Substrate strategies for high-performance and low-power applications at 45 nm
Posted by Carlos MAZURE (Soitec) on July 11, 2005In Advanced Substrate Corners, ASN #2, R&D/Labnews
Tagged with 45nm, FD-SOI, FinFET, rf, SOC, Soitec, wafers
Two distinct technical strategies for advanced substrates will mark the 45nm node. One will be focused on high performance, the other driven by system-on-chip (SOC) applications, including low power, portable RF applications. The high performance path will drive the most advanced substrates and material innovations. Engineered substrate solutions include ultra-thin (UT) SOI, mobility enhancing substrates …
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