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Industry Buzz

INDUSTRY BUZZ

  • April 27, 2015 - RF-SOI will play a key role in the IoT plans of analog and mixed-signal specialist MagnaChip (read the press release here). The company has launched a task force to address IoT. The statement says, “MagnaChip also offers 0.18 micron and plans to offer 0.13 micron Silicon on Insulator (SOI) RF-CMOS technologies, which is suitable for use in antenna switching, tuner and Power Amplifier... Read more »
  • April 27, 2015 - Research and consulting group Semico has issued a new report entitled SOI Update 2015: Finding New Applications (for information on getting a copy of the report, click here). As described on the Semico website: “With the recent growth in RF-SOI for switches and integrated solutions for RF functions such as power amplifiers and transceivers, the opportunities for growth in SOI wafer... Read more »
  • April 21, 2015 - SFARDS' SF3301 cryptocurrency ASIC is the world’s first chip to use 28nm FD-SOI. Surpassing expecttions, it operates at a stunning 0.45Vt supply voltage. (Courtesy: SFARDS) - Right on schedule, the SFARDS cryptocurrency ASIC on 28nm FD-SOI has made its debut in silicon, and is surpassing expectations. In what is clearly a stunning success, the company announced that the ASIC’s... Read more »
  • April 21, 2015 - TEM cross-section of FDSOI transistor (Courtesy of STMicroelectonics) - CEA-Leti’s newest version of its advanced compact model for FD-SOI is now available in all major SPICE simulators (get the press release here). The Leti-UTSOI2.1 is the latest version of Leti’s compact model for FD-SOI, which was first released in 2013. (Compact models of transistors and other elementary devices... Read more »
  • April 9, 2015 - In a new YouTube video, Samsung’s Sr. Director of Foundry Marketing, Kelvin Low, makes a strong case for 28nm FD-SOI, especially for ultra-low-power, IoT, wearables, networking and automotive apps. The five-minute video was taped by ChipEstimate.TV host Sean O’Kane during the Cadence User Conference (CDNLive, Silicon Valley, March 2015 – click here to see it). While the first half... Read more »
  • April 9, 2015 - Hua Hong Semiconductor of Shanghai (a pure-play 200mm foundry operated by HHGrace Semi) recently launched a 0.2μm RF-SOI process design kit (PDK) (click here to read the full press release). The 0.2μm RF-SOI technology platform has been successfully validated and is ready for customers product design and development, says the company. It is tailored and optimized for wireless RF... Read more »
  • March 27, 2015 - The Heterogeneous Technology Alliance (HTA), a coalition of top European R&D organizations, is offering an SOI-MEMS platform. Looking to bridge the gap between academia and industry, this technological platform pools the SOI-MEMS expertise, capabilities and fabrication facilities of Leti (France), Fraunhofer (Germany), CSEM (Switzerland) and VTT (Finland). - The main focus of HTA... Read more »
  • March 27, 2015 - Peregrine Semiconductor teams with Murata to announce the 2015 UltraCMOS® Global 1 Initiative. This new initiative seamlessly integrates the PE56500 all-CMOS RF-SOI front-end solution and Murata filters. - Peregrine Semiconductor and Murata have launched the 2015 UltraCMOS® Global 1 Initiative, which includes the UltraCMOS Global 1 PE56500 and seamlessly integrates Murata filters and... Read more »
  • March 11, 2015 - Cryptocurrency mining hardware company SFARDS is preparing to release its debut miner, which is built on a 28nm FD-SOI ASIC, by April 2015. (You can read the announcement here.) - At the time of this post, tape out of the company’s SF3301ASIC has been announced as complete. Cryptocurrency (the best-known example of which is Bitcoin) depends on “ledgers” supported by bitcoin... Read more »
  • March 11, 2015 - X-FAB is running a series of webinars on very high-temperature design the 18th and 19th of March 2015. A pure-play analog/mixed-signal and specialty foundry, X-FAB’s broad portfolio includes SOI CMOS processes for use at high temperatures up to 225°C. The event is free, but space is limited, so sign up here. - As noted in the program announcement, an increasing number of applications... Read more »
  • March 5, 2015 - With a special blog and video invitation, Samsung pulled out the stops to help get the word out about the recent FD-SOI workshop in San Francisco. Kelvin Low, Sr. Director Foundry Marketing,SamsungSSI, posted Design Faster, Cooler, Smaller Chips with Samsung Foundry’s 28nm FD-SOI Process Technology (read it here). Embedded in the blog is a YouTube video encouraging people to attend... Read more »
  • March 5, 2015 - SemiWiki founder Dan Nenni notes that their 41 FD-SOI related posts to date have drawn over 200,000 views (you can read his whole post about it here). Of that, he notes, over 60,000 came to the site directly via a search for the keyword FD-SOI. “So, if there is a question in your mind as to when FD-SOI will come to the mainstream semiconductor market the answer is very soon,... Read more »
  • March 3, 2015 - Freescale is designing its next generation microprocessor, the iMX7, on 28nm FD-SOI, EETimes has just revealed. This was in an article by Chief International Correspondent Junko Yoshida entitled Freescale, Cisco, Ciena Give Nod to FD-SOI (read it here). Freescale microcontroller SVP & GM Geoff Lees told EETimes the chip’s designed for “'secure' IoT applications, including... Read more »
  • March 3, 2015 - NXP recently expanded its GreenChip line of SOI-based power supply controller ICs with the new TEA1832TS (click here for more product info). Here at ASN, we first covered this line back in 2011 (see that Buzz here), and NXP’s been adding to it ever since. - Smart, green power supplies are one of the most important ways that designers reduce the power consumption of modern electronics.... Read more »
  • February 23, 2015 - SureCore's ultra-low power SRAM technology on 28nm FD-SOI saves 70% in read/write power and reduces leakage by 30% compared to 40nm bulk implementations, writes SemiconductorEngineering Editor-In-Chief Ed Sperling (read the article here). Hitting the sweet spot for mobile, IoT and wearables, SureCore recently raised $1.6 million in... Read more »

