Industry Buzz


  • October 6, 2015 - Slide from Freescales presentation at the 2015 Shanghai FD-SOI Forum. (Courtesy: Freescale) - 28nm FD-SOI is on the Freescale roadmap for two key platforms in the company's flagship i.MX line of embedded application processors: - the i.MX 8 series for advanced graphics and performance, which is based on the ARM v8-A, - and the i.MX 7 power efficiency series, which is based on the ARM... Read more »
  • October 6, 2015 - Using SiTimes' SOI-MEMS based oscillator can extend battery life by a full day in some apps, Piyush Sevalia, Executive Vice President, Marketing for SiTime explained in a recent Planet Analog piece (read the whole thing here). - The traditional timing device is a quartz (passive crystal) resonator, which doesn't draw any power itself. But it doesn't save any either. As Piyush describes:... Read more »
  • October 2, 2015 - In what may be a first for the MEMS industry, CEA-Leti has manufactured micro-accelerometers on 300mm wafers, a development that could lead to significantly lower MEMS manufacturing costs. And yes, those 300mm wafers are SOI wafers. These are “thick” SOI wafers, with an insulating BOx (buried oxide) layer of 2µm, and top silicon of 220nm. - The most advanced of Leti'splatforms is... Read more »
  • October 2, 2015 - A very successful two-day forum on FD-SOI and RF-SOI in Shanghai (September 2015) featured presentations from CEOs, CTOs and VPs at GF, ST, Leti, ARM, Verisilicon, Synapse Design, SITRI, Skyworks, Freescale, TowerJazz, Soitec, Qorvo and many more. Most of the presentations are now available on the SOI Consortium Website, and the rest are expected shortly, so keep checking back. - To... Read more »
  • September 24, 2015 - In an EETimes interview, GlobalFoundries CEO Sanjay Jha said RF-SOI and FD-SOI were “...the right technologies at the right time,” (read the full piece here). He offered the new iPhone 6s as a proofpoint for the value of RF-SOI. For the company's 22nm FD-SOI, he said production tape-out will be “ the second half of 2016”. He sees big opps for FD-SOI with the fabless... Read more »
  • September 24, 2015 - Soitec, the world's SOI wafer leader, announced that the Board of Directors has named André-Jacques Auberton-Hervé as Chairman Emeritus (he founded Soitec together with Jean-Michel Lamure in 1992). - CEO Paul Boudre has been appointed Chairman of Soitec’s Board of Directors. - (Read the press release... Read more »
  • September 10, 2015 - FD-SOI champion STMicroelectronics has unveiled the company's first System-on-Chip (SoC) products on FD-SOI. Two multi-core ARM SoC offerings – both for set-top boxes – have been announced. ST credits the 28nm FD-SOI silicon technology with providing highly-efficient RF and analog integration as well as outstanding power efficiency so that set-top box makers can now design very... Read more »
  • September 10, 2015 - Global specialty foundry TowerJazz and TowerJazz Panasonic Semiconductor Co. (TPSCo), the leading analog foundry in Japan, have announced breakthrough RF-SOI technology for next-generation 4G LTE smartphones and IoT devices. Through a collaborative effort, TowerJazz and its majority owned subsidiary, TPSCo, have developed a new 300mm RF-SOI process that can reduce losses in an RF switch... Read more »
  • July 21, 2015 - In an interview with EETimes, GlobalFoundries CEO Sanjay Jha indicated that more than 50% of the Dresden fab output could be FD-SOI by 2018 (read it here). Jha also told EETimes that More-than-Moore technologies can be considered the mainstream. In the piece entitled, Can GloFo and Europe's chip firms unite? author Peter Clarke makes an excellent point that between the four European... Read more »
  • July 21, 2015 - An IBM paper on a 14nm SOI-FinFET SRAM functional down to 0.3V has garnered press attention. The paper, entitled 14nm FinFET Based Supply Voltage Boosting Techniques for Extreme Low Vmin Operation by R.V. Joshi et al, was presented during the Symposium on VLSI Circuits in Kyoto, Japan in June. According to the abstract, the authors presented a new, “... dynamic supply and interconnect... Read more »
  • July 14, 2015 - RF-SOI champion Peregrine Semiconductor has introduced the industry’s first 300mm RF-SOI technology. Dubbed UltraCMOS® 11, it is built on GlobalFoundries’ 130 nm 300mm RF technology platform (read full press release here). - The UltraCMOS 11 platform will be the foundation for Peregrine’s high volume mobile products and SOI products for other applications. It builds on the... Read more »
  • July 14, 2015 - SOI-wafer leader Soitec has appointed Grégoire Duban as Chief Financial Officer. This recruitment supports the ongoing strategic refocusing of the Group’s activities on its core electronics business, as Soitec announced on January 19 (read full press release here). Duban will report directly to Soitec CEO Paul Boudre. - “Grégoire Duban possesses over 18 years’ experience in... Read more »
  • July 6, 2015 - Qorvo recently announced that new high-performance SOI components are landing major wins at cellular base station manufacturers. (Read the press release here.) Ideal for broadband communications systems, the highly integrated components significantly reduce external components while lowering cost, power consumption, and weight in wireless infrastructure, test and measurement, and... Read more »
  • July 6, 2015 - Synopsys recently announce that its IC Compiler II place and route solution was used by STMicroelectronics to tape out a complex 28-nm-FD-SOI SoC. (Read the press release here.) Fast throughput and analysis delivered a 10X reduction in time-to-good-floorplan. A 5X faster implementation with 2X smaller memory footprint enabled breakthrough productivity while exceeding quality of results... Read more »
  • June 12, 2015 - SOI wafer leader Soitec and SITRI (aka Shanghai Industrial µTechnology Research Institute) have announced a collaboration agreement. (Read the press release here.) They say the strategic partnership will strengthen their leadership in high-growth wireless communications and the global market for RF apps, with a special emphasis on the fast-developing Chinese RF ecosystem. - They’ll... Read more »

