ASN

Archive of In & Around Our Industry

IBM Nanoscale Probe Storage System Leverages SOI in New Frontiers Thumbnail

IBM Nanoscale Probe Storage System Leverages SOI in New Frontiers

Posted by (IBM) on July 11, 2006
In ASN #5, In & Around Our Industry, MEMS
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An IBM-Zurich team including Nobel laureates has extended the Atomic Force Microscopy (AFM) concept to data storage. IBM group manager and probe storage team member Michel Despont explains. While today’s magnetic data storage techniques are reaching some impressive levels, at some point in the not too distant future they will hit the physical limits of […]

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SOI-based Electronics for Avionic & Space Harsh Environments Thumbnail

SOI-based Electronics for Avionic & Space Harsh Environments

Posted by (Cissoid) on July 11, 2006
In ASN #5, Design & Manufacturing, In & Around Our Industry
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SOI-based ICs developed by CISSOID for extreme conditions are reaching record operating temperatures. The electronics used in Avionics & Space are subject to very harsh conditions, in particular very wide operating temperature ranges. In avionics, the sensors placed close to the engine are subject to very high temperature, well above 200°C, and airplane manufacturers are […]

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SOI By Design

Posted on April 6, 2006
In ASN #4, Design & Manufacturing, In & Around Our Industry
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The widening availability of tools and services is good news for designers in the fabless/foundry arena considering the move to SOI. Leading foundries have made the investments in manufacturing on SOI. Those that have taken the final steps – finalizing electrical characterization, constructing SPICE models, integrating design tools and building libraries – are winning business. […]

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Expert Advice

Posted on April 6, 2006
In ASN #4, Design & Manufacturing, In & Around Our Industry
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Michael Gruver, Program Manager, IBM Engineering & Technology Solutions, gives his perspective on foundry customers and custom SOI design. Advanced Substrate News: What tools or investments would a customer need if they were going for an SOI-based solution? Michael Gruver: There are two primary areas that a customer should address if they intend to use […]

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Benchmarking SOI vs. Bulk Defectivity Levels Thumbnail

Benchmarking SOI vs. Bulk Defectivity Levels

Posted by (Soitec) on April 6, 2006
In ASN #4, Design & Manufacturing, In & Around Our Industry
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Monitoring defects using low thresholds is key to manufacturing yield. For inspecting SOI wafers, UV light overcomes the limitations of visible light. Here’s why.   With visible-light inspection tools, the scattering behavior of defects on SOI structures depends on silicon and oxide thicknesses. Because of buried interfaces, transmitted visible light is sent back to the […]

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Chirac Awards Innovation Prize to Soitec Thumbnail

Chirac Awards Innovation Prize to Soitec

Posted on April 6, 2006
In ASN #4, In & Around Our Industry, People
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During an Elysée ceremony, the French president cited the company’s international growth and employment creation. At a ceremony held at the presidential Elysée Palace in March, French President Jacques Chirac awarded Soitec the “2006 Boldness and Creativity Award” (Prix de l’Audace Créatrice). The prize, awarded yearly, recognizes the achievements of a listed company that is […]

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IEEE/EDS Accolades for SOI Innovators Thumbnail

IEEE/EDS Accolades for SOI Innovators

Posted on April 6, 2006
In ASN #4, In & Around Our Industry, People
Tagged with ,

Top honors go to advanced substrate pioneers – again. For the second year in a row, the IEEE Electron Devices Society (EDS) gave the J.J. Ebers Award for “…outstanding technical contributions to electron devices” to an SOI pioneer. The 2005 honor went to Bijan Davari of IBM, now Vice President of Next Generation Computing Systems/Technology. […]

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IBM + SOI Yield More Honors Thumbnail

IBM + SOI Yield More Honors

Posted on April 6, 2006
In ASN #4, In & Around Our Industry, People
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Company received top White House medal and SI Fab of the Year. Recently, IBM has been lining up awards for technology leadership, often citing the company’s work in SOI. IBM’s 300-mm, SOI-enabled Building 323 in East Fishkill, NY, was selected as the Semiconductor International 2005 Top Fab Award winner. According to the publication, “IBM has […]

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What’s After Silicon? Thumbnail

What’s After Silicon?

Posted by (ASM) on April 6, 2006
In ASN #4, Design & Manufacturing, In & Around Our Industry
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For each technology node, those in the substrate world have to be ready with options years in advance of their customers. ASM describes developments in germanium epitaxy that could enable the industry to choose a GeOI future. In the silicon device industry, new materials have to be introduced to assure IC performance improvement from one […]

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Z-RAM Ultra-Dense Memories Remove Last Barrier to Entry for SOI Thumbnail

Z-RAM Ultra-Dense Memories Remove Last Barrier to Entry for SOI

Posted by (Innovative Silicon) on April 6, 2006
In ASN #4, Design & Manufacturing, In & Around Our Industry
Tagged with ,

ISi’s memory technology helps designers achieve speed increases and power savings at no extra cost. It is well-accepted that SOI processing offers significant benefits in terms of speed and low power. Moreover, as the industry moves to the 65 and 45nm nodes, many analysts predict that bulk CMOS – so long the technology of choice […]

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