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Industry Buzz

INDUSTRY BUZZ

  • April 29, 2016 - From RF-SOI pioneer Peregrine Semi comes a steady stream of new chips and design wins. - News include: - Two UltraCMOS® MPAC–Doherty products—the PE46130 and PE46140 (press release here). These monolithic phase and amplitude controllers (MPAC) join the PE46120 in offering maximum phase-tuning flexibility for Doherty power amplifier (PA) optimization. Designed for the LTE and LTE-A... Read more »
  • April 25, 2016 - Registration is open for GlobalFoundries' technical webinar, “How to Implement an ARM Cortex-A17 Processor in 22FDX 22nm FD-SOI Technology” (click here to go to the registration page). The webinar will cover the optimal steps to successfully implement ARM® Cortex®-A Series* processors using 22FDXTM 22nm FD-SOI technology. - GF Design Enablement Fellow Dr. Joerg Winkler will... Read more »
  • April 7, 2016 - GlobalFoundries recently announced availability of a new set of RF-SOI PDKs for the company's 7SW SOI technology. GF, which has now delivered more than 20 billion RF-SOI chips for the world’s smartphones, tablets and more, notes that its 7SW SOI technology is optimized for multi-band RF switching in next-generation smartphones. It is also poised to drive innovation in IoT... Read more »
  • April 5, 2016 - Three of the world's More-than-Moore and SOI technology development powerhouses have signed a comprehensive agreement for ongoing collaboration and cooperation in developing new technologies for the emerging IoT market. SITRI of Shanghai, and CEA-Leti and Minatec of Grenoble will work together to accelerate the adoption of their latest technologies and create a global innovation... Read more »
  • March 31, 2016 - Coupling Wave Solutions (CWS) has a new productivity tool called SiPEX, which enables RF-SOI designers to increase the number of design iterations—including Spice simulation—up to 10 times in the same time frame. - “With SiPEX, RF switch designers will be able to make their design changes in less than 15 minutes and obtain a few decibels (dB) of variation over silicon measurements... Read more »
  • March 23, 2016 - Don't forget to get your paper submitted to the top conference with a major focus on the SOI ecosystem: the IEEE S3S (SOI/3D/SubVt). The Call For Papers (CFP) deadline is April 15, 2016. As we noted for you in ASN back in December, the theme of the conference, which will take place October 10th – 13th in San Francisco, is “Energy Efficient Technology for the Internet of Things”. -... Read more »
  • March 18, 2016 - EDI CON China 2016, taking place April 19-21 in Beijing at the China National Convention Center (CNCC) will feature a keynote talk by GlobalFoundries' Peter Rabbeni, Sr. Director, RF BU Business Development & Product Marketing. The talk, entitled, "RF SOI: Revolutionizing Radio Design Today and Driving Innovation for Tomorrow",will kick off the newly added RF-SOI Technology Track.... Read more »
  • February 12, 2016 - Peregrine Semiconductor’s new 75-ohm glitch-less RF digital step attenuator, the UltraCMOS® PE4314, is ideal for wired broadband applications. - RF-SOI pioneer Peregrine Semiconductor has announced theUltraCMOS® PE4314, a 75-ohm glitch-less RF digital step attenuator (DSA). This new DSA extends Peregrine’s existing glitch-less DSA portfolio to 75 ohms. The PE4314 is ideal for... Read more »
  • February 8, 2016 - Professor Jean-Pierre Raskin (right) receiving the Blondel Medal for his industry-changing work on RF-SOI. Jury president Professor Pere Rocal I Cabarrocas (left) of the Ecole Polytechnique - Université Paris-Saclay presented the prize. - RF-SOI substrate guru Jean-Pierre Raskin, whose team at UCL* has driven the technology behind the most advanced wafer substrates for RF applications,... Read more »
  • February 3, 2016 - Design & Reuse, in partnership with GlobalFoundries, ST, Soitec and Leti, is sponsoring a series of FD-SOI IP Workshops around the globe. (Click here for more information.) These working days aim at sharing information about IP that’s currently available or is being designed for FD-SOI technology. - The first conference will take place during DATE in Dresden on 14 March 2016.... Read more »
  • December 23, 2015 - Mentor Graphics is collaborating with GlobalFoundries on 22nm FD-SOI to qualify the Mentor® RTL to GDS platform for the current version of GlobalFoundries 22FDX™ platform reference flow. (Read the press release here.) This includes including Mentor's RealTime Designer™ physical RTL synthesis solution and Olympus-SoC™ place & route system. In addition, Mentor and GF are... Read more »
  • December 22, 2015 - Peregrine Semiconductor’s new UltraCMOS® PE44820 is an 8-bit digital phase shifter that delivers exceptional phase accuracy and high linearity for active antenna applications. - RF-SOI pioneer Peregrine Semiconductor has introduced the UltraCMOS® PE44820, an 8-bit digital phase shifter designed for active antenna apps, covering a 358.6-degree phase range. (Read the press release... Read more »
  • December 19, 2015 - Soitec CEO Paul Boudre - VLSI Research Chip Insider has named Soitec CEO Paul Boudre to its roster of 2015 All Stars of the Semiconductor Industry. (See the announcement here.) - Boudre was cited for “...successfully re-organizing Soitec back to its core business as a leading innovative engineered substrate supplier. His first year results are already astounding, with very high growth... Read more »
  • December 17, 2015 - The IEEE S3S (SOI/3D/SubVt) has issued its call for papers for the 2016 conference (click here for details). The theme of the conference, which will take place October 10th – 13th in San Francisco, is "Energy Efficient Technology for the Internet of Things". This industry-wide event gathers together widely known experts, contributed papers and invited talks focused on SOI Technology,... Read more »
  • December 14, 2015 - CEA-Leti has signed an agreement with Keysight Technologies (formerly the Agilent/HP test group), the industry-leading device-modeling software supplier, to adopt Leti’s UTSOI extraction flow methodology within Keysight’s device modeling solutions for high-volume SPICE model generation. (Read the press release here.) - “This collaboration between Leti and Keysight will strengthen... Read more »

