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Industry Buzz

INDUSTRY BUZZ

  • July 6, 2015 - Qorvo recently announced that new high-performance SOI components are landing major wins at cellular base station manufacturers. (Read the press release here.) Ideal for broadband communications systems, the highly integrated components significantly reduce external components while lowering cost, power consumption, and weight in wireless infrastructure, test and measurement, and... Read more »
  • July 6, 2015 - Synopsys recently announce that its IC Compiler II place and route solution was used by STMicroelectronics to tape out a complex 28-nm-FD-SOI SoC. (Read the press release here.) Fast throughput and analysis delivered a 10X reduction in time-to-good-floorplan. A 5X faster implementation with 2X smaller memory footprint enabled breakthrough productivity while exceeding quality of results... Read more »
  • June 12, 2015 - SOI wafer leader Soitec and SITRI (aka Shanghai Industrial µTechnology Research Institute) have announced a collaboration agreement. (Read the press release here.) They say the strategic partnership will strengthen their leadership in high-growth wireless communications and the global market for RF apps, with a special emphasis on the fast-developing Chinese RF ecosystem. - They’ll... Read more »
  • June 12, 2015 - Silicon Europe (an alliance of Europe’s leading micro- and nanoelectronics clusters) and the SOI Consortium have organized an SOI Workshop on the 7th of July 2015, during the 10th Silicon Saxony Day in Dresden. - Here’s the agenda: - Quick Introduction - More than Moore Market Analysis and Opportunities (Yole) - Power SOI and applications (NXP) - Foundry offer (GlobalFoundries) -... Read more »
  • May 29, 2015 - CEA-Leti, a leading global center for applied research in microelectronics, nanotechnologies and integrated systems, is proudly hosting its 17th LetiDays in Grenoble on June 24–25, 2015, and associated seminars and workshops on June 22nd, 23rd and 26th (click here to go to the registration site). - On June 22-23, Leti will present their first workshop on FD-SOI. This Forum brings... Read more »
  • May 29, 2015 - RF-SOI specialist Peregrine continues to expand its “SOI University” series of webinars (click here to see the full offering), which has been ongoing for five years now. The latest webinar (the fifteenth in the series) is entitled, Linearity: The Key to Successful Data Transmission in Cable & Beyond. It is presented by Peter Bacon, the company's Director of System Integration.... Read more »
  • May 14, 2015 - Cassette carrying several hundred chips intended for 100 Gb/s transceivers, diced from wafers fabricated with IBM SOI-CMOS Integrated Nano-Photonics Technology. The dense monolithic integration of optical and electrical circuits and the scalable manufacturing process provide a cost-effective silicon photonics interconnect solution, suitable for deployment in cloud servers, datacenters,... Read more »
  • May 14, 2015 - International research teams working on or interested in the far-reaching SOIPIX radiation-detector project have a workshop coming up in June. The project was originally started by KEK* scientists to develop a new detector technology and quantum beam imaging for high-energy particle physics. As research teams around the world (including Japan, USA, China and Europe) joined to take... Read more »
  • April 30, 2015 - A recent GlobalFoundries blog entitled RF-SOI is IoT's Future, and the Future is Bright (read it here) says, “RF SOI is a win-win technology option that can improve performance and data speed in smartphones and tablets, and it is expected to play a key role in the Internet of Things applications as well.” - The blog touches on the full range of benefits of RF-SOI for front-end... Read more »
  • April 30, 2015 - Presentations given at the ‘Beyond Computing' Innovative Technologies Symposium (March 2015 in Shanghai) are now available on the SOI Consortium website (click here to see the list). The Symposium covered MEMS, semiconductor manufacturing, RF and power, which are key topics for the fast growing “More than Moore” industry. The one-day, closed-door symposium was organized by members... Read more »
  • April 27, 2015 - RF-SOI will play a key role in the IoT plans of analog and mixed-signal specialist MagnaChip (read the press release here). The company has launched a task force to address IoT. The statement says, “MagnaChip also offers 0.18 micron and plans to offer 0.13 micron Silicon on Insulator (SOI) RF-CMOS technologies, which is suitable for use in antenna switching, tuner and Power Amplifier... Read more »
  • April 27, 2015 - Research and consulting group Semico has issued a new report entitled SOI Update 2015: Finding New Applications (for information on getting a copy of the report, click here). As described on the Semico website: “With the recent growth in RF-SOI for switches and integrated solutions for RF functions such as power amplifiers and transceivers, the opportunities for growth in SOI wafer... Read more »
  • April 21, 2015 - SFARDS' SF3301 cryptocurrency ASIC is the world’s first chip to use 28nm FD-SOI. Surpassing expecttions, it operates at a stunning 0.45V. (Courtesy: SFARDS) - Right on schedule, the SFARDS cryptocurrency ASIC on 28nm FD-SOI has made its debut in silicon, and is surpassing expectations. In what is clearly a stunning success, the company announced that the ASIC’s lowest working... Read more »
  • April 21, 2015 - TEM cross-section of FDSOI transistor (Courtesy of STMicroelectonics) - CEA-Leti’s newest version of its advanced compact model for FD-SOI is now available in all major SPICE simulators (get the press release here). The Leti-UTSOI2.1 is the latest version of Leti’s compact model for FD-SOI, which was first released in 2013. (Compact models of transistors and other elementary devices... Read more »
  • April 9, 2015 - In a new YouTube video, Samsung’s Sr. Director of Foundry Marketing, Kelvin Low, makes a strong case for 28nm FD-SOI, especially for ultra-low-power, IoT, wearables, networking and automotive apps. The five-minute video was taped by ChipEstimate.TV host Sean O’Kane during the Cadence User Conference (CDNLive, Silicon Valley, March 2015 – click here to see it). While the first half... Read more »

