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Industry Buzz

INDUSTRY BUZZ

  • September 1, 2014 - An excellent article in SST details Leti's monolithic 3D (M3D) technology, as presented at the SemiconWest 2014 Leti Day (read the full article here). Written by Brian Cronquest, MonolithIC 3D's VP Technology & IP, the piece covers a presentation given by Olivier Faynot, Leti’s Device Department Director, about “monolithic 3D technology as the 'solution for scaling'.”... Read more »
  • September 1, 2014 - Murata and Peregrine Semiconductor have entered into a definitive agreement under which Murata will acquire all outstanding shares of Peregrine not owned by Murata (read full press release here). Peregrine will become a wholly owned subsidiary of Murata and continue with its current business model of solving the world’s toughest RF challenges. Peregrine supplies many wireless markets,... Read more »
  • August 21, 2014 - imec's 28Gb/s silicon photonics platform for optical interconnects and other optical applications will be included in an upcoming multiproject wafer run, reports R. Colin Johnson in EETimes (read the article here). These runs, which are on SOI wafers, are a joint effort by ePIXfab (founded by imec and Leti), Europractice IC and MOSIS. They provide a cost-effective vehicle for fabless... Read more »
  • August 21, 2014 - Peter Clark at Electronics360 wrote about a recent presentation by an STMicroelectronics research team using hafnium oxide for non-volatile embedded memory. (Read the full article here.) The results were given at a Leti memory workshop in June 2014. The team presented, “... results for a 16-kbit OxRAM test chip implemented in 28nm high-k metal gate process.” The project is under the... Read more »
  • August 8, 2014 - In RF-SOI news, Peregrine and RFMD announced that they have settled all outstanding claims between the companies (read press release here). The two companies have entered into patent cross licenses and have agreed to dismiss all related litigation. - “We are pleased that we have reached agreement with RF Micro Devices and resolved all of our outstanding litigation under terms that... Read more »
  • August 8, 2014 - Gold Standard Simulations Ltd. (GSS) announced a multimillion dollar contract to license its complete TCAD/EDA tool suite to GlobalFoundries (see press release here). The fully integrated and automated tool chain includes GARAND, the GSS ‘atomistic’ TCAD simulator; Mystic, the GSS statistical compact model extractor; and RandomSpice, the GSS statistical circuit simulator. The GSS... Read more »
  • August 8, 2014 - A new book entitled Silicon-On-Insulator (SOI) Technology, Manufacture and Applications (1st Edition) features contributions by experts at Soitec, GF, TSMC, Leti and more. - Billed as “a complete review of this rapidly growing high-speed, low-power semiconductor technology,” the book covers the entire SOI spectrum, from Moore to More than Moore. It goes into SOI wafer technology,... Read more »
  • July 18, 2014 - Soitec estimates that it has shipped enough of its eSI wafers to fabricate more than 1.4 billion RF front-end semiconductor devices. (Read the press release here.) The proprietary Enhanced Signal Integrity™ (eSI) substrates are now the substrate of choice for manufacturing cost-effective and high-performance radio-frequency (RF) devices providing a power boost for 4G /LTE... Read more »
  • July 15, 2014 - ST has posted a series of helpful website page for those new to FD-SOI – click here to see it. It starts with the basics, moves onto a discussion of how FD-SOI continues Moore's Law, and finishes with info on power efficiency, memories, analog and high-speed... Read more »
  • July 15, 2014 - An excellent article highlighting Leti's work on monolithic 3D was recently published in the IEEE's Spectrum magazine – click here to read it. In the article, Maud Vinet, manager of advanced CMOS at Leti says they've worked closely with ST to ensure manufacturability. “There is no major roadblock to the transfer of this technology to foundries,” she says in the article. “I feel... Read more »
  • June 17, 2014 - Specialty foundry TowerJazz announced the availability of an enhanced RF-SOI CMOS process design kit (PDK) for its 0.18µm process technology (see press release here). The kit was developed for use with Agilent Technologies’ Advanced Design System (ADS) software and targets a wide range of analog markets including front-end modules for mobile phones, tablets and WiFi... Read more »
  • June 17, 2014 - A ppt presentation by STMicroelectronics entitled Features and Benefits of 14nm UTBB* FD-SOI Technology is now posted on WeSRCH (click here to view it). It is fairly technical, covering process boosters, modules and innovations, mask sequences, performance and... Read more »
  • June 17, 2014 - IBM Foundry Solutions announced a new SOI-based technology for RF called 7SW SOI. The company says it is designed for 30 percent better performance than its predecessor, 7RF SOI, with which IBM shipped over seven billion chips in the last three years. The new mobile phone chip technology can help device manufacturers provide consumers with extremely fast downloads, higher quality... Read more »
  • June 8, 2014 - (Courtesy: SiTime) - SiTime, which leverages SOI for high-performance MEMS timing solutions, has introduced what it says is the smallest, lowest power 32 kHz TCXO (temperature compensated oscillator – read the press release here). With its tiny footprint and ultra-low power consumption, the SiT1552 MEMS TCXO enables a paradigm shift in the size and battery life of wearable electronics... Read more »
  • June 8, 2014 - Soitec, the world leader in SOI wafer manufacturing, has hired a former Intel exec, Thom Degnan, to take on the job of VP of the company's sales and bizdev for the Electronics Division in North America (read press release here). Soitec says that this strategic hiring supports the Electronics Division’s focus on mobile markets with FD-SOI wafers for digital electronics and RF-SOI... Read more »

