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Industry Buzz

INDUSTRY BUZZ

  • January 22, 2015 - Leti's M3D technology is now called "CoolCube". (Courtesy: Leti, IEDM 2014) - Leti’s monolithic 3D technology, which has now been dubbed “CoolCube”, was featured in a recent EETimes piece. Entitled True 3D monolithic integration eliminates TSV dependence (click here to read it), the article covers a Leti paper presented during a 3D-VLSI workshop preceding IEDM’14. Leti’s... Read more »
  • January 22, 2015 - Paul Boudre has been named CEO of Soitec. - Paul Boudre has been named CEO of SOI wafer leader, Soitec (see financial press release here). The company also announced its plans to re-focus on its core electronics business unit. - Q3 sales were 48 million euros, up 45% over last year. The sale of 200mm wafers (which are used in chips for RF-SOI and smartpower) were almost doubled from... Read more »
  • January 12, 2015 - A new interactive WebEx webinar on FD-SOI design sponsored by CMC Microsystems has been posted. Entitled Design and Characterization of Circuits and Devices in the ST 28nm Fully-Depleted Silicon-On-Insulator (FD SOI) (click hereto view it), it features two presentations by University of Toronto professors based on their recent experiences with circuit design in the ST’s 28nm FDSOI... Read more »
  • January 12, 2015 - New record solar cell on a 100 mm wafer yielding approximately 500 concentrator solar cell devices. (©Fraunhofer ISE/Photo Alexander Wekkeli) - A new world record of 46% for the direct conversion of sunlight into electricity was recently established by Soitec, Leti and the Fraunhofer Institute for Solar Energy Systems ISE (read the press release here). Multi-junction cells are used in... Read more »
  • January 9, 2015 - The IEEE SOI-3D-Subthreshold Microelectronics TechnologyUnified Conference (IEEE S3S) has issued the 2015 Call for Papers. - Now in its 3rd year as a combined event, the 2015 IEEE S3S Conference will take place in Sonoma Valley, CA, just north of San Francisco, October 5-8. This industry-wide event will gather together widely known experts, contributed papers and invited talks on three... Read more »
  • January 9, 2015 - There’s been a significant uptick in patents related to fully-depleted SOI, according to a new report byKnowMade(clickhereto getthe report brochure). The report looks at both FD-SOI and SOI-FinFETs (both of which are fully depleted technologies). More than 740 patent families have been published to date, of which planar FD-SOI accounts for 340 families. Following a rush of activity... Read more »
  • January 7, 2015 - SOI wafer and advanced substrate leader Soitec and Korea’s SK Innovation (SKI) recently signed a Collaboration Agreement (CA) to establish a strategic alliance (read the press release here). The focus is on accelerating innovation in the area of semiconductor materials for information communication technologies and internet-of-things applications. - The collaborative partnership will... Read more »
  • January 7, 2015 - Samsung’s “28FDSOI comes with a complete design ecosystem (PDK, Library, IP, and DFM),” says Kelvin Low in a blog entitled, “2014, What a Year It’s Been for Samsung Foundry. (Click here to read it.) Kelvin’s Senior Director, Foundry Marketing at Samsung Semiconductor, Inc. Samsunglicensed the process technologyfrom ST in May 2014. “Customers who are looking to manufacture... Read more »
  • December 9, 2014 - Under a new agreement, Simgui now has the exclusive right to promote, distribute and sell Soitec’s 200-mm SOI wafers in China (see press release in Englishhere; Chinese versionhere). Soitec is the world's leading producer of SOI wafers. Shanghai Simgui Technology Co., Ltd. (Simgui), a Shanghai-based semiconductor materials company, is a spinoff of the Shanghai Institute of Microsystem... Read more »
  • December 8, 2014 - The Orion Lightspeed™ inspection system by Altatech (a division of Soitec) pinpoints the true size and location of nano-scale defects inside compound semiconductor materials and transparent substrates - Two new products from semi equipment manufacturer Altatech: one for ultra-thin film deposition, and one for searching out nano-defects. Altatech is a division of Soitec, best known in... Read more »
  • November 3, 2014 - SOI-MEMS timing device leader SiTime Corporation is being acquired by MegaChips Corporation,a top 25 fabless semiconductor company based in Japan for $200 million in cash. (read the press release here). This transaction combines two complementary fabless semiconductor leaders that provide solutions for the growing Wearables, Mobile and Internet of Things markets. - “MEMS components... Read more »
  • November 3, 2014 - Soitec, a leader in SOI wafers and other advanced substrates, recently announced the sale of its gallium arsenide (GaAs) epitaxy business (the Soitec Specialty Electronics subsidiary) to Intelligent Epitaxy Technology Inc (see press release here). The deal follows the previous collaboration between Soitec and IntelliEPI (see press release dated December 12, 2013). - “The sale of our... Read more »
  • October 27, 2014 - Peregrine Semi's new RF-SOI based UltraCMOS® PE42722 high-linearity RF switch allows customer premises equipment (CPE) vendors to future proof their devices to meet the strict linearity requirements of the DOCSIS 3.1 Cable Industry Standard (Courtesy: Peregrine Semi) - Peregrine Semi senior marketing manager Kinana Hussain says the company's new RF-SOI PE42722 switch “...is a game... Read more »
  • October 27, 2014 - In a piece entitled Time To Look At SOI Again (you can read it here), SemiconductorEngineering Executive Editor Mark Lapedus charts the industry's accelerating interest in SOI, including FD-SOI and FinFETs on SOI. - He notes that FD-SOI is now planned for four generations: 28nm, 20nm, 14nm and 10nm. The offering has expanded beyond ST to Samsung and GF. He quotes GF's Mike Mendicino as... Read more »
  • October 17, 2014 - In a blog entitled “FD-SOI Will Be Mainstream” (8 October 2014 – read it here), ElectronicsWeekly'sDavid Manners reports that the CEO of Synapse Design predicts FD-SOI will be a mainstream technology. - Synapse has been working in FD-SOI since 2011, has already taped out three designs and has more in the pipeline, the CEO told Manners. He sees a lot of activity coming from Japan... Read more »

