semiconductor will be a foundry partner for the IBM 180nm SOI technology

Posted on March 18, 2013
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Specialty foundry Altis Semiconductor will be a foundry partner for the IBM 180nm SOI technology. ALTIS will deliver high volume products starting Q2 2013 and will secure capacity increase for 2014 and beyond to address the IBM forecasted demand.  This foundry agreement addresses the next generation of consumer products, including as an example, the RF/SOI …

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Peregrine has announced the latest version of UltraCMOS® process technology-Semiconductor Technology Platform 8 (STeP8) Thumbnail

Peregrine has announced the latest version of UltraCMOS® process technology-Semiconductor Technology Platform 8 (STeP8)

Posted on March 18, 2013
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Peregrine has announced the latest version of UltraCMOS®  process technology—Semiconductor Technology Platform 8 (STeP8), which the company says enables unmatched performance in RF Front End ICs. STeP8 technology shows a 36% improvement in Ron Coff  performance over STeP5 technology announced just one year ago—dramatically improving the linearity, insertion loss, and isolation capabilities of Peregrine’s RFIC …

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TowerJazz says its latest RF SOI technology offers the industry’s best figure of merit for antenna switch and antenna tuning applications

Posted on March 18, 2013
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Specialty foundry TowerJazz says its latest RF SOI technology offers the industry’s best figure of merit for antenna switch and antenna tuning applications with Ron-Coff of only 217fs. The technology is driving FEM market share, quickly replacing GaAs implementations and has already been adopted by multiple customers worldwide with over 50 separate designs taped-in with …

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RDA Microelectronics has begun volume shipments of its RDALN16 GPS LNA

Posted on March 18, 2013
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RDA Microelectronics has begun volume shipments of its RDALN16 GPS LNA for use in Samsung’s 3G handsets deployed in Europe and emerging markets worldwide, such as South America. Developed on SOI, RDA’s GPS LNA is a high gain, low noise, small size amplifier ideally suited for GPS, Galileo and GLONASS applications in 2G and 3G …

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Skyworks announced that its industry-leading Silicon-on-insulator (SOI) switching technology is now being used by European, Japanese, Korean and North American car manufacturers Thumbnail

Skyworks announced that its industry-leading Silicon-on-insulator (SOI) switching technology is now being used by European, Japanese, Korean and North American car manufacturers

Posted on March 14, 2013
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Skyworks announced that its industry-leading Silicon-on-insulator (SOI) switching technology is now being used by European, Japanese, Korean and North American car manufacturers for advanced infotainment systems. Specifically, Skyworks’ solid state technology is enabling seamless low noise and broadband switching between audio, Blu-ray/DVD, navigation, cell phone and vehicle security display inputs as well as a variety …

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