New Options for GaN RF
Posted by Jean-Luc LEDYS (Soitec) on December 7, 2005In Advanced Substrate Corners, ASN #3, III-V
Tagged with GaN, rf, SiC, Smart Cut, Soitec, wafers
Smart Cut™ enables innovative substrate solutions GaN HEMT technology holds enormous promise for increasing the power of commercial RF applications. However, challenges both technological and economic remain to be resolved before GaN can realize its full potential beyond the very high-end niche.
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