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Industry Buzz

INDUSTRY BUZZ

  • May 14, 2015 - Cassette carrying several hundred chips intended for 100 Gb/s transceivers, diced from wafers fabricated with IBM SOI-CMOS Integrated Nano-Photonics Technology. The dense monolithic integration of optical and electrical circuits and the scalable manufacturing process provide a cost-effective silicon photonics interconnect solution, suitable for deployment in cloud servers, datacenters,... Read more »
  • May 14, 2015 - International research teams working on or interested in the far-reaching SOIPIX radiation-detector project have a workshop coming up in June. The project was originally started by KEK* scientists to develop a new detector technology and quantum beam imaging for high-energy particle physics. As research teams around the world (including Japan, USA, China and Europe) joined to take... Read more »
  • April 30, 2015 - A recent GlobalFoundries blog entitled RF-SOI is IoT's Future, and the Future is Bright (read it here) says, “RF SOI is a win-win technology option that can improve performance and data speed in smartphones and tablets, and it is expected to play a key role in the Internet of Things applications as well.” - The blog touches on the full range of benefits of RF-SOI for front-end... Read more »
  • April 30, 2015 - Presentations given at the ‘Beyond Computing' Innovative Technologies Symposium (March 2015 in Shanghai) are now available on the SOI Consortium website (click here to see the list). The Symposium covered MEMS, semiconductor manufacturing, RF and power, which are key topics for the fast growing “More than Moore” industry. The one-day, closed-door symposium was organized by members... Read more »
  • April 27, 2015 - RF-SOI will play a key role in the IoT plans of analog and mixed-signal specialist MagnaChip (read the press release here). The company has launched a task force to address IoT. The statement says, “MagnaChip also offers 0.18 micron and plans to offer 0.13 micron Silicon on Insulator (SOI) RF-CMOS technologies, which is suitable for use in antenna switching, tuner and Power Amplifier... Read more »
  • April 27, 2015 - Research and consulting group Semico has issued a new report entitled SOI Update 2015: Finding New Applications (for information on getting a copy of the report, click here). As described on the Semico website: “With the recent growth in RF-SOI for switches and integrated solutions for RF functions such as power amplifiers and transceivers, the opportunities for growth in SOI wafer... Read more »
  • April 21, 2015 - SFARDS' SF3301 cryptocurrency ASIC is the world’s first chip to use 28nm FD-SOI. Surpassing expecttions, it operates at a stunning 0.45V. (Courtesy: SFARDS) - Right on schedule, the SFARDS cryptocurrency ASIC on 28nm FD-SOI has made its debut in silicon, and is surpassing expectations. In what is clearly a stunning success, the company announced that the ASIC’s lowest working... Read more »
  • April 21, 2015 - TEM cross-section of FDSOI transistor (Courtesy of STMicroelectonics) - CEA-Leti’s newest version of its advanced compact model for FD-SOI is now available in all major SPICE simulators (get the press release here). The Leti-UTSOI2.1 is the latest version of Leti’s compact model for FD-SOI, which was first released in 2013. (Compact models of transistors and other elementary devices... Read more »
  • April 9, 2015 - In a new YouTube video, Samsung’s Sr. Director of Foundry Marketing, Kelvin Low, makes a strong case for 28nm FD-SOI, especially for ultra-low-power, IoT, wearables, networking and automotive apps. The five-minute video was taped by ChipEstimate.TV host Sean O’Kane during the Cadence User Conference (CDNLive, Silicon Valley, March 2015 – click here to see it). While the first half... Read more »
  • April 9, 2015 - Hua Hong Semiconductor of Shanghai (a pure-play 200mm foundry operated by HHGrace Semi) recently launched a 0.2μm RF-SOI process design kit (PDK) (click here to read the full press release). The 0.2μm RF-SOI technology platform has been successfully validated and is ready for customers product design and development, says the company. It is tailored and optimized for wireless RF... Read more »
  • March 27, 2015 - The Heterogeneous Technology Alliance (HTA), a coalition of top European R&D organizations, is offering an SOI-MEMS platform. Looking to bridge the gap between academia and industry, this technological platform pools the SOI-MEMS expertise, capabilities and fabrication facilities of Leti (France), Fraunhofer (Germany), CSEM (Switzerland) and VTT (Finland). - The main focus of HTA... Read more »
  • March 27, 2015 - Peregrine Semiconductor teams with Murata to announce the 2015 UltraCMOS® Global 1 Initiative. This new initiative seamlessly integrates the PE56500 all-CMOS RF-SOI front-end solution and Murata filters. - Peregrine Semiconductor and Murata have launched the 2015 UltraCMOS® Global 1 Initiative, which includes the UltraCMOS Global 1 PE56500 and seamlessly integrates Murata filters and... Read more »
  • March 11, 2015 - Cryptocurrency mining hardware company SFARDS is preparing to release its debut miner, which is built on a 28nm FD-SOI ASIC, by April 2015. (You can read the announcement here.) - At the time of this post, tape out of the company’s SF3301ASIC has been announced as complete. Cryptocurrency (the best-known example of which is Bitcoin) depends on “ledgers” supported by bitcoin... Read more »
  • March 11, 2015 - X-FAB is running a series of webinars on very high-temperature design the 18th and 19th of March 2015. A pure-play analog/mixed-signal and specialty foundry, X-FAB’s broad portfolio includes SOI CMOS processes for use at high temperatures up to 225°C. The event is free, but space is limited, so sign up here. - As noted in the program announcement, an increasing number of applications... Read more »
  • March 5, 2015 - With a special blog and video invitation, Samsung pulled out the stops to help get the word out about the recent FD-SOI workshop in San Francisco. Kelvin Low, Sr. Director Foundry Marketing,SamsungSSI, posted Design Faster, Cooler, Smaller Chips with Samsung Foundry’s 28nm FD-SOI Process Technology (read it here). Embedded in the blog is a YouTube video encouraging people to attend... Read more »