Latest posts
Medea+ sSOI Partners Now Public Thumbnail

Medea+ sSOI Partners Now Public

Posted on April 6, 2006
In ASN #4, In & Around Our Industry, R&D/Labnews
Tagged with ,

Program includes AMD, Freescale, Infineon, Philips and ST. The list of partners in the Medea+ Strained Silicon-On-Insulator Substrates for High Performance ICs program, known as SilOnIS, has now been made public. Among the corporate partners are AMD, ASM, Freescale, Infineon, Philips, Siltronic and ST, among others. Lead by Soitec, the project’s stated goal is to […]

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Strained Silicon on Insulator: the Wafer Solution for Low-Power and High-Performance Devices

Posted by (Soitec) on April 6, 2006
In Advanced Substrate Corners, ASN #4, R&D/Labnews
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sSOI is on-track for high-volume manufacturing at the 45nm node. The end of conventional scaling is a topic that has generated discussion and controversy within the semiconductor community. The fact is that IC density increase through device geometry shrinking no longer results in an IC performance increase if the scaling is not coupled to the […]

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SOI-MEMS Go Straight to the Heart Thumbnail

SOI-MEMS Go Straight to the Heart

Posted on April 6, 2006
In ASN #4, In & Around Our Industry, MEMS
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www.tronics-mst.com www.elamedical.com A European leader in pacemakers relies on SOI based accelerometers to adapt pacing to activity level. On the leading edge of medical technology, accelerometers that detect a person’s activity level are enabling major improvements in pacemakers and other cardiac devices. Pacemakers are used when the heart beats at incorrect levels; but of course, […]

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Innovation Accompanies Steady Growth In Power Devices Thumbnail

Innovation Accompanies Steady Growth In Power Devices

Posted by (Yole Développement) on April 6, 2006
In Advanced Substrate Corners, ASN #4, III-V
Tagged with , , , , ,

The power devices market may be small, but it has a strong tradition of pioneering important advanced technologies. Within the microelectronics world, the power devices industry stands apart. There are very few standards, and overall it represents only about 10% of the mainstream semiconductor business. Applications cover a broad range, including industrial, automotive, traction motors […]

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Cost Impact of Switching From Bulk to SOI Thumbnail

Cost Impact of Switching From Bulk to SOI

Posted by (Soisic) on April 6, 2006
In ASN #4, Design & Manufacturing, In & Around Our Industry
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Overall the cost of an SOI chip is not higher than bulk and may even be lower, depending on the application. Cost is an important factor when developing a chip and going to production. Users of bulk substrates may ask how they can manage the added cost of the SOI substrate if they were to […]

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