Latest posts
It’s Official! GlobalFoundries Launches 22FDX: 22nm FD-SOI in 4 flavors Thumbnail

It’s Official! GlobalFoundries Launches 22FDX: 22nm FD-SOI in 4 flavors

Posted by on July 14, 2015
In Design & Manufacturing, Editor's Blog
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With much fanfare, GlobalFoundries has officially announced its 22nm FD-SOI offering. Dubbed “22FDX™”, GF says the platform delivers FinFET-like performance and energy-efficiency at a cost comparable to 28nm planar, targeting mainstream mobile, IoT, RF connectivity and networking markets. Asked by EETimes why FD-SOI here and now, GF’s CEO Sanjay Jha responded, “The mass market is […]

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Yes! FD-SOI IP Ready for GF, Samsung; Ecosystem Now a Force to Be Reckoned With Thumbnail

Yes! FD-SOI IP Ready for GF, Samsung; Ecosystem Now a Force to Be Reckoned With

Posted by on July 6, 2015
In Conferences, Design & Manufacturing, Editor's Blog
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The recent LetiDays FD-SOI workshop in Grenoble was the biggest show of force to date for the burgeoning FD-SOI ecosystem. In addition to a raft of excellent presentations, we learned two very big pieces of news. First, GlobalFoundries provided more insights into their upcoming FD-SOI offering. And second, designers opting for Samsung’s 28nm FD-SOI offering […]

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GlobalFoundries FD-SOI Webinar 24 June 2015, 10am PST: Be There! Thumbnail

GlobalFoundries FD-SOI Webinar 24 June 2015, 10am PST: Be There!

Posted by on June 13, 2015
In Design & Manufacturing, Editor's Blog
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It’s happening! GlobalFoundries is having an FD-SOI technical webinar on the 24th of June 2015. Don’t wait – sign up now – click here to get the registration document. Here’s the information we know so far. Title: Extending Moore’s Law with FD-SOI Technology  Agenda: FD-SOI technology overview Power Performance Area (PPA) advantages Transistor control with […]

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X-Fab Interview: SOI Solutions for analog/mixed-signal, high-voltage, high-temperature and MEMS Applications Thumbnail

X-Fab Interview: SOI Solutions for analog/mixed-signal, high-voltage, high-temperature and MEMS Applications

Posted by on May 29, 2015
In Design & Manufacturing, News & Viewpoints
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With five manufacturing sites around the world and 72,000 wafer starts/month, X-Fab is a leading pure-play analog/mixed-signal and specialty foundry for automotive, industrial and medical applications. ASN recently had the opportunity to talk to Tilman Metzger, Product Marketing Manager for the X-Fab Group, about when customers choose an SOI-based offering. Advanced Substrate News (ASN): Can […]

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FinFET or FD-SOI? Designers have a real choice, say experts Thumbnail

FinFET or FD-SOI? Designers have a real choice, say experts

Posted by on May 14, 2015
In Editor's Blog
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Is FD-SOI a better choice than FinFETs for my chip? In some high-profile forums, designers are now asking that question. And the result is coming back: almost certainly. Is there a place for FinFETs? Of course there is. If it’s a really big digital chip –  no significant analog integration, where leakage not your biggest […]

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