Latest posts
Tokyo FD-SOI/RF-SOI Workshop (part 1): Samsung, ST presentations & more Thumbnail

Tokyo FD-SOI/RF-SOI Workshop (part 1): Samsung, ST presentations & more

Posted by on February 8, 2015
In Design & Manufacturing, Editor's Blog
Tagged with , , , , , , , , , , , , ,

A dozen excellent presentations on FD-SOI and RF-SOI were made by industry leaders at the recent workshop in Tokyo. Here in part 1 of ASN’s coverage, we’ll take a quick look at the presentations by Samsung, ST, IBS, IBM and Lapis. In part 2, we’ll look at Sony’s, as well as the presentations from the […]

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LTE-A/5G: Bring it on.  Next-gen Soitec eSI90 wafers predict & improve RF performance. Thumbnail

LTE-A/5G: Bring it on. Next-gen Soitec eSI90 wafers predict & improve RF performance.

Posted by on February 2, 2015
In Design & Manufacturing, Editor's Blog
Tagged with , , , , , , , , , , , , , , , , , ,

The folks at SOI wafer maker Soitec have announced an amazing update to their RF wafer line-up, with what they’re calling their eSI90 substrate (read the press release here). As you might expect, it improves on their terrifically successful line of substrates for the RF chips in smartphones and other mobile devices. And now with […]

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2015 – Turning the Tables for FD-SOI, RF-SOI and More Thumbnail

2015 – Turning the Tables for FD-SOI, RF-SOI and More

Posted by on January 22, 2015
In Editor's Blog
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If current momentum is any indication, 2015 will be the year the tables turn in favor of FD-SOI designs (with a big shout-out to IoT).  The RF-SOI juggernaut will continue cutting an enormous swath through the mobile market.   Attention to the exciting possibilities of monolithic 3D (M3D) technology (like Leti’s “CoolCube”) will continue to grow, […]

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SOI for MEMS, NEMS, sensors and more at IEDM ’14 (Part 3 of 3 in ASN’s IEDM coverage) Thumbnail

SOI for MEMS, NEMS, sensors and more at IEDM ’14 (Part 3 of 3 in ASN’s IEDM coverage)

Posted by on January 12, 2015
In Conferences, Paperlinks, R&D/Labnews
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Important SOI-based developments in MEMS, NEMS (like MEMS but N for nano), sensors and energy harvesting shared the spotlight with advanced CMOS and future devices at IEDM 2014 (15-17 December in San Francisco). IEDM is the world’s showcase for the most important applied research breakthroughs in transistors and electronics technology. Here in Part 3, we’ll […]

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SOI-based future device structures at IEDM ’14 (Part 2 of 3 in ASN’s IEDM coverage) Thumbnail

SOI-based future device structures at IEDM ’14 (Part 2 of 3 in ASN’s IEDM coverage)

Posted by on January 9, 2015
In Conferences, Paperlinks, R&D/Labnews
Tagged with , , , , , , , , , , , , , , , , , , ,

Beyond FD-SOI and FinFETs, important SOI-based developments in advanced device architectures including nanowires (NW), gate all around (GAA) and other FET structures shared the spotlight at IEDM 2014 (15-17 December in San Francisco). IEDM is the world’s showcase for the most important applied research breakthroughs in transistors and electronics technology. Here in Part 2 of […]

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