Latest posts
Harnessing SOI’s Floating Body Effect for Dense Memory Cells Thumbnail

Harnessing SOI’s Floating Body Effect for Dense Memory Cells

Posted by (Innovative Silicon) on December 6, 2006
In ASN #6, Design & Manufacturing, In & Around Our Industry
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The co-inventor of Z-RAM explains the technology. As a Z-RAM – zero capacitor RAM – memory technology bit cell uses only a transistor plus the floating body effect inherent in SOI processing (see Figure 1), it typically measures only 15-20F² (where F is the technology minimum feature size).

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Ultra-Thin Body & Box (UTB²) SOI Thumbnail

Ultra-Thin Body & Box (UTB²) SOI

Posted by (STMicroelectronics) on December 6, 2006
In ASN #6, Design & Manufacturing, In & Around Our Industry
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As we approach the end of the roadmap, single gate FD SOI devices with ultra-thin BOX could pre-empt the need for double gate devices. It is well known that UTB (Ultra Thin Body) devices present improved electrostatic integrity. We were, however, among the first to report [1] on the importance of the BOX thickness with […]

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SOI Substrates with Ultra-Thin BOX Thumbnail

SOI Substrates with Ultra-Thin BOX

Posted by (Soitec) on December 6, 2006
In ASN #6, Design & Manufacturing, In & Around Our Industry
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Soitec is now sampling 25nm-thick UT-BOX. Advanced SOI with ultra thin buried oxide (UT-BOX), in which the insulating BOX layer is less than 50nm thick, brings additional benefits to SOI CMOS architecture. It enables: • electrostatic control of the device by back biasing, allowing ultra-low power operation through dynamic Vt control [1, 2]. • the […]

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The New Generation: It’s All On SOI Thumbnail

The New Generation: It’s All On SOI

Posted on December 6, 2006
In ASN #6, End-User Apps, SOI In Action
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The PS3, Wii and Xbox 360 CPU design teams all chose SOI. Here’s why. Design challenges (Read the Cell overview paper by Kahle et al on the IBM website) Achieve 100 times the PlayStation®2 performance. Joint developers IBM, Sony Group and Toshiba needed to co-optimize the chip area, design frequency, and product operating voltage, creating […]

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Hitachi’s tiny mu-chip Thumbnail

Hitachi’s tiny mu-chip

Posted on December 6, 2006
In ASN #6, End-User Apps, SOI In Action
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Already the world’s smallest RFID chip, SOI makes the next generation far thinner than a piece of paper – while radically increasing productivity. The next generation of Hitachi’s µ-chip (mu-chip) is poised to make a major impact on the RFID (radio frequency identification) world. Presented at the IEEE conference in February 2006, this latest version […]

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