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Archive of Design & Manufacturing

12nm FD-SOI on the Roadmap for H1/2019 Customer Tape-out! Says GloFo (While Giving 22FDX Ecosys a Great Boost) Thumbnail

12nm FD-SOI on the Roadmap for H1/2019 Customer Tape-out! Says GloFo (While Giving 22FDX Ecosys a Great Boost)

Posted by on September 15, 2016
In Design & Manufacturing, Editor's Blog
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12nm FD-SOI has now officially joined the GlobalFoundries’ roadmap, targeting intelligent, connected systems and beating 14/16nm FinFET on performance, power consumption (by 50%!) and cost (see press release here). Customer product tape-outs are expected to begin in the first half of 2019. GloFo also announced FDXcelerator™, an ecosystem designed to give 22FDX™ SoC design a […]

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Why Dan Hutcheson/VLSIresearch, Inc. (finally!) Likes FD-SOI Thumbnail

Why Dan Hutcheson/VLSIresearch, Inc. (finally!) Likes FD-SOI

Posted by on May 27, 2016
In Design & Manufacturing, Editor's Blog
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Dan Hutcheson, CEO of VLSIresearch, Inc. finally likes FD-SOI. That’s important, because he’s a really influential person in the chip world. Everybody who’s anybody in the chip biz pays attention to what VLSIresearch, Inc. has to say. Dan recently gave a talk entitled “FD-SOI: Disruptive or Just Another Process?” to a packed-to-the-brim room during the […]

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Why NXP’s i.MX 7 and 8 Applications Processors are Taking on IoT, Wearables, Automotive and Other Embedded Markets with 28nm FD-SOI [Part 2 of 2] Thumbnail

Why NXP’s i.MX 7 and 8 Applications Processors are Taking on IoT, Wearables, Automotive and Other Embedded Markets with 28nm FD-SOI [Part 2 of 2]

Posted by on April 7, 2016
In Design & Manufacturing, End-User Apps
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By Ronald M. Martino, Vice President, i.MX Applications Processor and Advanced Technology Adoption, NXP Semiconductors At NXP, we’re very excited about the prospects for our new i.MX 7 and 8 series of applications processors, which we’re manufacturing on 28nm FD-SOI. As noted in part 1 of this article series, the new i.MX 7 series, which […]

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NXP’s Latest i.MX Applications Processors for IoT/Wearables and Automotive – Here’s Why They’re on FD-SOI [Part 1 of 2] Thumbnail

NXP’s Latest i.MX Applications Processors for IoT/Wearables and Automotive – Here’s Why They’re on FD-SOI [Part 1 of 2]

Posted by on April 5, 2016
In Design & Manufacturing, End-User Apps
Tagged with , , , , , , , , , , , , ,

By Ronald M. Martino, Vice President, i.MX Applications Processor and Advanced Technology Adoption, NXP Semiconductors The latest generations of power efficient and full-featured applications processors in NXP’s very successful and broadly deployed i.MX platform are being manufactured on 28nm FD-SOI. The new i.MX 7 series leverages the 32-bit ARM v7-A core, targeting the general embedded, […]

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Silicon Valley FD-SOI Symposium Promises Best Ecosystem Line-Up Ever: ARM, Foundries, EDA, Designers, Experts & Users (13 April – free and open to all who sign up) Thumbnail

Silicon Valley FD-SOI Symposium Promises Best Ecosystem Line-Up Ever: ARM, Foundries, EDA, Designers, Experts & Users (13 April – free and open to all who sign up)

Posted by on March 31, 2016
In Conferences, Design & Manufacturing, Editor's Blog
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The SOI Consortium has lined up an excellent, comprehensive FD-SOI Symposium on April 13th in San Jose. They’ll be highlighting the tremendous progress of the FD-SOI ecosystem. Headliners include Cisco, Sony, NXP, SigmaDesigns, ARM, Ciena plus the big FD-SOI foundries, EDA companies, design partners, chipmakers and analysts. There is a special session dedicated to RF […]

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RF-SOI – Foundries Weigh In On New 300mm Wafers for 4G/LTE-A, 5G and IoT. Plus a Look at the Innovation Pipeline – Part 2 of 2 Thumbnail

RF-SOI – Foundries Weigh In On New 300mm Wafers for 4G/LTE-A, 5G and IoT. Plus a Look at the Innovation Pipeline – Part 2 of 2

Posted by on March 23, 2016
In Design & Manufacturing, Editor's Blog
Tagged with , , , , , , , , , , , , , ,

As you may have read in the first part of this series, Soitec (the industry’s leading supplier of SOI wafers) says its 200mm RF-SOI wafers have been used to produce over 20 billion chips, and the company is now in high-volume manufacturing of a 300mm version of its wildly successful RFeSI line (see press release […]

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Now also on 300mm wafers and headed for 5G and IoT, RF-SOI’s going strong and stronger (>20 billion chips to date) – Part 1 of 2 Thumbnail

Now also on 300mm wafers and headed for 5G and IoT, RF-SOI’s going strong and stronger (>20 billion chips to date) – Part 1 of 2

Posted by on March 18, 2016
In Design & Manufacturing, Editor's Blog
Tagged with , , , , , , , , , , , , ,

Soitec, the industry’s leading supplier of SOI wafers recently announced it’s in high-volume manufacturing of a 300mm version of its wildly successful RFeSI line (see press release here). What’s it all about? FEMs. RF front-end module – aka FEM – chips handle the back-and-forth of signals between the transceiver and the antenna. FEMs built on […]

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What’s Behind the Power Savings in sureCore’s FD-SOI SRAM IP? Thumbnail

What’s Behind the Power Savings in sureCore’s FD-SOI SRAM IP?

Posted by on February 12, 2016
In Design & Manufacturing
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By Duncan Bremner, CTO SureCore Limited Editor’s note: sureCore just announced availability of its 28nm FD-SOI memory compiler (press release here), which supports the company’s low-power, Single and Dual Port SRAM IP. Here, the company’s CTO explains why this IP is getting such impressive results. ~ ~ ~ Recently, sureCore announced results from a 28nm FD-SOI test chip that […]

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GlobalFoundries and Synopsys Streamline the Move to 22nm FD-SOI Thumbnail

GlobalFoundries and Synopsys Streamline the Move to 22nm FD-SOI

Posted by and on February 9, 2016
In Design & Manufacturing
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By: Tamer Ragheb, Digital Design Methodology Technical Manager at GlobalFoundries and Josefina Hobbs, Senior Manager of Strategic Alliances, Synopsys It’s clear that getting an optimal balance of power and performance at the right cost is foremost in the minds of designers today. Designers who want either high performance or ultra low-power, or ideally both, have a […]

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Great FD-SOI start for 2016: Samsung, GF, Renesas, NXP/Freescale, ST, Soitec Thumbnail

Great FD-SOI start for 2016: Samsung, GF, Renesas, NXP/Freescale, ST, Soitec

Posted by on February 3, 2016
In Design & Manufacturing, Editor's Blog
Tagged with , , , , , , , , , , , , , , ,

Just a month into 2016 and we already have a raft of FD-SOI news from Samsung, GlobalFoundries, NXP/Freescale, Renesas and more. And of course RF-SOI continues ever stronger. Here’s a quick update of what we’ve been seeing, starting with news from the recent SOI Consortium forum in Tokyo. Many of the presentations are now available on […]

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