FD-SOI: The Substrates Are Ready
Posted by Olivier BONNIN (Soitec) on May 25, 2011In ASN #17, Design & Manufacturing, In & Around Our Industry, Power
Tagged with FD-SOI, substrate
At the most recent SOI Consortium FD-SOI workshop, Soitec gave a presentation on FD-SOI substrate readiness. Here are some of the highlights. The roadmap for FD-SOI architectures requires SOI wafer structures with ultra-thin top silicon and ultra-thin insulating BOX (Xtreme SOI TM). Using our industry-standard Smart CutTM technology, Soitec is ramping these wafers in production …
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