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Industry Buzz

INDUSTRY BUZZ

  • July 21, 2015 - In an interview with EETimes, GlobalFoundries CEO Sanjay Jha indicated that more than 50% of the Dresden fab output could be FD-SOI by 2018 (read it here). Jha also told EETimes that More-than-Moore technologies can be considered the mainstream. In the piece entitled, Can GloFo and Europe's chip firms unite? author Peter Clarke makes an excellent point that between the four European... Read more »
  • July 21, 2015 - An IBM paper on a 14nm SOI-FinFET SRAM functional down to 0.3V has garnered press attention. The paper, entitled 14nm FinFET Based Supply Voltage Boosting Techniques for Extreme Low Vmin Operation by R.V. Joshi et al, was presented during the Symposium on VLSI Circuits in Kyoto, Japan in June. According to the abstract, the authors presented a new, “... dynamic supply and interconnect... Read more »
  • July 14, 2015 - RF-SOI champion Peregrine Semiconductor has introduced the industry’s first 300mm RF-SOI technology. Dubbed UltraCMOS® 11, it is built on GlobalFoundries’ 130 nm 300mm RF technology platform (read full press release here). - The UltraCMOS 11 platform will be the foundation for Peregrine’s high volume mobile products and SOI products for other applications. It builds on the... Read more »
  • July 14, 2015 - SOI-wafer leader Soitec has appointed Grégoire Duban as Chief Financial Officer. This recruitment supports the ongoing strategic refocusing of the Group’s activities on its core electronics business, as Soitec announced on January 19 (read full press release here). Duban will report directly to Soitec CEO Paul Boudre. - “Grégoire Duban possesses over 18 years’ experience in... Read more »
  • July 6, 2015 - Qorvo recently announced that new high-performance SOI components are landing major wins at cellular base station manufacturers. (Read the press release here.) Ideal for broadband communications systems, the highly integrated components significantly reduce external components while lowering cost, power consumption, and weight in wireless infrastructure, test and measurement, and... Read more »
  • July 6, 2015 - Synopsys recently announce that its IC Compiler II place and route solution was used by STMicroelectronics to tape out a complex 28-nm-FD-SOI SoC. (Read the press release here.) Fast throughput and analysis delivered a 10X reduction in time-to-good-floorplan. A 5X faster implementation with 2X smaller memory footprint enabled breakthrough productivity while exceeding quality of results... Read more »
  • June 12, 2015 - SOI wafer leader Soitec and SITRI (aka Shanghai Industrial µTechnology Research Institute) have announced a collaboration agreement. (Read the press release here.) They say the strategic partnership will strengthen their leadership in high-growth wireless communications and the global market for RF apps, with a special emphasis on the fast-developing Chinese RF ecosystem. - They’ll... Read more »
  • June 12, 2015 - Silicon Europe (an alliance of Europe’s leading micro- and nanoelectronics clusters) and the SOI Consortium have organized an SOI Workshop on the 7th of July 2015, during the 10th Silicon Saxony Day in Dresden. - Here’s the agenda: - Quick Introduction - More than Moore Market Analysis and Opportunities (Yole) - Power SOI and applications (NXP) - Foundry offer (GlobalFoundries) -... Read more »
  • May 29, 2015 - CEA-Leti, a leading global center for applied research in microelectronics, nanotechnologies and integrated systems, is proudly hosting its 17th LetiDays in Grenoble on June 24–25, 2015, and associated seminars and workshops on June 22nd, 23rd and 26th (click here to go to the registration site). - On June 22-23, Leti will present their first workshop on FD-SOI. This Forum brings... Read more »
  • May 29, 2015 - RF-SOI specialist Peregrine continues to expand its “SOI University” series of webinars (click here to see the full offering), which has been ongoing for five years now. The latest webinar (the fifteenth in the series) is entitled, Linearity: The Key to Successful Data Transmission in Cable & Beyond. It is presented by Peter Bacon, the company's Director of System Integration.... Read more »
  • May 14, 2015 - Cassette carrying several hundred chips intended for 100 Gb/s transceivers, diced from wafers fabricated with IBM SOI-CMOS Integrated Nano-Photonics Technology. The dense monolithic integration of optical and electrical circuits and the scalable manufacturing process provide a cost-effective silicon photonics interconnect solution, suitable for deployment in cloud servers, datacenters,... Read more »
  • May 14, 2015 - International research teams working on or interested in the far-reaching SOIPIX radiation-detector project have a workshop coming up in June. The project was originally started by KEK* scientists to develop a new detector technology and quantum beam imaging for high-energy particle physics. As research teams around the world (including Japan, USA, China and Europe) joined to take... Read more »
  • April 30, 2015 - A recent GlobalFoundries blog entitled RF-SOI is IoT's Future, and the Future is Bright (read it here) says, “RF SOI is a win-win technology option that can improve performance and data speed in smartphones and tablets, and it is expected to play a key role in the Internet of Things applications as well.” - The blog touches on the full range of benefits of RF-SOI for front-end... Read more »
  • April 30, 2015 - Presentations given at the ‘Beyond Computing' Innovative Technologies Symposium (March 2015 in Shanghai) are now available on the SOI Consortium website (click here to see the list). The Symposium covered MEMS, semiconductor manufacturing, RF and power, which are key topics for the fast growing “More than Moore” industry. The one-day, closed-door symposium was organized by members... Read more »
  • April 27, 2015 - RF-SOI will play a key role in the IoT plans of analog and mixed-signal specialist MagnaChip (read the press release here). The company has launched a task force to address IoT. The statement says, “MagnaChip also offers 0.18 micron and plans to offer 0.13 micron Silicon on Insulator (SOI) RF-CMOS technologies, which is suitable for use in antenna switching, tuner and Power Amplifier... Read more »

