ASN
Industry Buzz

INDUSTRY BUZZ

  • February 3, 2016 - Design & Reuse, in partnership with GlobalFoundries, ST, Soitec and Leti, is sponsoring a series of FD-SOI IP Workshops around the globe. (Click here for more information.) These working days aim at sharing information about IP that’s currently available or is being designed for FD-SOI technology. - The first conference will take place during DATE in Dresden on 14 March 2016.... Read more »
  • December 23, 2015 - Mentor Graphics is collaborating with GlobalFoundries on 22nm FD-SOI to qualify the Mentor® RTL to GDS platform for the current version of GlobalFoundries 22FDX™ platform reference flow. (Read the press release here.) This includes including Mentor's RealTime Designer™ physical RTL synthesis solution and Olympus-SoC™ place & route system. In addition, Mentor and GF are... Read more »
  • December 22, 2015 - Peregrine Semiconductor’s new UltraCMOS® PE44820 is an 8-bit digital phase shifter that delivers exceptional phase accuracy and high linearity for active antenna applications. - RF-SOI pioneer Peregrine Semiconductor has introduced the UltraCMOS® PE44820, an 8-bit digital phase shifter designed for active antenna apps, covering a 358.6-degree phase range. (Read the press release... Read more »
  • December 19, 2015 - Soitec CEO Paul Boudre - VLSI Research Chip Insider has named Soitec CEO Paul Boudre to its roster of 2015 All Stars of the Semiconductor Industry. (See the announcement here.) - Boudre was cited for “...successfully re-organizing Soitec back to its core business as a leading innovative engineered substrate supplier. His first year results are already astounding, with very high growth... Read more »
  • December 17, 2015 - The IEEE S3S (SOI/3D/SubVt) has issued its call for papers for the 2016 conference (click here for details). The theme of the conference, which will take place October 10th – 13th in San Francisco, is "Energy Efficient Technology for the Internet of Things". This industry-wide event gathers together widely known experts, contributed papers and invited talks focused on SOI Technology,... Read more »
  • December 8, 2015 - Citing strong RF-SOI demand, TowerJazz has signed an agreement to purchase Maxim’s 8-inch fab in San Antonio, Texas (shown here). - With the acquisition of Maxim’s 8-inch fab in San Antonio, Texas, TowerJazz plans to quickly qualify its core specialty technologies, including its advanced Radio-Frequency Silicon-on-Insulator (RF-SOI) offering, to serve the substantial growth in... Read more »
  • December 8, 2015 - CEA-Leti announced it has developed two techniques to induce local strain in FD-SOI processes for next-generation FD-SOI circuits that will produce more speed or lower power consumption and improved performance. (For more details, read the press release here.) Targeting the 22/20nm node, the local-strain solutions are dual-strained technologies: compressive SiGe for PFETs and tensile Si... Read more »
  • November 30, 2015 - Toshiba has announced TaRF8, the next generation in the company's TarfSOI™ (aka Toshiba advanced RF SOI) process, which is optimized for RF switch apps. The first product to use the technology is Toshiba's new SP12T, enabling the lowest-class of insertion loss in the industry. Lowering insertion loss is recognized as particularly important in decreasing RF transmission power loss,... Read more »
  • November 30, 2015 - A recent NewElectronics article entitled ST’s FD-SOI transistor is set to give analogue designers a new knob to tune parameters, explores the many reasons that FD-SOI makes designers happy – even the analog folks. Editor Graham Pitcher talked to analog designer Andreia Cathelin, a senior member of STMicroelectronics’ technical staff. Among plenty of other things, she noted that... Read more »
  • November 27, 2015 - Cadence has announced that its digital and signoff tools are now enabled for the current version of the GLOBALFOUNDRIES® 22FDX™ platform reference flow (see press release here). GF has qualified these tools for the 22FDX reference flow to provide customers with the design flexibility of software-controlled body bias to manage power, performance and leakage needed to create... Read more »
  • November 27, 2015 - The 2016 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon, aka EUROSOI-ULIS 2016 will be taking place January 25-27, 2016 in Vienna, Austria. The event will be hosted by the Institute for Microelectronics, TU Wien. The focus of the sessions is on SOI technology and advanced nanoscale devices. The organizing committee invites active... Read more »
  • November 23, 2015 - Synopsys has announced a comprehensive RTL-to-GDSII solution for GlobalFoundries 22nm technology process. The implementation and signoff tools from the Synopsys Galaxy™ Design Platform have been enabled for the current version of GF's' 22FDX™ platform reference flow. GF has qualified these tools to use body bias to manage power, performance and leakage to achieve optimal energy... Read more »
  • November 23, 2015 - ATopTech, a leader in next-generation physical design solutions, has announced that their Aprisa™ and Apogee™ Place & Route tools are now enabled for the current version of the GlobalFoundries 22FDX™ platform reference flow. GF has qualified these tools for the 22FDX reference flow to provide customers with the design flexibility of using body bias to manage power, performance... Read more »
  • October 28, 2015 - Renesas Electronics will be coming out with chips built on 65nm FD-SOI technology by spring of 2016, reports EETimes Japan (see article in Japanese here, or a version translated by Google here). Although the story dates from February 2015, it has barely been covered in the English-speaking press. (FD-SOI expert Ali Khakifirooz talked about it briefly in a SemiWiki piece last month... Read more »
  • October 28, 2015 - Tags: FD-SOI, Leti, GlobalFoundries, GF, 22nm, IoT, design, foundry, manufacturing - Leti has joined the GlobalFoundries' GlobalSolutions ecosystem as an ASIC provider, specifically to support GF's 22FDX™ technology platform. (Read the press release here.) Earlier this year, Leti assigned a team of experts to GF's’ Dresden Fab 1 to support ramp up of the platform. As an ecosystem... Read more »

