ASN

Archive of Imaging

What Smart Stacking™ can do for you Thumbnail

What Smart Stacking™ can do for you

Posted by (Soitec) on April 22, 2011
In ASN #17, Design & Manufacturing, Imaging, In & Around Our Industry, MEMS
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Transferring a processed (or partially processed) layer of circuits from one wafer onto another enables innovative new solutions for BSI, MEMS, RF, 3D and more. Smart Stacking™ is Soitec’s wafer-to-wafer stacking technology platform for partially or fully processed wafers (see Figure 1). It enables the transfer of very thin processed layers in a high-volume production […]

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Production-Worthy Backside-Illuminated Image Sensors Thumbnail

Production-Worthy Backside-Illuminated Image Sensors

Posted by on December 3, 2008
In Advanced Substrate Corners, ASN #11, Imaging
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This SOI-based process requires no post-thinning passivation step. Demand for better cameras in less expensive mobile phones is pushing researchers to find higher performance image sensor solutions for that cost-conscious end of the market. Last year, a research team from MagnaChip and JPL presented a paper at the International Electron Devices Meeting (IEDM 2007, Washington, […]

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Smaller Pixels, Brighter Pictures Thumbnail

Smaller Pixels, Brighter Pictures

Posted by (STMicroelectronics) on July 16, 2008
In Advanced Substrate Corners, ASN #10, Imaging
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ST’s 3-megapixel back-illuminated image sensor for digital cameras leverages SOI, direct wafer-level bonding and thinning technologies, improving 1.45 x 1.45 µm² pixel quantum efficiency over 60%. To meet consumer demand for higher-quality digital cameras embedded in a widening array of mobile devices, designers need image sensors with very small pixels (higher resolution, smaller, cheaper and […]

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Higher Megapixels, Lower Cost Thumbnail

Higher Megapixels, Lower Cost

Posted by (Sarnoff Corporation) on May 14, 2008
In Advanced Substrate Corners, ASN #9, Imaging
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SOI enables back-illuminated CMOS and CCD image sensors with higher performance at lower cost. The consumer still and cell phone camera market is caught in a technology bind brought about by component pricing pressures. While consumers increasingly demand higher resolution (higher pixel density) cameras, the market is also very sensitive to manufacturing cost.

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