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Strained Engineered Substrates: sSOI and Beyond

Posted by (MIT) on July 11, 2006
In Advanced Substrate Corners, ASN #5, Professor's Perspective

The semiconductor industry has entered an exciting phase in which further performance gains (power, speed) are directly connected to materials engineering and the insertion of new materials into the heart of silicon integrated circuits. The rate at which the industry is incorporating strain engineering into production is a direct result of using strained substrate materials […]

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Enhanced Strained Silicon-On-Insulator CMOS Devices Thumbnail

Enhanced Strained Silicon-On-Insulator CMOS Devices

Posted by (Freescale) on July 11, 2006
In ASN #5, Design & Manufacturing, In & Around Our Industry

Freescale has investigated a selective biaxial-uniaxial strain hybridization method that significantly enhances drive current without adding process complexity. It has become increasingly difficult to scale CMOS transistors, yet still maintain high drive currents and simultaneously reduce supply voltage (Vdd). This is because threshold voltage and gate oxide thickness cannot be scaled at the same rate […]

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AMD & SOI: Winning with Performance/Watt/Dollar Thumbnail

AMD & SOI: Winning with Performance/Watt/Dollar

Posted on July 11, 2006
In ASN #5, End-User Apps, SOI In Action
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Nick Kepler, vice president of logic technology development at AMD talks about the role of SOI in the company’s strategy. Advanced Substrate News: How important is SOI to your strategy? Nick Kepler: SOI is an important part of AMD’s product strategy. We are currently utilizing it for our entire line of 90nm AMD64 products. AMD […]

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Honeywell & SOI: Military, Aerospace and Beyond Thumbnail

Honeywell & SOI: Military, Aerospace and Beyond

Posted on July 11, 2006
In ASN #5, End-User Apps, SOI In Action
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Honeywell has sent SOI by Jupiter and to Mars. Now its SOI rad-hard foundry services are charting new frontiers with the industry’s first 150 nm rad-hard, digital ASIC solutions and more. Honeywell’s path runs parallel to commercial markets. Chips destined for space are increasingly facing the same performance vs. power issues of chips we find […]

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Partners In Design: Standard Tools Simplify Rad-Hard SOI Design Thumbnail

Partners In Design: Standard Tools Simplify Rad-Hard SOI Design

Posted on July 11, 2006
In ASN #5, End-User Apps, SOI In Action
Tagged with , , , ,

Honeywell has worked with the top EDA tool vendors to develop the SOI process design kits (PDKs) needed by both in-house designers and foundry customers. Rick Veres, Honeywell EDA Manager, explains. ASIC Design With Pilot Flow For digital rad-hard ASIC design, we worked with Synopsys to adapt the Pilot Design Environment to our process. The […]

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