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ASN Exclusive Interview: Skyworks on SOI for RF Thumbnail

ASN Exclusive Interview: Skyworks on SOI for RF

Posted by on November 4, 2013
In Editor's Blog
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Skyworks has a growing portfolio of chips on SOI. Kevin Walsh, the company’s Marketing Director of Analog Solutions, tells ASN why. Advanced Substrate News: Can you tell us generally about Skyworks’ vision and position in the market? Kevin Walsh: Skyworks Solutions, Inc. is an innovator of high performance analog semiconductors and one of the world’s […]

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Back-biasing for FD-SOI – a simple way to meet power/performance targets Thumbnail

Back-biasing for FD-SOI – a simple way to meet power/performance targets

Posted by on November 2, 2013
In Design & Manufacturing, Editor's Blog
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FD-SOI with back-biasing* (BB – also referred to as body-biasing) is an immensely powerful tool, especially for getting great performance at very low voltages with extremely low leakage. Implemented on a smartphone processor, it’s what would give you that extra day of battery life or get you to 3GHz. But what does it mean for […]

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IP Value Starts at the Substrate Level Thumbnail

IP Value Starts at the Substrate Level

Posted by on October 19, 2013
In News & Viewpoints, SOI In Action
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If you say “IP” in the chip business, everyone thinks of cores and design. But in fact, the importance of intellectual property for chips can extend right down to the substrate level. Engineered, advanced wafer substrates open new doors for designers. For example, Soitec recently announcement that we are licensing some of our Smart Stacking™ […]

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Toshiba Says New RF-SOI Antenna Switch for Smartphones Is Smallest Thumbnail

Toshiba Says New RF-SOI Antenna Switch for Smartphones Is Smallest

Posted by on October 14, 2013
In Design & Manufacturing, Editor's Blog
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Another RF-SOI solution is making headlines. Leveraging SOI, Toshiba has announced an SP10T RF antenna switch for the smartphone market. The company says it achieves the industry’s lowest insertion loss and smallest size. The company credits its new generation TaRF5 process, the latest in its line of Toshiba-original TarfSOI™ (Toshiba advanced RF SOI) processes. The […]

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Peregrine Semi’s RF Chip On Bonded SOS Is Main Antenna Switch in Samsung Galaxy S4 LTE-A  – That’s SOI! Thumbnail

Peregrine Semi’s RF Chip On Bonded SOS Is Main Antenna Switch in Samsung Galaxy S4 LTE-A – That’s SOI!

Posted by on September 26, 2013
In Editor's Blog
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Peregrine has announced that the company’s new UltraCMOS antenna switch is driving RF performance in the Samsung Galaxy S4 LTE-A smartphone. UltraCMOS technology is an advanced RF SOI process leveraging bonded silicon-on-sapphire (BSOS) substrates from Soitec. The new dual SP7T Multiswitch in the Samsung leverages Peregrine’s latest version of its UltraCMOS® process technology, STeP8 for RF […]

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