Latest posts
Micragem™ – An SOI-based MEMS Process Platform Thumbnail

Micragem™ – An SOI-based MEMS Process Platform

Posted by (Micralyne) on December 6, 2006
In ASN #6, In & Around Our Industry, MEMS
Tagged with , , ,

Micralyne’s robust, standardized fabrication process reduces time-to-market. One key issue companies face is time-to-market — how long it takes to move a MEMS-based product from an idea to generating revenues. Micragem™ is an SOI-based MEMS fabrication process with a set of design and process guidelines used to prototype and manufacture different types of MEMS components […]

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High-Speed Wafer Bonder Boosts SOI MEMS Productivity Thumbnail

High-Speed Wafer Bonder Boosts SOI MEMS Productivity

Posted on December 6, 2006
In ASN #6, Design & Manufacturing, In & Around Our Industry
Tagged with ,

By eliminating the need for heating and cooling, MHI’s new system brings volume production to standard and SOI MEMS. One of the advantages cited in SOI MEMS design is the ability to create more complex structures serving a wider range of applications. However, the industry’s standard wafer-level packaging can be a challenge, as it typically […]

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Here are some highlights of advanced substrate-related papers published in the second half of 2006 at top conferences and in leading journals.

Posted on December 6, 2006
In ASN #6, Paperlinks
Tagged with

From the IEEE ’06 SOI Conference: “Best Paper” indicates RF on thin HR SOI can open the door to low-cost, mass-market 200GHz applications in the coming year. A paper presented by STMicroelectronics in conjunction with IMEP UMR and IEMN, entitled “State of the art 200 GHz passive components and circuits integrated in advanced thin SOI […]

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Photoreflectance: Promising Metrology on sSOI

Posted by (Optical Metrology Innovations) on July 11, 2006
In ASN #5, Design & Manufacturing, In & Around Our Industry

OMI describes a new approach to in-line strained SOI metrology. Strained-SOI (sSOI) requires fast, accurate and non-contact strain metrology. To address new demands in the engineered substrates industry, several techniques compete: Photoreflectance spectroscopy, Raman spectroscopy, x-ray diffraction and optical birefringence. Photoreflectance appears as one of the most promising of these techniques. Biaxial strain in sSOI […]

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Strained Silicon-On-Insulator (sSOI) Becomes an Industrial Reality Thumbnail

Strained Silicon-On-Insulator (sSOI) Becomes an Industrial Reality

Posted by (Soitec) on July 11, 2006
In Advanced Substrate Corners, ASN #5, R&D/Labnews

After several years of rigorous R&D work in close partnership with suppliers and customers alike, Soitec’s sSOI wafers are now ready for industrialization. The benefits of strained silicon as an amplifier of carrier mobility, current drive and, as a result, device performance are well documented in literature and highlighted by Dr. Nguyen of Freescale in […]

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