Latest posts
Non-Optical Inspection Technology Detects the Unseen Thumbnail

Non-Optical Inspection Technology Detects the Unseen

Posted by (Qcept Technologies) on October 31, 2007
In ASN #8, Design & Manufacturing, In & Around Our Industry
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ChemetriQ® Inspection provides fast, full-wafer inspection for Non-Visual Residue (NVR) defects. As manufacturers drive yield improvement and cost reduction programs, the ability to detect and mitigate non-visual residue (NVR) defects is just as important as historical efforts focused on physical defect inspection. Detecting submonolayer NVR defects is a challenge as they do not scatter light; […]

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SOI for Memory Applications Thumbnail

SOI for Memory Applications

Posted by (Soitec) on October 31, 2007
In Advanced Substrate Corners, ASN #8, R&D/Labnews
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SOI-based memory reverses cache crunch and simplifies DRAM scaling, boosting performance and reducing cost. Memory today represents about 25% of the estimated $260B worldwide semiconductor market. The two dominant players are DRAM (56%) and FLASH (33%). Further, memory in the form of embedded SRAM cache is becoming the dominant area user and technology driver for […]

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A GaN Approach to Schottky Diodes Thumbnail

A GaN Approach to Schottky Diodes

Posted by (Soitec) on October 31, 2007
In Advanced Substrate Corners, ASN #8, III-V
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The G²REC program aims to create a new generation of energy-efficient power devices for high-volume applications over 250V. The greater electronics industry has an urgent need for fast-switching, high-voltage, energy-efficient and cost-competitive rectifiers. Rectifiers (which convert AC to DC) are comprised of diodes, components that ensure electricity flows in just one direction. For certain high-volume […]

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Books & Journals

Posted on October 31, 2007
In ASN #8, Paperlinks
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SOI Materials and Devices, S. Cristoloveanu and G. K. Celler, Chapter 4 of Handbook of Semiconductor Manufacturing Technology, 2nd edition, edited by R. Doering and Y. Nishi (CRC Press, Taylor and Francis Group, Boca Raton, Fl, 2007), pages 4-1 to 4-52 Low temperature diffusion of impurities in hydrogen implanted silicon, S. Personnic, K. K. Bourdelle, […]

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Conference Proceedings

Posted on October 31, 2007
In ASN #8, Paperlinks
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International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) (April 2007): Multi-Gate MOSFETs with Dual Contact Etch Stop Liner Stressors on Tensile Metal Gate and Strained Silicon on Insulator (sSOI), Che-Hua Hsu, Weize Xiong, Chien-Ting Lin, Yao-Tsung Huang, Mike Ma1, C.R Cleavelin, Paul Patruno, Mark Kennard, Ian Cayrefourcq, Kyoungsub Shin, Tsu-Jae King Liu (UMC, Texas […]

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