Latest posts
Advanced substrates for 3D and other new markets drive new fab inspection equipment – interview with Altatech GM Thumbnail

Advanced substrates for 3D and other new markets drive new fab inspection equipment – interview with Altatech GM

Posted by on October 6, 2015
In Design & Manufacturing, News & Viewpoints
Tagged with , , , , , , , ,

New approaches in chipmaking and fast-evolving specialty markets are driving the need for new equipment on the fab floor. 3D chips (be they stacked or bonded), MEMS, lighting, power – they’re all leveraging wafer substrates in new ways. Altatech, the equipment division of SOI-wafer leader Soitec, has just announced new inspection equipment for foundry and […]

Continue ReadingLeave a Comment
GF’s 22nm FD-SOI Offering – Where to Get Lots of Excellent Info Thumbnail

GF’s 22nm FD-SOI Offering – Where to Get Lots of Excellent Info

Posted by on October 2, 2015
In Design & Manufacturing, Editor's Blog
Tagged with , , , , , , , , , , , , , , , ,

A fast-growing body of information is now posted by GlobalFoundries on their new 22nm FD-SOI offering. After years of asking “where’s FD-SOI on the GF website??”, it’s (finally!) there, front and center. There are some excellent new videos and documents. Here’s a rundown of what you’ll find. When you click down the “Technology Solutions” tab […]

Continue ReadingLeave a Comment
First SOI wafers based on Smart Cut tech produced in China, target strong 200mm SOI demand in smart power, RF, automotive Thumbnail

First SOI wafers based on Smart Cut tech produced in China, target strong 200mm SOI demand in smart power, RF, automotive

Posted by on September 24, 2015
In Design & Manufacturing, Editor's Blog
Tagged with , , , , , , , , , , , , , , , , , ,

Shanghai-based Simgui has produced the company’s first 200mm SOI wafers based on Soitec‘s Smart CutTM manufacturing technology (read the press release here). Samples will be going to customers in the coming weeks for qualification, with high-volume ramp planned for early 2016. Simgui will be selling the wafers directly to its own customers in China, and […]

Continue ReadingView Comments (3)
Great line-up planned for IEEE S3S (SOI, 3D and low-voltage — 5-8 October, Sonoma, CA). Advance Program available. Registration still open. Thumbnail

Great line-up planned for IEEE S3S (SOI, 3D and low-voltage — 5-8 October, Sonoma, CA). Advance Program available. Registration still open.

Posted by on September 10, 2015
In Conferences, In & Around Our Industry
Tagged with , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , ,

Now in its third year, the 2015 IEEE S3S Conference has evolved into the premier venue for sharing the latest and most important findings in the areas of process integration, advanced materials & materials processing, and device and circuit design for SOI, 3D and low-voltage microelectronics. World-class leading experts in their fields will come to […]

Continue ReadingLeave a Comment
Go! FD-SOI Wafer Suppliers Ready for High-Volume Ramp; Atomic-Scale Uniformity Assured Thumbnail

Go! FD-SOI Wafer Suppliers Ready for High-Volume Ramp; Atomic-Scale Uniformity Assured

Posted by on July 21, 2015
In Design & Manufacturing, Editor's Blog
Tagged with , , , , , , , , , ,

With the great news about FD-SOI foundry offerings from Samsung, ST and now GlobalFoundries, plus the IP availability, the wafer suppliers have chimed in to remind the ecosystem they’re ready to ramp (and have been for a number of years!). So the wafers are ready (and they truly are amazing), the processes ensuring high yield […]

Continue ReadingLeave a Comment